Abstract: The present invention provides a highly integrated memory cell and a semiconductor memory device including the same. According to the present invention, a semiconductor memory device comprises: a memory cell array in which a plurality of memory cells is vertically stacked to a substrate, wherein each of the memory cells includes: a bit line vertically oriented to the substrate; a capacitor laterally spaced apart from the bit line; an active layer laterally oriented between the bit line and the capacitor; and a word line and a back gate facing each other with the active layer interposed therebetween, and wherein an edge of the word line and an edge of the back gate have a step shape along a stacking direction of the memory cells.

Abstract: A method and an apparatus are disclosed for video coding using improved cross-component linear model (CCLM) prediction. The video coding method and the apparatus generate a first predictor of a current chroma block according to CCLM prediction, and additionally generate a second predictor of the current chroma block based on the neighboring pixels of the current chroma block in intra prediction of the current chroma block. The video coding method and the apparatus perform weighted combination on the first predictor and the second predictor.

Abstract: An image encoding/decoding method and apparatus are provided. An image decoding method performed by an image decoding apparatus includes determining a splitting type of a current block, splitting the current block into a plurality of lower-layer blocks based on the splitting type, and decoding the lower-layer blocks. In this case, the current block may be a chroma block, and the determining the splitting type of the current block may be performed by disallowing a predetermined type, in which a width or height of the lower-layer blocks is a predetermined value, among a plurality of splitting types.

Abstract: A dual release actuator for a vehicle seat includes a motor, a cable carrier configured to receive power of the motor, thereby rotating to selectively pull one of two different cables, a Hall sensor to sense rotation of the motor, and a controller configured to count a sensing pulse of the Hall sensor for controlling rotation of the motor.

Abstract: An apparatus for generating a roll map of a merge-wound electrode includes a position measurement device configured to acquire coordinate value data for a longitudinal position of an electrode according to an amount of rotation of the rewinder. The apparatus includes an input device configured to input an input signal indicating a start of merge-winding or an end of merge-winding, a seam detector configured to detect a seam, a reference point detector configured to detect a plurality of reference points of the merge-wound electrode, and a roll map generator configured to generate a roll map for simulating the merge-wound electrode moving in a roll-to-roll state based on the input signal of the input device, and to display the longitudinal coordinate values of the electrode, the electrode coordinate values of the seam, and the electrode coordinate values of the plurality of reference points of the merge-wound electrode on the roll map.

Abstract: A color matching circuit of an image sensor includes a receiving end configured to receive an analog pixel signal. The color matching circuit also includes a path controller including a first switch set configured to control current paths between a common node coupled to the receiving end and power sources and a second switch set configured to control signal paths between the common node and analog-to-digital converters, the path controller being configured to determine on-off states of switches included in the first switch set and the second switch set based on a color corresponding to the analog pixel signal. The path controller transfers the analog pixel signal to a target analog-to-digital converter determined depending on the on-off states of the switches, among the analog-to-digital converters.

Abstract: A molding apparatus for fabricating a semiconductor package includes an upper mold including an upper cavity, a first side cavity at a first side of the upper cavity, a second side cavity formed at an opposite second side of the upper cavity, and a first driving part connected to the first side cavity and configured to move the first side cavity in a first direction, and a bottom mold including a bottom cavity configured to receive a molding target including a package substrate and at least one semiconductor chip. A width in the first direction between the first side cavity and the second side cavity may be smaller than a width of the package substrate in the first direction and greater than a width in the first direction between a first boundary and a second boundary of the at least one semiconductor chip.

Abstract: A display panel includes an amorphous silicon gate driver in which a lower voltage than the gate-off voltage output from the gate driver is applied to an adjacent stage as a low voltage transmission signal.

Abstract: The present invention provides a highly integrated memory cell and a semiconductor memory device including the same. According to the present invention, a semiconductor memory device comprises: a substrate; an active layer spaced apart from the substrate, extending in a direction parallel to the substrate, and including a thin-body channel; a bit line extending in a direction vertical to the substrate and connected to one side of the active layer; a capacitor connected to another side of the active layer; and a first word line and a second word line extending in a direction crossing the thin-body channel with the thin-body channel interposed therebetween, wherein a thickness of the thin-body channel is smaller than thicknesses of the first word line and the second word line.

