Abstract: A vehicle frame assembly includes a front cross member provided at the front of a cabin and extending in a widthwise direction of a vehicle, a front side member having one end connected to the front cross member and having another end extending rearwards of the front cross member, a fender member having one end connected to the front cross member and having another end extending outwardly upwards of the vehicle, and a connection joint connected to an end portion of the front cross member, having formed therein an inner space, and allowing the front cross member, the front side member, and the fender member to be interconnected in the inner space.

Abstract: A body for a vehicle is proposed. The body includes an A pillar upper member supporting a front glass of the vehicle, an A pillar lower member disposed under the A pillar upper member and extending in a vertical direction of the vehicle, a cowl cross member extending in a width direction of the vehicle, and a joint provided on a front side of a vehicle cockpit, provided between a lower end of the A pillar upper member, an upper end of the A pillar lower member, and an end of the cowl cross member, and connected to each of the lower end of the A pillar upper member, the upper end of the A pillar lower member, and the end of the cowl cross member to form a load path.

Abstract: Disclosed herein is a burn-in system with a plurality of plugs on test boards, including: a main body (100) which has a test chamber (200) with an open front side; a plurality of test boards (40) on which a plurality of semiconductor chips (90) are mounted and which is mounted in the test chamber (200); a main board which tests the semiconductor chips by exchanging signals with the plurality of semiconductor chips; a door (540) which is provided on the main body (100) to open and close the test chamber (200); and a temperature control means provided inside the main body (100) to heat and cool the test boards (40) mounted inside the test chamber (200).

Abstract: A socket for testing a semiconductor to electrically connect electrodes of a test device and contact balls of a semiconductor device with each other, including: contactors each of which has an upper end portion protruding to one side from a vertical line and a lower end portion protruding to the other side in such a way as to have elasticity by a structure that the upper end portion and the lower end portion are symmetric with each other; insulation parts each of which is made of an insulating elastic material and is formed integrally with the contactor to absorb the force generated when coming in contact with the contactor; and guide films each of which is made with an insulating elastic body and is formed on an upper layer of the insulation part in order to align the contact balls of the semiconductor device and the contactors.