Patents by Inventor Seung-Woo Lee
Seung-Woo Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11976934Abstract: Route guidance using less client device power and bandwidth is enabled by automatically selecting portions of a map to display with higher and lower levels of detail. An origin location and destination location are displayed at a higher level of detail, while portions between origin and destination are displayed at a lower level of detail. A user of a transportation service may request a ride, specifying her pickup location and destination locations using a map rendered at a higher level of detail. While waiting for pickup, and while in route to the destination location, the user may consult a map that is rendered at a lower level of detail. When multiple users participate as riders in a transportation service, sharing a common driver but each having different pickup and drop off locations, portions of a map may be rendered differently for each user.Type: GrantFiled: June 7, 2022Date of Patent: May 7, 2024Assignee: Uber Technologies, Inc.Inventors: Seung Woo Lee, Christopher Moore
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Publication number: 20240141103Abstract: The present disclosure relates to a method for preparing a polyalkylene carbonate resin, and more particularly, to a method for preparing a polyalkylene carbonate resin having the reduced cyclic carbonate content, which is a by-product, and an increased ratio of a repeating unit including carbon dioxide, by increasing catalyst activity.Type: ApplicationFiled: September 26, 2022Publication date: May 2, 2024Inventors: Seung Hee LEE, Sang Kook KIM, Sang Woo KIM, Bo Ra SHIN, No Jin PARK
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Publication number: 20240145268Abstract: A molding apparatus for fabricating a semiconductor package includes an upper mold including an upper cavity, a first side cavity at a first side of the upper cavity, a second side cavity formed at an opposite second side of the upper cavity, and a first driving part connected to the first side cavity and configured to move the first side cavity in a first direction, and a bottom mold including a bottom cavity configured to receive a molding target including a package substrate and at least one semiconductor chip. A width in the first direction between the first side cavity and the second side cavity may be smaller than a width of the package substrate in the first direction and greater than a width in the first direction between a first boundary and a second boundary of the at least one semiconductor chip.Type: ApplicationFiled: September 15, 2023Publication date: May 2, 2024Inventors: Jun Woo Park, Gyu Hyeong Kim, Seung Hwan Kim, Jung Joo Kim, Jong Wan Kim, Yong Kwan Lee
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Patent number: 11974498Abstract: Disclosed are a compound for an organic light-emitting device, and an organic light-emitting diode comprising the same and exhibiting high efficiency. More particularly, the compound has a specific structure represented by Chemical Formula A or B and is used as a material for a hole injection layer or a hole transport layer in an organic light-emitting diode to confer high efficiency on the organic light-emitting diode. Chemical Formulas A and B are as defined in the description.Type: GrantFiled: December 22, 2020Date of Patent: April 30, 2024Assignee: SFC CO., LTD.Inventors: Seung-Soo Lee, Tae Gyun Lee, Sang-woo Park
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Publication number: 20240136175Abstract: The present invention relates to an auxiliary precursor, a thin film precursor composition, a method of forming a thin film using the thin film precursor composition, and a semiconductor substrate fabricated using the method. The present invention provides the thin film precursor composition including a thin film precursor compound and a compound having a predetermined structure that exhibits reaction stability as the auxiliary precursor. By using the thin film precursor composition in a thin film deposition process, side reactions may be suppressed, and thin film growth rate may be appropriately controlled. In addition, since process by-products are removed from a thin film, even when a thin film is formed on a substrate having a complicated structure, step coverage and the thickness uniformity and resistivity characteristics of the thin film may be greatly improved.Type: ApplicationFiled: February 22, 2022Publication date: April 25, 2024Inventors: Jae Sun JUNG, Chang Bong YEON, Seung Hyun LEE, Ji Hyun NAM, Sung Woo CHO
