Abstract: There are provided a fingerprint detection sensor and a method of manufacturing the same. The fingerprint detection sensor includes a plurality of piezoelectric sensors arranged in an array on a two-dimensional plane and having a predetermined height; a filler provided to surround the plurality of piezoelectric sensors and isolating vibrations between the plurality of piezoelectric sensors; and a control unit discharging predetermined output signals through the piezoelectric sensors to detect information of an object in contact with, or close to, the plurality of piezoelectric sensors, wherein the plurality of piezoelectric sensors include first surfaces and second surfaces disposed on both ends thereof in a height direction and areas of the first surfaces and the second surfaces are different from each other.

Abstract: There are a fingerprint sensor and a method of operating the same. The fingerprint sensor includes: a fingerprint sensing unit sensing a fingerprint coming into contact with one surface of a substrate; a light source provided at a first end of the substrate; and a light detection unit provided at a second end of the substrate and detecting light emitted from the light source, wherein the first and second ends correspond to both ends of the one surface of the substrate with which the fingerprint comes into contact, respectively, and bio-information of an object coming into contact with the one surface of the substrate is determined by using light detected by the light detection unit.

Abstract: There are provided a fixed focus transducer array and an ultrasonic wave transceiving apparatus using the same. The fixed focus transducer array includes: a plurality of transducers, transducing electrical signals into ultrasonic signals to thereby focus the ultrasonic signals on a single focal point and transducing reflected ultrasonic signals from the single focal point into electrical signals to thereby output the electrical signals, wherein the plurality of transducers are disposed to be symmetrical to each other based on one transducer and simultaneously focus the ultrasonic signals on the single focal point at speeds according to the respective natural frequencies thereof. Therefore, a circuit area is reduced, whereby miniaturization may be implemented and a processing speed may be increased.

Abstract: There is provided a camera module including: a first diaphragm opened and closed according to a first electrical signal and including a first light quantity adjustment hole having a first size when being closed; a second diaphragm opened and closed according to a second electrical signal and including a second light quantity adjustment hole having a second size different from the first size when being closed; and a control unit electrically connected to the first and second diaphragms and controlling the first and second electrical signals transmitted to the first and second diaphragms, respectively.

Abstract: An apparatus for inspecting defects in a circuit pattern is described. The apparatus includes at least one laser unit for radiating a laser beam onto a first end of a circuit pattern formed on a substrate. The apparatus also includes a capacitor sensor disposed opposite a second end of the circuit pattern, which is connected to the first end of the circuit pattern through a via hole, in a non-contact manner. The apparatus also includes a voltage source connected to the capacitor sensor and configured to apply a voltage. The apparatus also includes a measurement unit connected to the capacitor sensor and configured to detect variation in impedance generated in the capacitor sensor.

Abstract: Disclosed is a wafer level package having a cylindrical capacitor, which is capable of increasing electrostatic capacity thanks to the use of a cylindrical capacitor structure and which includes a wafer chip having a bonding pad formed thereon and an insulating layer formed thereon and exposing the bonding pad, a redistribution layer connected to the bonding pad and extending to one side of the insulating layer, a cylindrical outer electrode connected to the redistribution layer and having a center opening therein, a cylindrical inner electrode formed in the center opening of the outer electrode so as to be separated from the outer electrode, a dielectric layer formed between the outer electrode and the inner electrode, and a resin sealing portion formed on the insulating layer to cover the redistribution layer, the inner electrode, the outer electrode and the dielectric layer and having a first recess for exposing an upper surface of the inner electrode.

Abstract: Disclosed herein are an apparatus and a method for spin coating, and a method for manufacturing a substrate having a structure. The spin-coating apparatus includes a support to support a substrate having a structure, a motor to rotate the support to perform spin-coating with respect to the structure, and a heat source to heat a coating material which is subjected to the spin-coating to perform pre-baking. The method for spin-coating a substrate having a structure includes preparing the substrate having the structure of a predetermined height formed on an upper portion thereof, coating the structure of the substrate with photoresist, and performing spin-coating of the photoresist in a place in which a heat source is provided, while performing pre-baking of the photoresist.

Abstract: A method for manufacturing a wafer level package including: forming a redistribution line connected to a top surface of a die pad on a wafer with the die pad; additionally preparing a carrier film including a metal post with a concave central portion on one surface; bonding the metal post to a top surface of the redistribution line; molding a space between the metal posts with a molding resin; and removing the carrier film.

Abstract: Disclosed herein is a method of inspecting defects in a circuit pattern of a substrate. At least one laser beam radiation unit for radiating a laser beam onto an inspection target circuit pattern of a substrate in a non-contact manner is prepared. A probe beam radiation unit for radiating a probe beam onto a connection circuit pattern to be electrically connected to the inspection target circuit pattern in a non-contact manner is prepared. The laser beam is radiated onto the inspection target circuit pattern using the laser beam radiation unit. The probe beam is radiated onto the connection circuit pattern using the probe beam radiation unit, thus measuring information about whether the probe beam is diffracted, and a diffraction angle. Accordingly, the method can solve problems such as erroneous measurements caused by contact pressure and can reduce the time required for measurements.

Abstract: A method for manufacturing a wafer level package including: forming a redistribution line connected to a top surface of a die pad on a wafer with the die pad; additionally preparing a carrier film including a metal post with a concave central portion on one surface; bonding the metal post to a top surface of the redistribution line; molding a space between the metal posts with a molding resin; and removing the carrier film.

