Patents by Inventor Seung Hyun Lee

Seung Hyun Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240155150
    Abstract: The present invention relates to a method for encoding and decoding an image. The method for decoding an image includes: deriving an initial motion vector from a merge candidate list of a current block; deriving a refined motion vector using the initial motion vector; and generating a prediction block of the current block using the refined motion vector.
    Type: Application
    Filed: January 10, 2024
    Publication date: May 9, 2024
    Inventors: Ha Hyun LEE, Jung Won KANG, Hyun Suk KO, Sung Chang LIM, Jin Ho LEE, Dong San JUN, Seung Hyun CHO, Hui Yong KIM, Jin Soo CHOI
  • Publication number: 20240154112
    Abstract: A cathode active material for a lithium secondary battery according to an embodiment includes lithium metal oxide particles containing lithium and nickel, and containing a small amount of cobalt or no cobalt. An average particle diameter, a modulus and a hardness of the lithium metal oxide particles are adjusted to satisfy a desired relation. A lithium secondary battery has improved high-temperature storage properties, structural stability and high power properties.
    Type: Application
    Filed: October 24, 2023
    Publication date: May 9, 2024
    Inventors: Hong Ki KIM, Min Gu KANG, Seung Hyun KIM, Young Hoon DO, Young Uk PARK, Yoon Ji LEE, Yong Hyun CHO
  • Patent number: 11977855
    Abstract: The Zero User Interface (UI)-based automatic speech translation system and method can solve problems such as the procedural inconvenience of inputting speech signals and the malfunction of speech recognition due to crosstalk when users who speak difference languages have a face-to-face conversation. The system includes an automatic speech translation server, speaker terminals and a counterpart terminal. The automatic speech translation server selects a speech signal of a speaker among multiple speech signals received from speaker terminals connected to an automatic speech translation service and transmits a result of translating the speech signal of the speaker into a target language to a counterpart terminal.
    Type: Grant
    Filed: November 9, 2021
    Date of Patent: May 7, 2024
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Sang Hun Kim, Seung Yun, Min Kyu Lee, Joon Gyu Maeng, Dong Hyun Kim
  • Patent number: 11972839
    Abstract: A memory system includes a memory device including an interface circuit and a semiconductor memory, and a controller to generate a command for controlling the memory device. The interface circuit receives the command from the controller; determines whether the command is for the semiconductor memory or the interface circuit; and when it is determined that the command is for the interface circuit, performs a blocking operation to block transfer of the command between the interface circuit and the semiconductor memory and performs an internal operation of the interface circuit. The internal operation includes a signal controlling operation, a training operation, a read operation, an on-die termination operation, a ZQ calibration operation, or a driving force control operation.
    Type: Grant
    Filed: July 26, 2022
    Date of Patent: April 30, 2024
    Assignee: SK hynix Inc.
    Inventors: Chang Kyun Park, Young Sik Koh, Seung Jin Park, Dong Hyun Lee
  • Patent number: 11970090
    Abstract: A railess variable seatback type rear seat includes: a linear movement device configured to convert a rotation of a motor into a linear movement; a sliding movement device configured to convert the linear movement into a sliding movement in which a seat cushion is pushed forward or backward; and a reclining angle change device configured to convert the sliding movement into a reclining movement, and to fold a seatback, which is connected to the seat cushion, forward or to recline the seatback backward.
    Type: Grant
    Filed: July 20, 2021
    Date of Patent: April 30, 2024
    Assignees: HYUNDAI MOTOR COMPANY, Kia Corporation, Daechang Seat Co.,LTD-Dongtan, Hyundai Transys Inc.