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Patent number: 11966768Abstract: Disclosed herein are an apparatus and method for a multi-cloud service platform. The apparatus includes one or more processors and executable memory for storing at least one program executed by the one or more processors. The at least one program may receive a service request from a user client device, generate a multi-cloud infrastructure service using multiple clouds in response to the service request, make the multiple clouds interoperate with mufti-cloud infrastructure in order to provide the multi-cloud infrastructure service, and generate a multi-cloud application runtime environment corresponding to the multi-cloud infrastructure service.Type: GrantFiled: February 3, 2021Date of Patent: April 23, 2024Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTEInventors: Seok-Ho Son, Dong-Jae Kang, Byoung-Seob Kim, Seung-Jo Bae, Ji-Hoon Seo, Byeong-Thaek Oh, Kure-Chel Lee, Young-Woo Jung
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Patent number: 11967381Abstract: A semiconductor memory device includes a memory cell array, a row decoder, a plurality of page buffers, and a voltage switching circuit. The memory cell array includes a plurality of memory cells. The row decoder is connected to the memory cell array through word lines. The plurality of page buffers are connected to the memory cell array through bit lines. The voltage switching circuit decodes an operation voltage and transmits the decoded operation voltage to the row decoder. The plurality of page buffers are formed in a first under cell region among first and second under cell regions, the first and second under cell regions being adjacent to each other in a first direction under the memory cell array. At least a portion of the voltage switching circuit is formed in an under slim region that is adjacent to the first under cell region and the second under cell region in a second direction.Type: GrantFiled: October 6, 2021Date of Patent: April 23, 2024Assignee: SK hynix Inc.Inventors: Seung Wan Chae, Young Ki Kim, Jong Il Lee, Eun Woo Jo
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Patent number: 11968627Abstract: An electronic device is provided. The electronic device includes a housing including a front surface and a rear surface, a display, a communication circuit, at least one processor, and a memory. The memory stores instructions which, when executed, cause the at least one processor to receive a signal from outside of the electronic device using the communication circuit, in response to receiving the signal, display a user interface on an elongated region that extends along at least one edge region of the display, and display at least one content corresponding to the signal, while displaying the user interface or after displaying the user interface.Type: GrantFiled: March 8, 2022Date of Patent: April 23, 2024Assignee: Samsung Electronics Co., Ltd.Inventors: Jong Moo Lee, Seung Min Choi, Gyu Chual Kim, Ji Woo Lee
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Patent number: 11961775Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.Type: GrantFiled: November 8, 2022Date of Patent: April 16, 2024Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Gyu Wan Han, Won Bae Bang, Ju Hyung Lee, Min Hwa Chang, Dong Joo Park, Jin Young Khim, Jae Yun Kim, Se Hwan Hong, Seung Jae Yu, Shaun Bowers, Gi Tae Lim, Byoung Woo Cho, Myung Jea Choi, Seul Bee Lee, Sang Goo Kang, Kyung Rok Park
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Publication number: 20240119948Abstract: Provided is an encoding apparatus for integrally encoding and decoding a speech signal and a audio signal, and may include: an input signal analyzer to analyze a characteristic of an input signal; a stereo encoder to down mix the input signal to a mono signal when the input signal is a stereo signal, and to extract stereo sound image information; a frequency band expander to expand a frequency band of the input signal; a sampling rate converter to convert a sampling rate; a speech signal encoder to encode the input signal using a speech encoding module when the input signal is a speech characteristics signal; a audio signal encoder to encode the input signal using a audio encoding module when the input signal is a audio characteristic signal; and a bitstream generator to generate a bitstream.Type: ApplicationFiled: June 21, 2023Publication date: April 11, 2024Applicants: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE, Kwangwoon University Industry-Academic Collaboration FoundationInventors: Tae Jin LEE, Seung-Kwon BAEK, Min Je KIM, Dae Young JANG, Jeongil SEO, Kyeongok KANG, Jin-Woo HONG, Hochong PARK, Young-Cheol PARK
