Patents by Inventor Seung-Hwan Kang

Seung-Hwan Kang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11991150
    Abstract: Disclosed herein are an apparatus and method for providing a remote work environment. The apparatus includes one or more processors and executable memory for storing at least one program executed by the one or more processors. The at least one program performs Virtual Private Network (VPN) authentication in response to a request for remote access to a work network from a user terminal, performs user authentication in order to connect the user terminal that succeeds in VPN authentication to the work network, decrypts the encrypted user data area of the user terminal that is connected to the work network, and provides the remote work environment to the user terminal based on the user data area through the work network.
    Type: Grant
    Filed: September 7, 2021
    Date of Patent: May 21, 2024
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Gak-Soo Lim, Sung-Jin Kim, Jung-Hwan Kang, Seung-Hun Han, Byung-Joon Kim
  • Publication number: 20240149751
    Abstract: A dual release actuator for a vehicle seat includes a motor, a cable carrier configured to receive power of the motor, thereby rotating to selectively pull one of two different cables, a Hall sensor to sense rotation of the motor, and a controller configured to count a sensing pulse of the Hall sensor for controlling rotation of the motor.
    Type: Application
    Filed: May 17, 2023
    Publication date: May 9, 2024
    Inventors: Jae Wook Kim, Sang Soo Lee, Deok Soo Lim, Hyun Wook Lim, Sang Ho Lee, Sang Hark Lee, Hak Cheol Lee, Deok Ki Kim, Byeong Deok Choi, Hoe Cheon Kim, Hwa Young Mun, Seung Yeop Lee, Cheol Hwan Yoon, Jung Bin Lee, Byung Ju Kang
  • Publication number: 20240137790
    Abstract: The present disclosure discloses systems and methods of calculating a near-maximum likelihood detection (MLD) performance capability signal to interference plus noise ratio (SINR) according to instructions stored in non-transitory computer readable memory that when executed by a processor of a multiple-input, multiple output orthogonal frequency-division multiplexing (MIMO-OFDM) wireless communications receiver device cause the processor to perform operations including the processor acquiring Hi and noise variance ?n2 for each subcarrier of a set of subcarriers between a MIMO-OFDM wireless communications transmitter device and the wireless communications receiver device, computing an average received bit mutual information rate (RBIR) over all subcarriers, converting the average RBIR to an effective SINR; and selecting a modulation coding scheme (MCS).
    Type: Application
    Filed: April 4, 2023
    Publication date: April 25, 2024
    Inventors: KYUNG HOON KWON, SEUNG HYEOK AHN, YOUNG HWAN KANG, SEUNG HO CHOO, JUNGCHUL SHIN, DAEHONG KIM
  • Patent number: 11965684
    Abstract: An inverter module according to an embodiment of the present invention comprises: a high voltage circuit unit which generates an inverter control voltage and a motor driving voltage by using a first DC voltage; a high voltage circuit pattern which electrically connects the high voltage circuit unit; a low voltage circuit unit which communicates with an external device by using a second DC voltage having a smaller magnitude than the first DC voltage; and a low voltage circuit pattern which electrically connects the low voltage circuit unit. The high voltage circuit pattern and the low voltage circuit pattern are spaced apart from each other.
    Type: Grant
    Filed: October 18, 2019
    Date of Patent: April 23, 2024
    Assignee: Hanon Systems
    Inventors: Tae Hyeong Kim, Eun Seok Kang, Sung Jun Park, Chan Song, Seung Hwan Shin, Ho Bin Im, Min Gyo Jung
  • Patent number: 11961775
    Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.
    Type: Grant
    Filed: November 8, 2022
    Date of Patent: April 16, 2024
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Gyu Wan Han, Won Bae Bang, Ju Hyung Lee, Min Hwa Chang, Dong Joo Park, Jin Young Khim, Jae Yun Kim, Se Hwan Hong, Seung Jae Yu, Shaun Bowers, Gi Tae Lim, Byoung Woo Cho, Myung Jea Choi, Seul Bee Lee, Sang Goo Kang, Kyung Rok Park
  • Patent number: 11949508
    Abstract: A method performed by a transmitter in a wireless local area network (WLAN) is provided. The method comprises: setting a second parameter in a second frame based on a first puncturing pattern indicated by a first parameter in a first frame for a basic service set (BSS) set up by an access point (AP); and transmitting, to a receiver, the second frame, wherein the first puncturing pattern is one of a plurality of puncturing patterns pre-determined for a third parameter in a third frame.
