Patents by Inventor Seung Yup Lee

Seung Yup Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9643209
    Abstract: There are provided a method of manufacturing a reverse osmosis membrane and a reverse osmosis membrane manufactured thereby. The method includes forming a polysulfone layer by applying a solution including a mixed solvent containing two or more solvents having different solubility parameter values to a surface of a porous support; and forming an active layer on the polysulfone layer.
    Type: Grant
    Filed: December 30, 2014
    Date of Patent: May 9, 2017
    Assignee: LG CHEM, LTD.
    Inventors: Seung-Pyo Jeong, Seung-Yup Lee, Phill Lee, Hye-Jin Kwon, Chong-Kyu Shin
  • Patent number: 9611358
    Abstract: The present invention relates to a laminate and a device fabricated using the laminate. The laminate includes a debonding layer including a polyimide resin having a similarity score not greater than 0.5, as calculated by Equation 1 defined in the detailed description, between a carrier substrate and a flexible substrate. According to the present invention, the flexible substrate can be easily separated from the carrier substrate without the need for further processing such as laser or light irradiation. Therefore, the use of the laminate facilitates the fabrication of the device having the flexible substrate. The device may be, for example, a flexible display device. In addition, the device can be prevented from deterioration of reliability and occurrence of defects caused by laser or light irradiation. This ensures improved characteristics and high reliability of the device.
    Type: Grant
    Filed: April 8, 2014
    Date of Patent: April 4, 2017
    Assignee: LG CHEM, LTD.
    Inventors: Hye Won Jeong, Kyungjun Kim, Kyoung Hoon Kim, Chan Hyo Park, BoRa Shin, Seung Yup Lee, HangAh Park, JinHo Lee, MiRa Im
  • Patent number: 9456073
    Abstract: An electronic device and method are provided. The electronic device includes a built-in microphone; a Bluetooth communication module configured to wirelessly connect to a first wireless external device including a speaker and a second wireless external device including a speaker; and a controller configured to detect a call establishment, if the call establishment is detected while one of the first and second wireless external devices is connected to the electronic device, operate the built-in microphone to receive sound based on information regarding the connected one of the first and second wireless external devices, and if the call establishment is detected while both of the first and second wireless external devices are connected to the electronic device, provide an incoming call audio signal received via the call establishment to one of the first and second wireless external devices.
    Type: Grant
    Filed: September 1, 2015
    Date of Patent: September 27, 2016
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Sang-Kyu Park, Seung-Yup Lee, Jung-Ho Park, Soo-Ho Song
  • Publication number: 20160242291
    Abstract: Various embodiments related to a printed circuit board in which a capacitor is embedded are described. The capacitor may include: a plurality of first conductive layers that have a plurality of first via holes; a plurality of second conductive layers that have a plurality of second via holes, wherein the first and second conductive layers are alternately arranged in turns; and a plurality of dielectric layers that are arranged between the first and second conductive layers. Other various embodiments are possible.
    Type: Application
    Filed: February 17, 2016
    Publication date: August 18, 2016
    Inventors: Sung-Won PARK, Dong-Kyun YU, Ji-Heon YU, Seung-Yup LEE, Taek-Kyun CHOI
  • Patent number: 9312270
    Abstract: Methods of manufacturing a three-dimensional semiconductor device are provided. The method includes: forming a thin film structure, where first and second material layers of at least 2n (n is an integer more than 2) are alternately and repeatedly stacked, on a substrate; wherein the first material layer applies a stress in a range of about 0.1×109 dyne/cm2 to about 10×109 dyne/cm2 to the substrate and the second material layer applies a stress in a range of about ?0.1×109 dyne/cm2 to about ?10×109 dyne/cm2 to the substrate.
    Type: Grant
    Filed: January 9, 2015
    Date of Patent: April 12, 2016
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kyung-Tae Jang, Myoungbum Lee, Seungmok Shin, JinGyun Kim, Yeon-Sil Sohn, Seung-Yup Lee, Dae-Hun Choi
  • Publication number: 20150373177
    Abstract: An electronic device and method are provided. The electronic device includes a built-in microphone; a Bluetooth communication module configured to wirelessly connect to a first wireless external device including a speaker and a second wireless external device including a speaker; and a controller configured to detect a call establishment, if the call establishment is detected while one of the first and second wireless external devices is connected to the electronic device, operate the built-in microphone to receive sound based on information regarding the connected one of the first and second wireless external devices, and if the call establishment is detected while both of the first and second wireless external devices are connected to the electronic device, provide an incoming call audio signal received via the call establishment to one of the first and second wireless external devices.