Abstract: The present invention provides an optical image stabilizer including: a substrate; a table which faces the substrate and has an image sensor mounted on its upper surface to be horizontally actuated on the substrate; supporting members for supporting the table on the substrate; and a scratch drive actuator for actuating the table, and a method for manufacturing thereof.

Abstract: Disclosed herein is an optical image stabilizer, including: a substrate; a table disposed over the substrate, while levitating, to be movable on the substrate and having an image sensor mounted on the upper end of the substrate; cantilever arms disposed over the substrate, while levitating, and connected to the table to move the table; anchors fixing one ends of the cantilever arms onto the substrate; and electrodes applying voltage for moving the cantilever arm.

Abstract: The present invention provides an energy converting device, which includes: a base substrate; and a plurality of thermoelectric element structures which are sequentially stacked on the base substrate and electrically interconnected in parallel to one another.

Abstract: A method of manufacturing a wafer level package can include: forming an indentation, by etching one side of a semiconductor chip, on one side of which a chip pad is formed; forming a rewiring pattern, which is electrically connected with the chip pad and which includes a post pad having a corrugated shape in correspondence with the indentation, by selectively adding a conductive material on one side of the semiconductor chip; forming a sacrificial layer on one side of the semiconductor chip such that a window is formed in the sacrificial layer that completely or partially uncovers the post pad; forming a conductive post on the post pad, by filling the window with a conductive material; and removing the sacrificial layer. This method can be used to produce a wafer level package having a post structure that provides greater strength against lateral shear stresses.

Abstract: Disclosed herein is a wafer level packaging image sensor module, including a wafer including an image sensor, a circuit portion and a lower electrode on one side thereof, a lens actuator disposed on the lower electrode and made of electroactive polymer, an upper electrode disposed on the lens actuator, and a lens unit disposed on the upper electrode to allow light to be transmitted to the image sensor therethrough. The wafer level packaging image sensor module includes the lens actuator made of electroactive polymer, and thus it enables realization of the autofocusing of the wafer level packaging image sensor module.

Abstract: Disclosed herein is an apparatus and method for inspecting defects in a circuit pattern. In the inspection apparatus and method, a laser beam is radiated by a laser unit onto a first end of a circuit pattern, and variation in impedance of a capacitor sensor disposed at a second end of the circuit pattern is measured, thus measuring the open/short circuits of the circuit pattern. Accordingly, the inspection apparatus and method are advantageous in that defects in the circuit pattern can be measured in a non-contact manner, so that the consumption of pin probes can be reduced, and the reliability of the measurement of defects in the circuit pattern can be improved.

Abstract: Disclosed herein is a method of inspecting defects in a circuit pattern of a substrate. At least one laser beam radiation unit for radiating a laser beam onto an inspection target circuit pattern of a substrate in a non-contact manner is prepared. A probe beam radiation unit for radiating a probe beam onto a connection circuit pattern to be electrically connected to the inspection target circuit pattern in a non-contact manner is prepared. The laser beam is radiated onto the inspection target circuit pattern using the laser beam radiation unit. The probe beam is radiated onto the connection circuit pattern using the probe beam radiation unit, thus measuring information about whether the probe beam is diffracted, and a diffraction angle. Accordingly, the method can solve problems such as erroneous measurements caused by contact pressure and can reduce the time required for measurements.

Abstract: Disclosed herein is an apparatus and method for inspecting defects in the circuit pattern of a substrate. The apparatus for inspecting defects in a circuit pattern of a substrate includes a pin probe configured to input a voltage while coming into contact with an inspection target circuit pattern of a substrate. A capacitor sensor is provided with a membrane electrode which is opposite a connection circuit pattern to be electrically connected to the inspection target circuit pattern in a non-contact manner, and is configured to detect both capacitance and capacitance variation, generated due to displacement of the membrane electrode attributable to electrostatic attractive force acting from the connection circuit pattern on the membrane electrode. A capacitance measurement unit is connected to the capacitor sensor and is configured to measure capacitance attributable to the displacement of the membrane electrode, which is input from the capacitor sensor.

Abstract: Disclosed herein is an apparatus and method for inspecting a circuit of a substrate. The apparatus includes a pin probe coming into contact with a first end of an electrode formed on a first side of a substrate, a voltage source for applying a voltage to the pin probe, a film disposed at a second end of the electrode formed on a second side of the substrate, a dielectric fluid sealed in the film, and an electronic ink dispersed in the dielectric fluid, and charged with electricity to flow when the electrode is electrified. The present invention is advantageous in that whether an electrode has been electrified is measured using charged electronic ink, so that the use of a pin probe is limited to one side of a substrate, thus reducing cost required for the entire inspection.

Abstract: Disclosed is a wafer level package having a cylindrical capacitor, which is capable of increasing electrostatic capacity thanks to the use of a cylindrical capacitor structure and which includes a wafer chip having a bonding pad formed thereon and an insulating layer formed thereon and exposing the bonding pad, a redistribution layer connected to the bonding pad and extending to one side of the insulating layer, a cylindrical outer electrode connected to the redistribution layer and having a center opening therein, a cylindrical inner electrode formed in the center opening of the outer electrode so as to be separated from the outer electrode, a dielectric layer formed between the outer electrode and the inner electrode, and a resin sealing portion formed on the insulating layer to cover the redistribution layer, the inner electrode, the outer electrode and the dielectric layer and having a first recess for exposing an upper surface of the inner electrode.