Patents by Inventor Seung-min SON

Seung-min SON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240163234
    Abstract: Provided is a method of operating a terminal. The method includes determining a profile item applicable to the profile view for the account based on an input received by the terminal and a coordinate indicating a position where the profile item is provided on the profile view. The method includes displaying the profile item on a screen of the terminal based on the determined profile item and the determined coordinate. The method includes receiving an input related to the profile item, and displaying a visual effect corresponding to the input on the screen.
    Type: Application
    Filed: November 8, 2023
    Publication date: May 16, 2024
    Inventors: Sul Gi KIM, Ji Hwi PARK, Yun Jin KIM, Nam Hee KO, Hye Seon KIM, Bo Young JANG, Seung Yong JI, Jae Ick HWANG, Sun Je BANG, Ji On CHU, Hye Mi LEE, Shin Young LEE, Seung Uk JEONG, Eun Ho SON, Sang Min SEO, Jeong Ryeol CHOI
  • Publication number: 20240120262
    Abstract: An electronic device includes a substrate with a conductive structure and a substrate encapsulant. The conductive structure has a lead with a lead via and a lead protrusion. The lead via can include via lateral sides defined by first concave portions and the lead protrusion can include protrusion lateral sides defined by second concave portions. The substrate encapsulant covers the first concave portions at a first side of the substrate but not the second concave portions so that the lead protrusion protrudes from the substrate encapsulant at a second side of the substrate. An electronic component can be adjacent to the first side of the substrate and electrically coupled to the conductive structure. A body encapsulant encapsulates portions of the electronic component and the substrate. The lead can further include a lead trace at the second side of the substrate.
    Type: Application
    Filed: December 15, 2023
    Publication date: April 11, 2024
    Applicant: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Hyeong Il JEON, Gi Jeong KIM, Yong Ho SON, Byong Jin KIM, Jae Min BAE, Seung Woo LEE
  • Publication number: 20160027796
    Abstract: According to example embodiments, a semiconductor device includes a substrate, a plurality of word lines spaced apart from each other in a first direction on the substrate, a channel layer in a channel hole defined by the plurality of word lines, a gate insulating layer in the channel hole along an inner wall of the channel hole; and a self-aligned contact on an upper portion of the channel layer in the channel hole. The gate insulating layer is between the plurality of word lines and the channel layer. The first direction is perpendicular to an upper surface of the substrate. The channel hole exposes the upper surface of the substrate.
    Type: Application
    Filed: March 12, 2015
    Publication date: January 28, 2016
    Inventors: Hyung-mo YANG, Sang-in KIM, Hae-na KIM, Seung-min SON, Hee-sung YANG, Sang-min HAN