    Type: Application
    Filed: September 1, 2015
    Publication date: December 24, 2015
    Inventors: Sang-Kyu PARK, Seung-Yup LEE, Jung-Ho PARK, Soo-Ho SONG
  • Publication number: 20150334520
    Abstract: An electronic device and method are provided. The electronic device includes a built-in microphone; a Bluetooth communication module configured to wirelessly connect to a first wireless external device including a speaker and a second wireless external device including a speaker; and a controller configured to detect a call establishment, if the call establishment is detected while one of the first and second wireless external devices is connected to the electronic device, operate the built-in microphone to receive sound based on information regarding the connected one of the first and second wireless external devices, and if the call establishment is detected while both of the first and second wireless external devices are connected to the electronic device, select one of the first and second wireless external devices and provide an incoming call audio signal received via the call establishment to the selected one of the first and second wireless external devices.
    Type: Application
    Filed: July 29, 2015
    Publication date: November 19, 2015
    Inventors: Sang-Kyu PARK, Seung-Yup LEE, Jung-Ho PARK, Soo-Ho SONG
  • Publication number: 20150277710
    Abstract: Provided is a data preloading method which improves the response speed of a user device by predicting whether a particular object provided on a graphic user interface (GUI) will be selected based on the position of a pointer before the particular object is selected by a user and preloading data that should be loaded when the particular object is selected.
    Type: Application
    Filed: October 10, 2013
    Publication date: October 1, 2015
    Inventors: Seung Yup Lee, Ju Wan Yoo, Gun Hee Han
  • Patent number: 9124710
    Abstract: An apparatus and method for controlling a built-in microphone of a portable terminal is provided. The method includes checking whether a connection device connected to the portable electronic device includes an external microphone; operating the built-in microphone of the portable electronic device to receive a first signal, upon connecting a call, when the connection device does not include the external microphone; and selecting, upon connecting the call while a plurality of connection devices are connected to the portable electronic device, one connection device from among the plurality of connection devices to output a second signal.
    Type: Grant
    Filed: July 8, 2014
    Date of Patent: September 1, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sang-Kyu Park, Seung-Yup Lee, Jung-Ho Park, Soo-Ho Song
  • Patent number: 9124711
    Abstract: An electronic device and a method implemented in the electronic device are provided. The method includes detecting, by a device detector, whether a wired external device coupled to the electronic device and including a wired external speaker further includes a wired external microphone; providing a signal, by the device detector, indicating whether the wired external device includes the wired external microphone; detecting, by a controller, a call establishment; and operating, by the controller, a built-in microphone to receive a voice sound if the signal from the device detector indicates that the wired external device does not include the wired external microphone and providing a voice signal received from a second electronic device to the wired external device so that the wired external speaker outputs the voice signal, wherein the built-in microphone and a built-in speaker of the electronic device are coupled to the controller via a COder-DECoder (CODEC).
    Type: Grant
    Filed: October 6, 2014
    Date of Patent: September 1, 2015
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Sang-Kyu Park, Seung-Yup Lee, Jung-Ho Park, Soo-Ho Song
  • Publication number: 20150239210
    Abstract: The present invention relates to a laminate and a device fabricated using the laminate. The laminate includes a debonding layer including a polyimide resin between a carrier substrate and a flexible substrate. The adhesive strength of the debonding layer to the flexible substrate is changed by a physical stimulus. According to the present invention, the flexible substrate can be easily separated from the carrier substrate without the need for further processing such as laser or light irradiation. Therefore, the use of the laminate facilitates the fabrication of the device having the flexible substrate. The device may be, for example, a flexible display device. In addition, the device can be prevented from deterioration of reliability and occurrence of defects caused by laser or light irradiation. This ensures improved characteristics and high reliability of the device.
    Type: Application
    Filed: April 8, 2014
    Publication date: August 27, 2015
    Applicant: LG CHEM, LTD.
    Inventors: Hye Won Jeong, Kyungjun Kim, Kyoung Hoon Kim, Chan Hyo Park, BoRa Shin, Seung Yup Lee, HangAh Park, JinHo Lee, MiRa Im
  • Publication number: 20150232621
    Abstract: The present invention relates to a laminate and a device fabricated using the laminate. The laminate includes a debonding layer including a polyimide resin having a similarity score not greater than 0.5, as calculated by Equation 1 defined in the detailed description, between a carrier substrate and a flexible substrate. According to the present invention, the flexible substrate can be easily separated from the carrier substrate without the need for further processing such as laser or light irradiation. Therefore, the use of the laminate facilitates the fabrication of the device having the flexible substrate. The device may be, for example, a flexible display device. In addition, the device can be prevented from deterioration of reliability and occurrence of defects caused by laser or light irradiation. This ensures improved characteristics and high reliability of the device.
    Type: Application
    Filed: April 8, 2014
    Publication date: August 20, 2015
    Applicant: LG CHEM, LTD.