    Inventors: Seung-Hyun Kim, Sang-Hyun Lee, Min-Ju Lee, Byung-Yong Choi, Chan-Ho Jung, Seon-Chae Na, Young-Woon Choi, Jae-Jin Lee, Dong-Hwan Kim, In-Chang Hwang
  • Patent number: 11970672
    Abstract: A semiconductor wafer cleaning composition for used in a semiconductor device manufacturing process and a method of cleaning a semiconductor wafer using the cleaning composition are provided. The cleaning composition includes surfactants represented by Formula 1 and Formula 2, respectively, an organic or inorganic acid, and water occupying for the remaining proportion. The cleaning method is a method of immersing a semiconductor wafer in the cleaning composition for 100 to 500 seconds. The cleaning composition and the cleaning method according to the present disclosure provide an incredibility improved removal rate and an effective cleaning power for contaminants, especially organic wax, during a process of polishing the surface of a wafer used to manufacture semiconductor devices, thereby providing a super-cleaned wafer surface, resulting in production of reliable semiconductor devices.
    Type: Grant
    Filed: February 10, 2020
    Date of Patent: April 30, 2024
    Assignee: YOUNG CHANG CHEMICAL CO., LTD
    Inventors: Seung Hun Lee, Seung Hyun Lee, Seong Hwan Kim, Seung Oh Jin
  • Publication number: 20240133642
    Abstract: The present invention relates to an integrated connector and a heat exchanger including the same, in which a connector main body is formed by pressing one pipe, a cap is press-fitted into the connector main body, such that the integrated connector is formed so that an interior of the connector main body is blocked by the cap. Therefore, the number of components used to manufacture a connector, which connects and securely couples a header tank and a gas-liquid separator, may be reduced, the integrated connector may be easily manufactured, and a brazing defect may be reduced at portions where the integrated connector is joined to the header tank and the gas-liquid separator of the heat exchanger.
    Type: Application
    Filed: September 26, 2023
    Publication date: April 25, 2024
    Inventors: Seung Hark SHIN, Woon Sik KIM, Dae Sung NOH, Hyunwoo CHO, Min Won SEO, Sung Hong SHIN, Jong Du LEE, Jung Hyun CHO, Uk HUH
  • Publication number: 20240136175
    Abstract: The present invention relates to an auxiliary precursor, a thin film precursor composition, a method of forming a thin film using the thin film precursor composition, and a semiconductor substrate fabricated using the method. The present invention provides the thin film precursor composition including a thin film precursor compound and a compound having a predetermined structure that exhibits reaction stability as the auxiliary precursor. By using the thin film precursor composition in a thin film deposition process, side reactions may be suppressed, and thin film growth rate may be appropriately controlled. In addition, since process by-products are removed from a thin film, even when a thin film is formed on a substrate having a complicated structure, step coverage and the thickness uniformity and resistivity characteristics of the thin film may be greatly improved.
    Type: Application
    Filed: February 22, 2022
    Publication date: April 25, 2024
    Inventors: Jae Sun JUNG, Chang Bong YEON, Seung Hyun LEE, Ji Hyun NAM, Sung Woo CHO
  • Publication number: 20240136404
    Abstract: Disclosed are a SiC MOSFET power semiconductor device and a method of manufacturing the same. More particularly, a SiC MOSFET power semiconductor device and a method of manufacturing the same are disclosed, including a trench gate having a hexagonal shape in a plan or layout view, to improve on-resistance (Rsp) characteristics and increase channel density.
    Type: Application
    Filed: April 20, 2023
    Publication date: April 25, 2024
    Inventors: Hee Bae LEE, Jae Yuhn MOON, Seung Hyun KIM
  • Publication number: 20240137511
    Abstract: Disclosed herein are a video decoding method and apparatus and a video encoding method and apparatus. In video encoding and decoding, multiple partition blocks are generated by splitting a target block. A prediction mode is derived for at least a part of the multiple partition blocks, among the multiple partition blocks, and prediction is performed on the multiple partition blocks based on the derived prediction mode. When prediction is performed on the partition blocks, information related to the target block may be used, and information related to an additional partition block, which is predicted prior to the partition block, may be used.
