Patents by Inventor Seung-min Lee

Seung-min Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240120262
    Abstract: An electronic device includes a substrate with a conductive structure and a substrate encapsulant. The conductive structure has a lead with a lead via and a lead protrusion. The lead via can include via lateral sides defined by first concave portions and the lead protrusion can include protrusion lateral sides defined by second concave portions. The substrate encapsulant covers the first concave portions at a first side of the substrate but not the second concave portions so that the lead protrusion protrudes from the substrate encapsulant at a second side of the substrate. An electronic component can be adjacent to the first side of the substrate and electrically coupled to the conductive structure. A body encapsulant encapsulates portions of the electronic component and the substrate. The lead can further include a lead trace at the second side of the substrate.
    Type: Application
    Filed: December 15, 2023
    Publication date: April 11, 2024
    Applicant: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Hyeong Il JEON, Gi Jeong KIM, Yong Ho SON, Byong Jin KIM, Jae Min BAE, Seung Woo LEE
  • Publication number: 20240120477
    Abstract: A positive electrode material for a lithium secondary battery has improved electron conductivity and surface stability because oxidation-treated carbon nanotubes are stably attached to the surface of an active material. According to one embodiment the positive electrode material includes a positive electrode active material core made of a Li—Ni—Co—Mn-M-O-based material (M=transition metal) and an oxidized carbon nanotube coating layer formed on the surface of the positive electrode active material core and including 1% to 3% by weight of oxidation-treated carbon nanotubes (OCNT) relative to 100% by weight of the positive electrode active material core.
    Type: Application
    Filed: July 7, 2023
    Publication date: April 11, 2024
    Inventors: Seung Min Oh, Sung Ho Ban, Sang Hun Lee, Chang Hoon Song, Yoon Sung Lee, Ko Eun Kim, Van Chuong Ho, Jun Young Mun
  • Publication number: 20240119904
    Abstract: A display device is provided. The display device may include a substrate, a plurality of pixels, a first data line, a second data line, a defect sensing line, a first input pad, and a static electricity discharge element. The substrate may include a display area and a peripheral area neighboring each other. The plurality of pixels may be positioned on the display area and may include a first pixel and a second pixel. The first data line may be electrically connected to the first pixel. The second data line may be electrically connected to the second pixel and may be electrically isolated from the first data line. The defect sensing line may be positioned on the peripheral area. The first input pad may be electrically connected to the defect sensing line. The static electricity discharge element may be electrically connected through the defect sensing line to the first input pad.
    Type: Application
    Filed: December 19, 2023
    Publication date: April 11, 2024
    Inventors: Kwang-Min KIM, Seung-Kyu LEE, Won Kyu KWAK
  • Publication number: 20240114620
    Abstract: A printed circuit board includes a first insulating layer, a plurality of first and second pads disposed on the first insulating layer, and a solder resist layer disposed on the first insulating layer, the solder resist layer having a plurality of first and second openings respectively exposing at least portions of the plurality of first and second pads. The first pad has a closed region having a side surface covered by the solder resist layer, and an open region having a side surface exposed by the first opening. The second pad has only a closed region having a side surface covered by the solder resist layer.
    Type: Application
    Filed: August 25, 2023
    Publication date: April 4, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seung Min LEE, Francis SAYNES, Keun Woo KWON
  • Publication number: 20240103362
    Abstract: Disclosed herein is a method of printing a nanostructure including: preparing a template substrate on which a pattern is formed; forming a replica pattern having an inverse phase of the pattern by coating a polymer thin film on an upper portion of the template substrate, adhering a thermal release tape to an upper portion of the polymer thin film, and separating the polymer thin film from the template substrate; forming a nanostructure by depositing a functional material on the replica pattern; and printing the nanostructure deposited on the replica pattern to a substrate by positioning the nanostructure on the substrate, applying heat and pressure to the nanostructure, and weakening an adhesive force between the thermal release tape and the replica pattern by the heat.