    Inventors: Hye Won Jeong, Kyungjun Kim, Kyoung Hoon Kim, Chan Hyo Park, BoRa Shin, Seung Yup Lee, HangAh Park, JinHo Lee, MiRa Im
  • Publication number: 20150210048
    Abstract: The present invention relates to a laminate and a device fabricated using the laminate. The laminate includes a first polyimide resin layer between a carrier substrate and a second polyimide resin layer, wherein the first polyimide resin layer has a coefficient of thermal expansion (CTE) equal to or lower than the CTE of the second polyimide-based resin layer at a temperature of 100 to 200° C., and the adhesive strength of the first resin layer to the second resin layer decreases when a physical stimulus causing no chemical changes in the first resin layer is applied to the laminate. According to the present invention, the flexible substrate can be easily separated from the carrier substrate without the need for further processing such as laser or light irradiation. Therefore, the use of the laminate facilitates the fabrication of the device having the flexible substrate. The device may be, for example, a flexible display device.
    Type: Application
    Filed: April 8, 2014
    Publication date: July 30, 2015
    Applicant: LG CHEM, LTD.
    Inventors: Hye Won Jeong, Kyungjun Kim, Kyoung Hoon Kim, Chan Hyo Park, BoRa Shin, Seung Yup Lee, HangAh Park, JinHo Lee, MiRa Im
  • Patent number: 9079139
    Abstract: There is provided a reverse osmosis membrane including a porous support; a polysulfone layer formed on the porous support and having pores formed in a surface thereof, pores having a diameter of 40 nm or greater accounting for less than 0.5% of total pores; and an active layer.
    Type: Grant
    Filed: September 13, 2013
    Date of Patent: July 14, 2015
    Assignee: LG CHEM, LTD.
    Inventors: Hye-Jin Kwon, Seung-Yup Lee, Seung-Pyo Jeong, Phill Lee, Chong-Kyu Shin
  • Publication number: 20150190761
    Abstract: There is provided a reverse osmosis membrane including a porous support; a polysulfone layer formed on the porous support and having pores formed in a surface thereof, pores having a diameter of 40 nm or greater accounting for less than 0.5% of total pores; and an active layer.
    Type: Application
    Filed: March 18, 2015
    Publication date: July 9, 2015
    Inventors: Hye-Jin KWON, Seung-Yup LEE, Seung-Pyo JEONG, Phill LEE, Chong-Kyu SHIN
  • Publication number: 20150126007
    Abstract: Methods of manufacturing a three-dimensional semiconductor device are provided. The method includes: forming a thin film structure, where first and second material layers of at least 2n (n is an integer more than 2) are alternately and repeatedly stacked, on a substrate; wherein the first material layer applies a stress in a range of about 0.1×109 dyne/cm2 to about 10×109 dyne/cm2 to the substrate and the second material layer applies a stress in a range of about ?0.1×109 dyne/cm2 to about ?10×109 dyne/cm2 to the substrate.
    Type: Application
    Filed: January 9, 2015
    Publication date: May 7, 2015
    Inventors: Kyung-Tae Jang, Myoungbum Lee, Seungmok Shin, JinGyun Kim, Yeon-Sil Sohn, Seung-Yup Lee, Dae-Hun Choi
  • Publication number: 20150114902
    Abstract: There are provided a method of manufacturing a reverse osmosis membrane and a reverse osmosis membrane manufactured thereby. The method includes forming a polysulfone layer by applying a solution including a mixed solvent containing two or more solvents having different solubility parameter values to a surface of a porous support; and forming an active layer on the polysulfone layer.
    Type: Application
    Filed: December 30, 2014
    Publication date: April 30, 2015
    Inventors: Seung-Pyo JEONG, Seung-Yup LEE, Phill LEE, Hye-Jin KWON, Chong-Kyu SHIN
  • Patent number: 8993053
    Abstract: There are provided a method of manufacturing a reverse osmosis membrane and a reverse osmosis membrane manufactured thereby. The method includes forming a polysulfone layer by applying a solution including a mixed solvent containing two or more solvents having different solubility parameter values to a surface of a porous support; and forming an active layer on the polysulfone layer.
    Type: Grant
    Filed: September 13, 2013
    Date of Patent: March 31, 2015
    Assignee: LG Chem, Ltd.
    Inventors: Seung-Pyo Jeong, Seung-Yup Lee, Phill Lee, Hye-Jin Kwon, Chong-Kyu Shin
  • Patent number: D750080
    Type: Grant
    Filed: November 12, 2014
    Date of Patent: February 23, 2016
    Assignee: LG Electronics Inc.
    Inventors: Seung Yup Lee, Sea La Park
  • Patent number: D750628
    Type: Grant
    Filed: November 12, 2014
    Date of Patent: March 1, 2016
    Assignee: LG Electronics Inc.
    Inventors: Seung Yup Lee, Sea La Park