    Type: Grant
    Filed: February 18, 2022
    Date of Patent: April 2, 2024
    Assignee: Senscomm Semiconductor Co., Ltd.
    Inventors: Yujin Noh, Seung Hyeok Ahn, Seung Ho Choo, Young-Hwan Kang, Jungchul Shin, Tan Joong Park
  • Patent number: 11915853
    Abstract: A coil component is provided. The coil component includes a body having fifth and sixth surfaces opposing each other, first and second surfaces respectively connecting the fifth and sixth surfaces of the body and opposing each other, and third and fourth surfaces respectively connecting the first and second surfaces of the body and opposing each other in one direction, a recess disposed in an edge between one of the first and second surfaces of the body and the sixth surface of the body, a coil portion disposed inside the body and exposed through the recess, and an external electrode including a connection portion disposed in the recess and connected to the coil portion, and a pad portion disposed on one surface of the body. A length of the pad portion in the one direction is greater than a length of the connection portion in the one direction.
    Type: Grant
    Filed: November 6, 2020
    Date of Patent: February 27, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seung Mo Lim, Seung Min Lee, Byeong Cheol Moon, Yong Hui Li, Byung Soo Kang, Ju Hwan Yang, Tai Yon Cho, No Il Park, Tae Jun Choi
  • Patent number: 11685702
    Abstract: Provided is a method for producing (alkyl)arene compounds represented by Formulae 3-1, 3-2, and 3-3 by the Friedel-Crafts alkylation reaction of alkyl halide compounds and arene compounds using organic phosphine compounds as a catalyst.
    Type: Grant
    Filed: December 7, 2020
    Date of Patent: June 27, 2023
    Assignee: JSI SILICONE CO.
    Inventors: Il Nam Jung, A Ra Cho, Seung Hwan Kang, Young Min Kim
  • Publication number: 20210188739
    Abstract: Provided is a method for producing (alkyl)arene compounds represented by Formulae 3-1, 3-2, and 3-3 by the Friedel-Crafts alkylation reaction of alkyl halide compounds and arene compounds using organic phosphine compounds as a catalyst.
    Type: Application
    Filed: December 7, 2020
    Publication date: June 24, 2021
    Inventors: Il Nam JUNG, A Ra CHO, Seung Hwan KANG, Young Min KIM
  • Patent number: 10508333
    Abstract: A heating apparatus including a side wall heat insulator configured to provide an inner space for receiving a reaction tube, an upper wall heat insulator covering a top portion of the side wall heat insulator, a heat generation part in an inner surface of the side wall heat insulator, and a heat compensating part on a lower surface of the upper wall heat insulator, the heat compensating part including a reflection surface in a first region on the lower surface of the upper wall heat insulator, the first region having a first emissivity less than an emissivity of the upper wall heat insulator may be provided.
    Type: Grant
    Filed: January 27, 2017
    Date of Patent: December 17, 2019
    Assignees: Samsung Electronics Co., Ltd., Sungkyunkwan University's Research & Business Foundation
    Inventors: Byeong-Hoon Kim, Byung-Hwan Kong, Sung-Han Lee, Sun Cho, Seung-Hwan Kang, Seung-Ho Lee, Han-Seo Ko
  • Publication number: 20170218507
    Abstract: A heating apparatus including a side wall heat insulator configured to provide an inner space for receiving a reaction tube, an upper wall heat insulator covering a top portion of the side wall heat insulator, a heat generation part in an inner surface of the side wall heat insulator, and a heat compensating part on a lower surface of the upper wall heat insulator, the heat compensating part including a reflection surface in a first region on the lower surface of the upper wall heat insulator, the first region having a first emissivity less than an emissivity of the upper wall heat insulator may be provided.
    Type: Application
    Filed: January 27, 2017
    Publication date: August 3, 2017
    Applicants: Samsung Electronics Co., Ltd., SungKyunKwan University's Research & Business Foundation
    Inventors: BYEONG-HOON KIM, Byung-Hwan Kong, Sung-Han Lee, Sun Cho, Seung-Hwan Kang, Seung-Ho Lee, Han-Seo Ko