    Type: Application
    Filed: January 4, 2024
    Publication date: April 25, 2024
    Applicants: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE, INDUSTRY-UNIVERSITY COOPERATION FOUNDATION KOREA AEROSPACE UNIVERSITY, HANBAT NATIONAL UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION
    Inventors: Jin-Ho LEE, Jung-Won KANG, Hyunsuk KO, Sung-Chang LIM, Dong-San JUN, Ha-Hyun LEE, Seung-Hyun CHO, Hui-Yong KIM, Hae-Chul CHOI, Dae-Hyeok GWON, Jae-Gon KIM, A-Ram BACK
  • Patent number: 11968485
    Abstract: The present specification discloses a method for monitoring a mobile asset by using a sensing terminal which comprises: a coupling unit for coupling an object of interest to the housing; a sensor unit for generating sensing data for the object of interest; a processor for generating, on the basis of the sensing data, transmission unit data to be transmitted to a server; and a communication unit for transmitting the transmission unit data to the server.
    Type: Grant
    Filed: November 28, 2019
    Date of Patent: April 23, 2024
    Assignee: C&TECHCO., LTD.
    Inventors: Ki Duk Kim, Seung Hyun Park, Jeong Ho Lee
  • Publication number: 20240128260
    Abstract: Disclosed are a semiconductor device (1) including a MOSPET region and an integrated diode region, and a manufacturing method thereof. More particularly, a semiconductor device (1) including a silicon carbide (SiC) MOSPET region and an integrated Schottky bather diode that reduce forward voltage drop (Vf), device area, and switching oscillation resulting from parasitic inductance are disclosed.
    Type: Application
    Filed: April 17, 2023
    Publication date: April 18, 2024
    Inventors: Seung Hyun KIM, Hee Bae LEE, Jae Yuhn MOON, Soon Jong PARK
  • Publication number: 20240128136
    Abstract: A wafer level package includes: a substrate; an element portion disposed on one surface of the substrate; a cap disposed on the substrate to cover the element portion; a connection portion electrically connected to the element portion; and a bonding portion disposed on an outer side of the connection portion, wherein the bonding portion is disposed on a first surface of one of the substrate and the cap, wherein one end portion of the connection portion is disposed on a second surface having a step difference from the first surface, and wherein the connection portion and the bonding portion are formed of a eutectic material.
    Type: Application
    Filed: February 16, 2023
    Publication date: April 18, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seung Wook PARK, Seong Hun NA, Jae Hyun JUNG, Kwang Su KIM, Sung Jun LEE, Yong Suk KIM, Dong Hyun PARK
  • Publication number: 20240128290
    Abstract: A depth sensor includes a substrate that includes a first face and a second face opposite to each other in a first direction; a photoelectric conversion element disposed in the substrate; and first and second taps connected to the photoelectric conversion element. Each of the first and second taps includes: a floating diffusion area disposed in the substrate; a transfer transistor connected to the floating diffusion area; a photo transistor connected to the photoelectric conversion element; a tap transfer transistor connected to the photo transistor; and a storage transistor connected to the tap transfer transistor and the transfer transistor. The storage transistor includes a storage gate electrode. The storage gate electrode includes a first extension and a second extension that extend from the first face of the substrate toward the second face, and the first extension and the second extension are spaced apart from each other in a second direction.
    Type: Application
    Filed: October 3, 2023
    Publication date: April 18, 2024
    Inventors: Seung Hyun LEE, Young Chan KIM, Young Gu JIN, Young Sun OH
  • Publication number: 20240130111
    Abstract: A semiconductor device may comprise: a plurality of lower electrodes which are on a substrate; a first electrode support which is between adjacent lower electrodes and comprises a metallic material; a dielectric layer which is on the lower electrodes and the first electrode support to extend along profiles of the first electrode support and each of the lower electrodes; and an upper electrode which is on the dielectric layer.
    Type: Application
    Filed: December 26, 2023
    Publication date: April 18, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Yoon Young CHOI, Seung Jin KIM, Byung-Hyun LEE, Sang Jae PARK
  • Patent number: 11963399
    Abstract: A display device includes a substrate including pixels including a first pixel and a second pixel, a driver of the first pixel disposed on the substrate, a driver of the second pixel disposed on the substrate, a first pixel electrode overlapping the driver of the first pixel and electrically connected to the driver of the first pixel, a second pixel electrode overlapping the driver of the first pixel and the driver of the second pixel and electrically connected to the driver of the second pixel, an emission layer disposed on the first pixel electrode and the second pixel electrode, and a common electrode disposed on the emission layer, wherein the second pixel electrode includes a first opening overlapping the driver of the first pixel.