    Type: Application
    Filed: September 19, 2023
    Publication date: March 28, 2024
    Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Jong Min KIM, Seung Yong LEE, So Hye CHO, Ho Seong JANG, Jae Won CHOI, Chang Kyu HWANG
  • Publication number: 20240105542
    Abstract: The present invention relates to a power module and a method of manufacturing the same. A power module according to one embodiment of the present invention includes a power module including a substrate a sealing member disposed to cover the substrate, a heatsink bonded to one surface of the substrate, a stepped bonding portion protruding to be stepped from one surface of the heatsink toward the substrate, and a bonding member disposed between and sinter-bonded to the stepped bonding portion and the substrate.
    Type: Application
    Filed: September 27, 2023
    Publication date: March 28, 2024
    Applicant: HYUNDAI MOBIS CO., LTD.
    Inventors: Jae Min HWANG, Seung Pyo LEE, Jae Guk AN, Tae Heun KIM
  • Publication number: 20240105918
    Abstract: A positive electrode material for a lithium secondary battery and a manufacturing method therefor are provided. The positive electrode material may have carbon nanotubes stably attached to a surface of an active material and may exhibit increased electron conductivity and improved surface stability. The positive electrode material for a lithium secondary battery may comprises: a positive electrode active material core comprising a Li—Ni—Co—Mn-M-O-based material, where M is a transition metal; and a carbon nanotube coating layer on a surface of the positive electrode active material core. Carbon nanotubes (CNT) may be in an amount of 1-5 wt %, based on 100 wt % of the positive electrode active material core.
    Type: Application
    Filed: July 3, 2023
    Publication date: March 28, 2024
    Inventors: Seung Min Oh, Sung Ho Ban, Sang Hun Lee, Chang Hoon Song, Yoon Sung Lee, Ko Eun Kim, Van Chuong Ho, Jun Young Mun
  • Publication number: 20240106441
    Abstract: A phase locked loop circuit and a semiconductor device are provided. The phased locked loop circuit includes a reference current generator configured to generate a summed compensation current in which at least one of a process change, a temperature change or a power supply voltage change are compensated and output the summed compensation current as a reference current, a current digital-to-analog converter configured to convert the reference current into a control current in accordance with a digital code and a voltage control oscillator configured to generate a signal based on the control current, wherein the summed compensation current is based on weighted-averaging a first type compensation current and a second type compensation current in response to at least one of the process change, the temperature change or the power supply voltage change.
    Type: Application
    Filed: September 13, 2023
    Publication date: March 28, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Kyung Min LEE, Gyu Sik KIM, Seung Jin KIM, Jae Hong JUNG
  • Publication number: 20240106362
    Abstract: A motor driving apparatus includes a motor having a plurality of windings, a first inverter which is connected to a first end of each of the plurality of windings and drives the motor, a second inverter which is connected to a second end of each of the plurality of windings and selectively drives the motor according to a motor drive mode, and a controller which generates a current command for the motor according to a torque command and a voltage utilization rate control value, determines whether to perform linearization control for the current command based on a present counter magnetic flux of the motor and a switching reference counter magnetic flux for the motor drive mode, and adjusts the voltage utilization rate control value such that a value of the current command is linearized in a section in which the linearization control is performed.
    Type: Application
    Filed: April 14, 2023
    Publication date: March 28, 2024
    Applicants: Hyundai Motor Company, Kia Corporation
    Inventors: Ho Rim CHOI, Seong Min KIM, Seon Mi LEE, Tae Il YOO, Seung Hyeon BIN
  • Patent number: 11942264
    Abstract: A coil component includes a body having a first surface, and a first end surface and a second end surface connected to the first surface and opposing each other in a length direction; a support substrate disposed inside the body; a coil portion comprising a first coil pattern and first and second lead-out patterns, each disposed on a first surface of the support substrate; first and second slit portions, respectively defined on edge portions of the first surface of the body to expose the first and second lead-out patterns; and first and second external electrodes disposed on the first and second slit portions to be connected to the first and second lead-out patterns. At least one of the first and second lead-out patterns has a thickness greater than a thickness of each of the first coil pattern and the first dummy lead-out pattern.
