Patents by Inventor Seung Kyun Ryu

Seung Kyun Ryu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220056588
    Abstract: This application relates to a metal coating method for plastic outer part requiring robustness. In the metal coating method, first, provide a plastic outer part as a motion assistance tool. Thereafter, a cold plasma treatment is performed to introduce a polar functional group to a surface of the plastic outer part by treating the plastic outer part with cold plasma. Next, a metal coating layer is formed on the surface of the plastic outer part treated with the cold plasma by an electroless plating method. Thereafter, an adhesive strength improvement process of improving an adhesive strength between the metal coating layer and the plastic outer part to 1,000 g/cm2 or more by heat treatment of the plastic outer part with the metal coating layer thereon is performed.
    Type: Application
    Filed: January 8, 2019
    Publication date: February 24, 2022
    Inventors: Seung Kyun RYU, Sook Eun BAEK
  • Publication number: 20210262094
    Abstract: A coating method for preventing outgassing from an aerospace component made of a resin is proposed. In the coating method for preventing outgassing from the aerospace component, first, a polymer including a resin is provided. After that, primary outgassing in which the polymer is subjected to hot air drying to evaporate gas therefrom is performed. Next, the surface of the polymer after the primary outgassing is subjected to a cold plasma treatment to introduce hydrophilic functional groups so that it is possible to perform plating on the surface of the polymer. After that, the surface of the polymer after the cold plasma treatment is subjected to a catalytic treatment and an activation treatment for post-processes. Next, a first functional metal layer is formed on the surface of the polymer by means of electroless plating to suppress the release of gas through outgassing.
    Type: Application
    Filed: January 8, 2019
    Publication date: August 26, 2021
    Inventors: Seung Kyun RYU, Sook Eun BAEK
  • Publication number: 20210266026
    Abstract: Proposed is a mobile device case that accommodates or covers a substrate and an electronic element located on the substrate. The case includes: a case frame made of a high molecular material including a resin and having a cover part for accommodating or covering the substrate and protrusions protruding from the cover part in such a manner as to be extended close to the electronic element; and a metal coating layer formed by coating a metal on a surface of the case frame including the protrusions to improve electromagnetic shielding ability.
    Type: Application
    Filed: January 8, 2019
    Publication date: August 26, 2021
    Inventors: Seung Kyun RYU, Sook Eun Baek
  • Publication number: 20180171497
    Abstract: Disclosed herein is a structure for strengthening strength and a method of manufacturing the same, and more particularly to a structure for strengthening strength in which a coating layer made of material containing tungsten is formed on the surface of a base of a base metal or a bass of a metal base. According to the present invention, it is possible to substitute synthetic resins and metal products which are currently manufactured and used, exhibit excellent physical properties and mechanical properties as compared with those of synthetic resins and metal products. And also if necessary, the surface of the metal plating of the structure according to the present invention may be plated with various precious metals such as gold and silver to meet the demand of the customer.
    Type: Application
    Filed: June 2, 2016
    Publication date: June 21, 2018
    Inventors: Seung Kyun RYU, Sook Eun BAEK
  • Publication number: 20070059449
    Abstract: The present invention relates to a method for plating the surface of polymer materials with a metal film by treating the surface of polymer materials with cold plasma method to introduce hydrophilic functional groups and then plating the surface of polymer materials with a metal film according to the electroless plating method. The cold plasma treatment reduces the contact angle of the surface of polymer materials to water by 5 to 60°. The surface of polymer materials can be more efficiently plated with the metal film by the additional step of either immersing the polymer material into an organic solvent for 0.1 to 5 minutes or washing the polymer material with ultrasonic washing machine after introducing the hydrophilic functional groups by treatment with cold plasma.
    Type: Application
    Filed: July 24, 2006
    Publication date: March 15, 2007
    Applicant: Seung-Kyun Ryu
    Inventors: Seung-Kyun Ryu, Kon Su
  • Publication number: 20030165633
    Abstract: The present invention relates to a method for plating the surface of polymer materials with a metal film by treating the surface of polymer materials with cold plasma method to introduce hydrophilic functional groups and then plating the surface of polymer materials with a metal film according to the electroless plating method. Wherein said method is characterized in that the cold plasma treatment reduces the contact angle of the surface of polymer materials to water by 5 to 60°. Further, in said method the surface of polymer materials can be more efficiently plated with the metal film by additionally practicing the step either of immersing the polymer material into an organic solvent for 0.1 to 5 minutes or of washing the polymer material with ultrasonic washing machine, after introducing the hydrophilic functional groups by treatment of cold plasma.
    Type: Application
    Filed: March 5, 2003
    Publication date: September 4, 2003
    Inventors: Seung-Kyun Ryu, Kon Su
  • Publication number: 20030064165
    Abstract: The process for preparing copper-film-plated steel cord (hereafter abbreviated as copper-plated cord) of 20-90 nm of copper film for vehicle tire, by plating zinc or tin with strong tendency of ionization on the surface of steel cord and after drawing the zinc or tin-plated cord, and then plating copper film onto it contacting with cupric sulfate solution of 10 to 50 gram per litter.
    Type: Application
    Filed: June 12, 2002
    Publication date: April 3, 2003
    Applicant: DIGITAL PLATING CO., LTD.
    Inventors: Gon Seo, Pyong Lee Cho, Gyung Soo Jeon, Seung Kyun Ryu
  • Patent number: 6410098
    Abstract: A process is disclosed for preparing copper-film-plated steel cord suitable for use in vehicle tires comprising plating zinc or tin on the surface of steel cord, drawing the zinc or tin-plated cord, and then plating copper film onto the zinc or tin plated steel cord by contact with a solution of cupric sulfate solution, cupric nitrate, cupric chloride or cupric acetate. Compared with the presently used brass-plated steel cord, manufacturing tires with copper-plated cord according to the present invention reduces manufacturing time due to faster formation of adhesion interphase, increases the storage period by enhancing moisture stability, and retards adhesion degradation thereby extending the service life of the tires.
    Type: Grant
    Filed: July 5, 2000
    Date of Patent: June 25, 2002
    Assignee: Digital Plating Co., Ltd.
    Inventors: Gon Seo, Pyong Lee Cho, Gyung Soo Jeon, Seung Kyun Ryu