Patents by Inventor Seungphil LEE

Seungphil LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11831403
    Abstract: Disclosed are a structure and a clock synchronization method of a precision network interface card for acquiring heterogeneous PTP synchronization information for PTP synchronization network extension. In order to precisely time-synchronize a synchronous switch at a remote location with a synchronous switch of an internal network, a precision time protocol (PTP) synchronous network system and a PTP synchronization method according to an embodiment allow a plurality of switches therebetween to operate as virtual nodes and can precisely measure Ingress_Time of a time synchronization message using a clock synchronized with the virtual nodes.
    Type: Grant
    Filed: January 3, 2022
    Date of Patent: November 28, 2023
    Assignee: SYSMATE CO., LTD.
    Inventors: Seungphil Lee, Yookyoung Lee, Ganho Choi, Sangman Lee
  • Patent number: 9415626
    Abstract: A deco glass panel including a mother substrate formed of glass, a glass powder layer welded on the mother substrate and a rear surface pattern disposed on a rear surface of the mother substrate, wherein the rear surface pattern is located within an outline of the glass powder layer when viewed from the front surface of the mother substrate.
    Type: Grant
    Filed: February 20, 2015
    Date of Patent: August 16, 2016
    Assignee: LG ELECTRONICS INC.
    Inventors: Jinsoo Lee, Seungphil Lee, Changmin Cho
  • Publication number: 20150165815
    Abstract: A deco glass panel including a mother substrate formed of glass, a glass powder layer welded on the mother substrate and a rear surface pattern disposed on a rear surface of the mother substrate, wherein the rear surface pattern is located within an outline of the glass powder layer when viewed from the front surface of the mother substrate.
    Type: Application
    Filed: February 20, 2015
    Publication date: June 18, 2015
    Applicant: LG ELECTRONICS INC.
    Inventors: Jinsoo LEE, Seungphil LEE, Changmin CHO