    Type: Grant
    Filed: December 8, 2020
    Date of Patent: March 26, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: No Il Park, Byung Soo Kang, Seung Mo Lim, Byeong Cheol Moon, Boum Seock Kim, Yong Hui Li, Seung Min Lee
  • Patent number: 11941923
    Abstract: An automation method of an artificial intelligence (AI)-based diagnostic technology for equipment application includes receiving one or more pieces of data among vibration data, noise data, and controller area network (CAN) data, a data input processing operation of trimming the input data, an operation of extracting features from the trimmed data, setting a setting value of a hyper-parameter with respect to the one or more pieces of data thereamong, and generating a total of N models to include both of machine learning (ML) and deep learning (DL) as N individual models and generating ensemble prediction model structures for the N individual models. As a parameter updating is being proceeded due to the hyper-parameter so as to minimize values of cost functions of the N individual models, a reward for model accuracy performance is optimized and the ensemble prediction model structures of the N individual models change.
    Type: Grant
    Filed: October 22, 2021
    Date of Patent: March 26, 2024
    Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION
    Inventors: In-Soo Jung, Seung-Hyun Lee, Jae-Min Jin, Dong-Chul Lee
  • Patent number: 11937641
    Abstract: A heater assembly for heating a cigarette accommodated in an aerosol generating device includes a heating element that extends in a longitudinal direction of the cigarette and includes a ferromagnetic substance for generating heat by an external magnetic field, and a temperature sensor that measures a temperature of the heating element. The heater assembly is disposed at an inner end portion of an accommodation space provided in the aerosol generating device to accommodate the cigarette.
    Type: Grant
    Filed: November 7, 2019
    Date of Patent: March 26, 2024
    Assignee: KT&G CORPORATION
    Inventors: Seung Won Lee, Sang Kyu Park, Jae Min Lee
  • Patent number: 11938827
    Abstract: The present disclosure relates to a system for controlling a motor of a vehicle for increasing control accuracy of the motor for driving the vehicle, and an object of the present disclosure is to provide a system for controlling a motor of a vehicle, which may accurately perform a motor control even when a battery voltage (i.e., motor voltage) applied to the motor upon the driving control of the motor is changed.
    Type: Grant
    Filed: July 13, 2022
    Date of Patent: March 26, 2024
    Assignees: Hyundai Motor Company, Kia Corporation
    Inventors: Ho Sun Jang, Han Hee Park, Seong Min Kim, Ho Rim Choi, Seon Mi Lee, Tae Il Yoo, Seung Hyeon Bin
  • Patent number: 11942574
    Abstract: A display device includes a first electrode disposed on a substrate, a first insulating film disposed on the first electrode and having a first opening formed, a second insulating film disposed on the first insulating film and having a second opening, and a contact electrode electrically contacting at least a portion of the first electrode through the first opening and the second opening, wherein a side surface of the first insulating film defines the first opening, and the second insulating film overlaps the side surface of the first insulating film such that the contact electrode and the first insulating film are not in contact with each other.
    Type: Grant
    Filed: August 31, 2021
    Date of Patent: March 26, 2024
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Seung Jin Chu, Je Min Lee, Hyun Kim, Myeong Hun Song, Jong Chan Lee, Woong Hee Jeong
  • Publication number: 20240091759
    Abstract: Disclosed herein is a method of depositing a transition metal single-atom catalyst including preparing a carbon carrier, and depositing a transition metal single-atom catalyst on the carbon carrier, in which the carbon carrier is surface-treated by an oxidation process, and wherein the deposition is carried out by an arc plasma process.