Abstract: A cell unit includes a plurality of battery cells disposed on both surfaces of a unit plate. A case accommodates the cell unit and provided with a cooling device on at least one surface of the case. The unit plate includes a plurality of receiving spaces formed by a plate portion, having a flat surface, and a side portion protruding upwardly and downwardly of the plate portion from both sides of the plate portion. The plurality of battery cells are received in each of the receiving spaces.

Abstract: A railess variable seatback type rear seat includes: a linear movement device configured to convert a rotation of a motor into a linear movement; a sliding movement device configured to convert the linear movement into a sliding movement in which a seat cushion is pushed forward or backward; and a reclining angle change device configured to convert the sliding movement into a reclining movement, and to fold a seatback, which is connected to the seat cushion, forward or to recline the seatback backward.

Abstract: A semiconductor wafer cleaning composition for used in a semiconductor device manufacturing process and a method of cleaning a semiconductor wafer using the cleaning composition are provided. The cleaning composition includes surfactants represented by Formula 1 and Formula 2, respectively, an organic or inorganic acid, and water occupying for the remaining proportion. The cleaning method is a method of immersing a semiconductor wafer in the cleaning composition for 100 to 500 seconds. The cleaning composition and the cleaning method according to the present disclosure provide an incredibility improved removal rate and an effective cleaning power for contaminants, especially organic wax, during a process of polishing the surface of a wafer used to manufacture semiconductor devices, thereby providing a super-cleaned wafer surface, resulting in production of reliable semiconductor devices.

Abstract: This surface-emitting laser device comprises: a first reflective layer; an active region disposed over the first reflective layer; an aperture region which is disposed over the active region and comprises an aperture and an insulating region; a second reflective layer disposed over the aperture region; and a second electrode electrically connected to the second reflective layer. The second electrode comprises first to sixth conductive layers. The first conductive layer may comprises Ti, and the sixth conductive layer may comprise Au.

Abstract: The disclosure relates to a tobacco material including a natural flavor material and a method of preparing the tobacco material. The tobacco material may have a core-shell structure in which a core includes a natural flavor material and is surrounded by a shell including a tobacco mixture, such that the aerosol generating article including the tobacco material generates a characteristic flavor.

Abstract: An inverter module according to an embodiment of the present invention comprises: a high voltage circuit unit which generates an inverter control voltage and a motor driving voltage by using a first DC voltage; a high voltage circuit pattern which electrically connects the high voltage circuit unit; a low voltage circuit unit which communicates with an external device by using a second DC voltage having a smaller magnitude than the first DC voltage; and a low voltage circuit pattern which electrically connects the low voltage circuit unit. The high voltage circuit pattern and the low voltage circuit pattern are spaced apart from each other.

Abstract: A method for fabricating a semiconductor device includes forming a stack body over a substrate; forming a sacrificial vertical structure including a double spacer in a first region of the stack body; forming a separation slit including a single spacer in a second region of the stack body to be spaced apart from the sacrificial vertical structure; forming a vertical opening in the first region of the stack body by removing the sacrificial vertical structure; and forming a vertical conductive line filling the vertical opening.

Abstract: An image encoding/decoding method and apparatus are provided. An image decoding method performed by an image decoding apparatus may include identifying a prediction mode of a current block, determining a candidate intra prediction mode for the current block, based on a prediction mode of a neighboring block located around the current block, based on the intra prediction mode of the current block being an intra prediction mode, generating a candidate intra prediction mode list of the current block based on the candidate intra prediction mode, and determine an intra prediction mode of the current block based on the candidate intra prediction mode list. In this case, the candidate intra prediction mode may be determined to be a predetermined intra prediction mode, based on the prediction mode of the neighboring block being an MIP mode.

Abstract: An image sensing device includes: a control circuit coupled between an output terminal of a pixel signal and a high voltage terminal, and configured to generate a control voltage corresponding to a voltage level of the pixel signal; and a current supplying circuit coupled between the output terminal and the high voltage terminal, and configured to supply a pre-charge current, which is configured to be adaptively adjusted according to the voltage level of the pixel signal, to the output terminal based on the control voltage.

Abstract: One or more embodiments relate to an aerosol generating article including: a first portion including an aerosol generating element; a second portion including a cooling element; a third portion including a tobacco element; and a fourth portion including a filter element, wherein the first through fourth portions are sequentially arranged in a longitudinal direction of the aerosol generating article.

Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.