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Publication number: 20240120262Abstract: An electronic device includes a substrate with a conductive structure and a substrate encapsulant. The conductive structure has a lead with a lead via and a lead protrusion. The lead via can include via lateral sides defined by first concave portions and the lead protrusion can include protrusion lateral sides defined by second concave portions. The substrate encapsulant covers the first concave portions at a first side of the substrate but not the second concave portions so that the lead protrusion protrudes from the substrate encapsulant at a second side of the substrate. An electronic component can be adjacent to the first side of the substrate and electrically coupled to the conductive structure. A body encapsulant encapsulates portions of the electronic component and the substrate. The lead can further include a lead trace at the second side of the substrate.Type: ApplicationFiled: December 15, 2023Publication date: April 11, 2024Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Hyeong Il JEON, Gi Jeong KIM, Yong Ho SON, Byong Jin KIM, Jae Min BAE, Seung Woo LEE
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Publication number: 20240120580Abstract: A sealing device for a pouch-type battery includes an upper sealing block and a lower sealing block. The upper sealing block has a two-stage upper sealing groove, including a first upper step and a second upper step, and the lower sealing block has a two-stage lower sealing groove, including a first lower step and a second lower step. The upper sealing block contacts a first surface of an electrode lead sealing part of the pouch-type battery, and the lower sealing block contacts a second surface of the electrode lead sealing part of the pouch-type battery in a process of performing sealing through heat fusion. A pouch-type battery having an electrode lead sealing part formed by the sealing device is also provided.Type: ApplicationFiled: November 17, 2022Publication date: April 11, 2024Applicant: LG Energy Solution, Ltd.Inventors: Seung Ho Na, Kwang Hee Choi, Dong Kyun Ha, Yoon Beom Lee, Do Woo Kim, Hye Ji Lee
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Publication number: 20240116036Abstract: Proposed are an unsupported metallic catalyst for a selective ring-opening (SRO) reaction and a method of using the same catalyst, wherein the catalyst contains nickel (Ni), molybdenum (Mo), and tungsten (W).Type: ApplicationFiled: July 14, 2023Publication date: April 11, 2024Inventors: Seung Woo LEE, Yeon Ho KIM, Yoon Kyung LEE, Hee Jung JEON
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Publication number: 20240119949Abstract: An encoding/decoding apparatus and method for controlling a channel signal is disclosed, wherein the encoding apparatus may include an encoder to encode an object signal, a channel signal, and rendering information for the channel signal, and a bit stream generator to generate, as a bit stream, the encoded object signal, the encoded channel signal, and the encoded rendering information for the channel signal.Type: ApplicationFiled: November 30, 2023Publication date: April 11, 2024Applicant: Electronics and Telecommunications Research InstituteInventors: Jeong Il SEO, Seung Kwon BEACK, Dae Young JANG, Kyeong Ok KANG, Tae Jin PARK, Yong Ju LEE, Keun Woo CHOI, Jin Woong KIM
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Patent number: 11955841Abstract: The present invention provides a stator and a motor assembly including the same. The stator includes: a stator core disposed outside a rotor core and having an inner surface inclined with respect to a rotation axis of a rotor; a plurality of coil-wound teeth extending from the inner surface of the stator core towards the rotation axis, wherein a coil is wound around each of the plurality of coil-wound teeth; and openings formed by sidewalls of the plurality of coil-wound teeth and the inner surface of the stator core, wherein a cross-sectional area of the openings changes along a direction of the rotation axis.Type: GrantFiled: September 18, 2019Date of Patent: April 9, 2024Assignee: DAEGU GYEONGBUK INSTITUTE OF SCIENCE AND TECHNOLOGYInventors: Sung Woo Chang, Seung Yeol Lee
