Patents by Inventor Seung Ryeol Lee

Seung Ryeol Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150364658
    Abstract: A method of manufacturing a glass-phosphor composite is disclosed. The method comprises: preparing rare earth ion-containing parent glass; mixing the rare-earth ion-containing parent glass in a power state with a phosphor in a powder state; and providing a glass-phosphor composite using the powder mixture of the rare earth ion-containing parent glass and the phosphor, wherein the mixing includes mixing the rare earth ion-containing parent glass in the powder state with the phosphor in the powder state so that the phosphor in the glass-phosphor composite is in an amount of 5 wt % to 30 wt %, and the preparing includes using a glass frit having a glass transition point of 300° C. to 800° C. and a sintering temperature of 200° C. to 600° C.
    Type: Application
    Filed: August 26, 2015
    Publication date: December 17, 2015
    Inventors: Jong Heo, Byoung Jin So, Seung Ryeol Lee
  • Patent number: 9005456
    Abstract: Disclosed herein is a method for manufacturing a printed circuit board, wherein a protective film for stripping and a metal layer closely adhered to the protective film for stripping are formed on an inner layer pad to protect the inner layer pad at the time of laser processing related to cavity processing and applying an etchant, thereby making it possible to improve reliability of a product.
    Type: Grant
    Filed: November 1, 2013
    Date of Patent: April 14, 2015
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Kwang Sun You, Seung Ryeol Lee, Sang Hoon Park, Kyung Jin Heo, Jae Ho Shin, Joong Hyuk Jung
  • Publication number: 20140124474
    Abstract: Disclosed herein is a method for manufacturing a printed circuit board, wherein a protective film for stripping and a metal layer closely adhered to the protective film for stripping are formed on an inner layer pad to protect the inner layer pad at the time of laser processing related to cavity processing and applying an etchant, thereby making it possible to improve reliability of a product.
    Type: Application
    Filed: November 1, 2013
    Publication date: May 8, 2014
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Kwang Sun You, Seung Ryeol Lee, Sang Hoon Park, Kyung Jin Heo, Jae Ho Shin, Joong Hyuk Jung