    Type: Application
    Filed: September 15, 2023
    Publication date: March 21, 2024
    Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Jong Min KIM, Sang Hoon KIM, Chang Kyu HWANG, Seung Yong LEE, So Hye CHO, Jae Won CHOI
  • Publication number: 20240097088
    Abstract: A backplane substrate, a display device, and a tiled display device are provided. The backplane substrate of a display device includes subpixels. The backplane substrate includes a support substrate, a circuit layer on a first surface of the support substrate and including pixel drivers corresponding to the subpixels, respectively, an electrode layer on the circuit layer and including an anode and a cathode corresponding to an emission area of each of the subpixels, a bank layer on the circuit layer and corresponding to an area around the emission area of each of the subpixels, and a valley spaced from edges of the support substrate and penetrating at least the bank layer.
    Type: Application
    Filed: August 30, 2023
    Publication date: March 21, 2024
    Inventors: Jin Ho HYUN, Seung Wook KWON, Hee Chang YOON, Hye Min LEE
  • Publication number: 20240098880
    Abstract: The present disclosure relates to an electronic device, and more specifically, to an electronic device including a printed circuit board including a heat-generating element arranged on one surface thereof, and a heat transfer coin provided such that one surface of the heat transfer coin comes into contact with a portion of the other surface of the printed circuit board, opposite to the heat-generating element, so as to dissipate heat generated from the heat-generating element. Accordingly, the present disclosure provides an advantage of improving heat dissipation performance without increasing the thickness of the printed circuit board.
    Type: Application
    Filed: December 1, 2023
    Publication date: March 21, 2024
    Applicant: KMW INC.
    Inventors: Bae Mook JEONG, Kyo Sung JI, Seong Min AHN, Chi Back RYU, Jae Eun KIM, Seung Min LEE, Ki Hun PARK, Won Jun PARK, Jun Woo YANG
  • Publication number: 20240098885
    Abstract: A communication apparatus is provided to include an apparatus enclosure that includes a substrate seating surface and at least one or more connection grooves formed on the substrate seating surface, a first printed circuit board disposed on the substrate seating surface, a second printed circuit board disposed on the substrate seating surface on one side of the first printed circuit board, and at least one or more connectors disposed within the connection groove and configured to electrically connect the first printed circuit board and the second printed circuit board.
    Type: Application
    Filed: December 1, 2023
    Publication date: March 21, 2024
    Applicant: KMW INC.
    Inventors: Bae Mook JEONG, Kyo Sung JI, Seong Min AHN, Chi Back RYU, Jae Eun KIM, Seung Min LEE, Ki Hun PARK, Won Jun PARK, Duk Yong KIM
  • Patent number: 11935472
    Abstract: The present disclosure relates to a pixel sensing circuit which extends an operation section of an integrator by using an additional signal and allows securing a time required for a stable output of a sensing voltage.
    Type: Grant
    Filed: September 28, 2020
    Date of Patent: March 19, 2024
    Assignee: LX SEMICON CO., LTD.
    Inventors: Seung Hwan Ji, Sang Min Lee, Gi Baek Choi, Jung Bae Yun
  • Publication number: 20240086603
    Abstract: A method of reinforcement learning of a neural network device for generating a verification vector for verifying a circuit design comprising a circuit block includes inputting a test vector to the circuit block, generating one or more rewards based on a coverage corresponding to the test vector, the coverage being determined based on a state transition of the circuit block based on the test vector, and applying the one or more rewards to a reinforcement learning.
    Type: Application
    Filed: November 16, 2023
    Publication date: March 14, 2024
    Applicant: SAMSUNG ELECTRONICS CO, LTD.
    Inventors: In HUH, Jeong-hoon KO, Hyo-jin CHOI, Seung-ju KIM, Chang-wook JEONG, Joon-wan CHAI, Kwang-II PARK, Youn-sik PARK, Hyun-sun PARK, Young-min OH, Jun-haeng LEE, Tae-ho LEE