Patents by Inventor Seung Lak Kim

Seung Lak Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multilayered printed circuit board, method for manufacturing the same, and semiconductor device using the same
    Patent number: 11848263
    Abstract: The present invention relates to a multilayered printed circuit board having excellent durability while having a thin thickness, a method for manufacturing the same, and a semiconductor device using the same.
    Type: Grant
    Filed: September 20, 2019
    Date of Patent: December 19, 2023
    Assignee: LG CHEM, LTD.
    Inventor: Seung Lak Kim
  • MULTILAYERED PRINTED CIRCUIT BOARD, METHOD FOR MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE USING THE SAME
    Publication number: 20200395289
    Abstract: [Summary] The present invention relates to a multilayered printed circuit board having excellent durability while having a thin thickness, a method for manufacturing the same, and a semiconductor device using the same.
    Type: Application
    Filed: September 20, 2019
    Publication date: December 17, 2020
    Inventor: Seung Lak KIM
  • PRINTED CIRCUIT BOARD
    Publication number: 20140060896
    Abstract: Disclosed herein is a printed circuit board, including: an insulating layer; a circuit layer formed on one surface of the insulating layer; and a via electrode penetrating through the insulating layer and being connected with the circuit layer, wherein the circuit layer is formed in a structure where different kinds of metal layers having different thermal conductivities are laminated.
    Type: Application
    Filed: March 14, 2013
    Publication date: March 6, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Gil Yong SHIN, Seung Lak Kim, Kyoung Ro Yoon