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Patent number: 11951130Abstract: The present invention relates to an antigen-binding molecule comprising a heavy chain variable region comprising a heavy-chain complementarity-determining region 1 (HCDR1) comprising an amino acid sequence represented by Sequence No. 1, an HCDR2 comprising an amino acid sequence represented by Sequence No. 2, and an HCDR3 comprising an amino acid sequence represented by Sequence No. 3; a light-chain variable region comprising a light-chain complementarity-determining region 1 (LCDR1) comprising an amino acid sequence represented by Sequence No. 4, an LCDR2 comprising an amino acid sequence represented by Sequence No. 5, and an LCDR3 comprising an amino acid sequence represented by Sequence No. 6; wherein the antigen-binding molecule is a T cell receptor (TCR); and to a cell line expressing the same.Type: GrantFiled: March 1, 2021Date of Patent: April 9, 2024Assignee: Eutilex Co., Ltd.Inventors: Byoung S. Kwon, Young Ho Kim, Kwang Hee Kim, Ji Won Chung, Young Gyoon Chang, Bo Rim Yi, Jung Yun Lee, Seung Hyun Lee, Sun Woo Im, Jin Kyung Choi, Hyun Tae Son, Eun Hye Yoo
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Patent number: 11956980Abstract: Discussed is an organic light emitting device in which a light emitting layer includes a host and different kinds of dopants, the fluorescent dopant is formed of a material having energy level properties facilitating thermally activated delayed fluorescence (TADF), and thus energy is concentratedly transferred to the fluorescent dopant so as to increase luminous efficacy of a single color.Type: GrantFiled: December 24, 2020Date of Patent: April 9, 2024Assignee: LG DISPLAY CO., LTD.Inventors: Gyeong-Woo Kim, Hong-Seok Choi, Seung-Ryong Joung, Jun-Ho Lee, Yoon-Deok Han, Hee-Su Byeon
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Publication number: 20240114151Abstract: A method for decoding an image, according to the present invention, can comprise the steps of: drawing out a vector predictor of a block vector for indicating a reference block with respect to a current block to be predicted within a current picture; drawing out the block vector on the basis of the vector predictor and a vector differential value corresponding to a different value of the block vector and the vector predictor; and generating a prediction block with respect to the current block on the basis of the block vector.Type: ApplicationFiled: December 5, 2023Publication date: April 4, 2024Applicant: RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITYInventors: Byeung Woo JEON, Seung Ha YANG, Hiuk Jae SHIM, Da Hee LEE
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Publication number: 20240114620Abstract: A printed circuit board includes a first insulating layer, a plurality of first and second pads disposed on the first insulating layer, and a solder resist layer disposed on the first insulating layer, the solder resist layer having a plurality of first and second openings respectively exposing at least portions of the plurality of first and second pads. The first pad has a closed region having a side surface covered by the solder resist layer, and an open region having a side surface exposed by the first opening. The second pad has only a closed region having a side surface covered by the solder resist layer.Type: ApplicationFiled: August 25, 2023Publication date: April 4, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Seung Min LEE, Francis SAYNES, Keun Woo KWON
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Patent number: 11949881Abstract: The present invention discloses an encoding apparatus using a Discrete Cosine Transform (DCT) scanning, which includes a mode selection means for selecting an optimal mode for intra prediction; an intra prediction means for performing intra prediction onto video inputted based on the mode selected in the mode selection means; a DCT and quantization means for performing DCT and quantization onto residual coefficients of a block outputted from the intra prediction means; and an entropy encoding means for performing entropy encoding onto DCT coefficients acquired from the DCT and quantization by using a scanning mode decided based on pixel similarity of the residual coefficients.Type: GrantFiled: April 1, 2021Date of Patent: April 2, 2024Assignees: Electronics and Telecommunications Research Institute, Kwangwoon University Research Institute for Industry Cooperation, Industry-Academia Cooperation Group of Sejong UniversityInventors: Se-Yoon Jeong, Hae-Chul Choi, Jeong-Il Seo, Seung-Kwon Beack, In-Seon Jang, Jae-Gon Kim, Kyung-Ae Moon, Dae-Young Jang, Jin-Woo Hong, Jin-Woong Kim, Yung-Lyul Lee, Dong-Gyu Sim, Seoung-Jun Oh, Chang-Beom Ahn, Dae-Yeon Kim, Dong-Kyun Kim