Abstract: A semiconductor package includes a package substrate, an interposer mounted on the package substrate via first conductive bumps, first and second semiconductor devices disposed spaced apart from each other on the interposer and mounted on the interposer via second conductive bumps, and an underfill member filling a space between the first conductive bumps that are between the package substrate and the interposer. The interposer includes a central region and a peripheral region at least partially surrounding the central region. The first conductive bumps include first bump structures disposed on second bonding pads, which are in the central region and on a lower surface of the interposer, respectively, and having a circular shape. The first conductive bumps further include second bump structures disposed on second bonding pads, which are in the peripheral region and on the lower surface of the interposer, respectively, and having an elliptical shape.

Abstract: A data storage device includes one or more nonvolatile memory devices each including a plurality of unit storage spaces; and an address recommending circuit configured to recommend a unit storage space among the plurality of unit storage spaces to process a write request, wherein the address recommending circuit applies feature data to a neural network to recommend the unit storage space, and wherein the feature data is generated based on request information for the write request, a target address corresponding to the write request, an address of data stored in the plurality of unit storage spaces.

Abstract: A mobile terminal includes: a touch screen is configured to display a field; and a controller is configured to input a selection of the displayed field, display a list of at least one data relating to the inputted field, inputting a selection of one data through a list of the displayed data, and inserting the inputted data into the inputted field.