Patents by Inventor Seung-Min Hong

Seung-Min Hong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8679865
    Abstract: A resin application apparatus includes: an optical property measurement unit measuring an optical property of light emitted from a light emitting diode (LED) chip which is mounted on a package body and to which transparent resin is not applied; and a resin application unit applying light conversion material-containing transparent resin to the LED chip in accordance with a resin application amount which is decided depending on the optical property measured by the optical measurement unit.
    Type: Grant
    Filed: August 26, 2010
    Date of Patent: March 25, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sang Bok Yoon, Hae Yong Eom, Mi Hwa You, Seung Min Hong, Sang Hoon Lee, Yong Gu Kim
  • Publication number: 20130313340
    Abstract: A dispensing pump, and more particularly, a valve impact type dispensing pump that may be used in a process of manufacturing an electronic product and may dispense an accurate amount of a liquid, such as a liquid synthetic resin, at high speed. The present invention provides a valve impact type dispensing pump that can descend a valve rod at high speed and thus can dispense a liquid with high viscosity at high speed. The valve impact type dispensing pump can dispense an accurate amount of a liquid at high speed. Also, the valve impact type dispensing pump can dispense a liquid having high viscosity at high speed due to a fast descending speed of a valve rod.
    Type: Application
    Filed: December 21, 2012
    Publication date: November 28, 2013
    Applicant: PROTEC CO., LTD.
    Inventors: Seung Min Hong, IL Kang
  • Publication number: 20130315764
    Abstract: A dispensing pump, and more particularly, a valve accelerating type dispensing pump that may be used in a process of manufacturing an electronic product and may dispense an accurate amount of a liquid, such as a liquid synthetic resin, at high speed. The present invention provides a valve accelerating type dispensing pump that can descend a valve rod at high speed and thus can dispense a liquid with high viscosity at high speed. The valve accelerating type dispensing pump can dispense an accurate amount of a liquid at high speed. Also, the valve accelerating type dispensing pump can dispense a liquid having high viscosity at high speed due to a fast descending speed of a valve rod.
    Type: Application
    Filed: December 21, 2012
    Publication date: November 28, 2013
    Applicant: PROTEC CO., LTD.
    Inventors: Seung Min HONG, IL KANG
  • Publication number: 20120190136
    Abstract: An apparatus and method of manufacturing a light emitting diode (LED) device, and more particularly, an apparatus and method of manufacturing an LED device by dispensing a fluorescent solution prepared by mixing a fluorescent material with a liquid synthetic resin, onto an LED chip. An apparatus and method of manufacturing an LED device, whereby an appropriate amount of fluorescent solution simultaneously in consideration of several factors, such as characteristics of an LED chip and viscosity of the fluorescent solution may be dispensed onto the LED chip, is provided. An apparatus and method of manufacturing an LED device, whereby an appropriate amount of fluorescent solution may be calculated actively in consideration of viscosity of the fluorescent solution, a change in characteristics of an LED chip, or the like, and the appropriate amount of fluorescent solution may be dispensed onto the LED chip, is provided.
    Type: Application
    Filed: January 18, 2012
    Publication date: July 26, 2012
    Applicant: Protec Co., Ltd.
    Inventor: Seung Min Hong
  • Publication number: 20110214907
    Abstract: Disclosed is a PCB having multiple layers of heavy copper. A prepreg having a nonwoven glass web substrate is used alone or together with another prepreg having a glass fabric substrate so that the space between heavy copper, which is comparable to a thick film, can be filled efficiently without creating voids. The PCB includes a copper clad laminate having first copper patterned on one surface or both surfaces of a core substrate; at least one first prepreg laminated on one surface or both surfaces of the copper clad laminate, nonwoven glass web being used as the substrate of the first prepreg; at least one second prepreg laminated on one surface or both surfaces of the first prepreg, glass fabric being used as a substrate of the second prepreg; and second copper laminated on one surface or both surfaces of the second prepreg.
    Type: Application
    Filed: December 18, 2008
    Publication date: September 8, 2011
    Applicant: DOOSAN CORPORATION
    Inventors: Jeong Don Kwon, Seung Min Hong, Ju Ho Shin
  • Publication number: 20110053295
    Abstract: A resin application apparatus includes: an optical property measurement unit measuring an optical property of light emitted from a light emitting diode (LED) chip which is mounted on a package body and to which transparent resin is not applied; and a resin application unit applying light conversion material-containing transparent resin to the LED chip in accordance with a resin application amount which is decided depending on the optical property measured by the optical measurement unit.
    Type: Application
    Filed: August 26, 2010
    Publication date: March 3, 2011
    Inventors: Sang Bok YOON, Hae Yong Eom, Mi Hwa You, Seung Min Hong, Sang Hoon Lee, Yong Gu Kim
  • Patent number: 6331598
    Abstract: A process for preparing an emulsion polymer comprising placing a first mixture of monomers in a feed tank B which is connected directly to a reactor, placing a second mixture of monomers in a feed tank A which is connected to the feed tank B, and continuously varying the composition ratio of the monomers of feed tanks A and B in the emulsion polymer. The composition ratio is varied by varying the rate of feeding of the second mixture of monomers present in tank A into tank B while simultaneously varying the rate of feeding of the first mixture of monomers present in tank B into the reactor. The polymerization occurs as the first and second mixtures of monomers are simultaneously fluxed in the reactor while stirring.
    Type: Grant
    Filed: August 24, 1999
    Date of Patent: December 18, 2001
    Assignee: Korea Chemical Co., Ltd.
    Inventors: Jong-Myung Park, Chang-Ho Choi, Jung-Kwon Oh, Seung-Min Hong