Patents by Inventor Seung M. You

Seung M. You has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • HYDROPHILIC SURFACES AND PROCESS FOR PREPARING
    Publication number: 20120308775
    Abstract: Disclosed are processes for forming hydrophilic surfaces on aluminum and aluminum substrates having highly hydrophilic surfaces.
    Type: Application
    Filed: December 7, 2011
    Publication date: December 6, 2012
    Inventors: Seung M. You, Miguel A. Amaya
  • Method of attaching non-adhesive thermal interface materials
    Patent number: 7019977
    Abstract: Securing a heat sink to an electronic device, such as an integrated circuit package, includes applying an adhesive layer to only a periphery of a surface on a thermal interface material. The thermal interface material is applied to the heat sink and/or integrated circuit package using the adhesive layer. The heat sink is in thermal contact with the integrated circuit package to extract heat during operation.
    Type: Grant
    Filed: December 17, 2003
    Date of Patent: March 28, 2006
    Assignee: Intel Corporation
    Inventors: Seri Lee, Seung M. You, Jae W. Chang