    Type: Grant
    Filed: June 16, 2021
    Date of Patent: April 16, 2024
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Kwang Soo Lee, Seul-Ki Kim, Seung Rae Kim, Jae Hyun Lee, Ki Su Jin
  • Patent number: 11958885
    Abstract: The present invention relates to a novel use of NCKAP1 gene in neurodegenerative diseases. More specifically, the present invention relates to a marker composition for predicting the prognosis of a neurodegenerative disease, comprising a NCKAP1 protein or a gene encoding same, a composition and a kit for predicting the prognosis of a neurodegenerative disease, which comprises a formulation for measuring the level of the protein or an mRNA of the gene encoding same, and a pharmaceutical composition for preventing or treating neurodegenerative disease, comprising the protein or the gene encoding same as an active ingredient.
    Type: Grant
    Filed: August 23, 2018
    Date of Patent: April 16, 2024
    Assignee: Industry-University Cooperation Foundation Hanyang University
    Inventors: Seung Hyun Kim, Min Young Noh, Min Soo Kwon, Ki Wook Oh, Min Yeop Nahm, Soo Jung Lee
  • Publication number: 20240121002
    Abstract: A test device and method for testing a distributed feedback laser diode (DFB-LD) device for an optical transceiver of a radio over fiber (RoF) system examines the DFB-LD device based on an absolute limiting rating, an operating case environment, and a functional specification, in which the absolute limiting rating is a rating at which there is no fatal damage to the DFB-LD device during a short period of time when each limiting parameter is isolated and all other parameters are in a normal performance parameter, the operating case environment includes an operating temperature, and the functional specification includes parameters to be tested according to an operating condition for the functional specification.
    Type: Application
    Filed: December 20, 2023
    Publication date: April 11, 2024
    Inventors: Seung-Hyun CHO, Joon Ki LEE
  • Publication number: 20240120211
    Abstract: A wafer level fan out package includes a semiconductor die having a first surface, a second surface, and a third surface. A stiffener is disposed on the third surface of the semiconductor die. A conductive via passes through the stiffener. First and second electrically conductive patterns electrically connected to the conductive via are disposed on the first and second surfaces of the semiconductor die and stiffener. Solder balls are electrically connected to the first or second electrically conductive patterns.
    Type: Application
    Filed: September 15, 2023
    Publication date: April 11, 2024
    Inventors: Jin Young Kim, Doo Hyun Park, Seung Jae Lee
  • Patent number: 11951130
    Abstract: The present invention relates to an antigen-binding molecule comprising a heavy chain variable region comprising a heavy-chain complementarity-determining region 1 (HCDR1) comprising an amino acid sequence represented by Sequence No. 1, an HCDR2 comprising an amino acid sequence represented by Sequence No. 2, and an HCDR3 comprising an amino acid sequence represented by Sequence No. 3; a light-chain variable region comprising a light-chain complementarity-determining region 1 (LCDR1) comprising an amino acid sequence represented by Sequence No. 4, an LCDR2 comprising an amino acid sequence represented by Sequence No. 5, and an LCDR3 comprising an amino acid sequence represented by Sequence No. 6; wherein the antigen-binding molecule is a T cell receptor (TCR); and to a cell line expressing the same.
    Type: Grant
    Filed: March 1, 2021
    Date of Patent: April 9, 2024
    Assignee: Eutilex Co., Ltd.
    Inventors: Byoung S. Kwon, Young Ho Kim, Kwang Hee Kim, Ji Won Chung, Young Gyoon Chang, Bo Rim Yi, Jung Yun Lee, Seung Hyun Lee, Sun Woo Im, Jin Kyung Choi, Hyun Tae Son, Eun Hye Yoo