Patents by Inventor Seungyong Baek

Seungyong Baek has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240107753
    Abstract: An integrated circuit device including a first cell block on a substrate that includes a first cell area, a first dummy cell area surrounding the first cell area in a plan view, the first dummy cell area including first active regions and second active regions in an outer periphery of the first dummy cell area, the first active regions each having a first size and the second active regions each having a second size larger than the first size, first and second word lines extending in a first direction and alternating with each other in a second direction, each of the first word lines including a first landing area extending between a second active region and a first active region, the first active region being near and apart from the second active region in the second direction, and first word line contacts on the first landing area may be provided.
    Type: Application
    Filed: September 13, 2023
    Publication date: March 28, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Dongwon LIM, Inseok BAEK, Sangbin AHN, Seokyeong CHOI, Seungyong HONG
  • Patent number: 11784731
    Abstract: Circuits, methods, and apparatus that provide improved data encoding for data transmitted through a channel of limited bandwidth. One example can provide circuits, signaling methods, and apparatus that can encode data to more fully utilize a bandwidth of a physical channel. This encoding can help to increase a data rate through the physical channel.
    Type: Grant
    Filed: March 9, 2021
    Date of Patent: October 10, 2023
    Assignee: Apple Inc.
    Inventors: William P. Cornelius, Seungyong Baek
  • Patent number: 11677174
    Abstract: Connectors that support high-speed data transfers and have a high signal quality, good reliability, and are readily manufactured. One example can provide a connector receptacle that supports high-speed data transfers and has a high signal quality by employing connector contacts that include multiple structures.
    Type: Grant
    Filed: February 21, 2021
    Date of Patent: June 13, 2023
    Assignee: Apple Inc.
    Inventors: Mahmoud R. Amini, Nikhil S. Pansare, William P. Cornelius, Seungyong Baek
  • Patent number: 11606230
    Abstract: Circuits, methods, and apparatus that provide improved data recovery for data transmitted through a channel of limited bandwidth. An example can provide circuits, methods, and apparatus that can equalize losses in a physical channel. This equalization can provide an overall channel response that is more consistent and uniform.
    Type: Grant
    Filed: March 3, 2021
    Date of Patent: March 14, 2023
    Assignee: Apple Inc.
    Inventors: William P. Cornelius, Seungyong Baek
  • Publication number: 20230020954
    Abstract: Connectors that support high-speed data transfers and have a high signal quality, good reliability, and are readily manufactured. One example can provide a connector receptacle that supports high-speed data transfers and has a high signal quality by employing contacts that are directly attached to a flexible circuit board.
    Type: Application
    Filed: September 23, 2022
    Publication date: January 19, 2023
    Applicant: Apple Inc.
    Inventors: Adam H. Herzog, Mahmoud R. Amini, Mohammed Aljashmi, George Tziviskos, Nikhil S. Pansare, William P. Cornelius, Seungyong Baek
  • Publication number: 20220376704
    Abstract: Circuits, methods, and apparatus for efficiently implementing encoding and decoding between binary and multilevel data.
    Type: Application
    Filed: August 5, 2022
    Publication date: November 24, 2022
    Applicant: Apple Inc.
    Inventors: William P. Cornelius, Seungyong Baek
  • Publication number: 20220294545
    Abstract: Circuits, methods, and apparatus that provide improved data encoding for data transmitted through a channel of limited bandwidth. One example can provide circuits, signaling methods, and apparatus that can encode data to more fully utilize a bandwidth of a physical channel. This encoding can help to increase a data rate through the physical channel.
    Type: Application
    Filed: March 9, 2021
    Publication date: September 15, 2022
    Applicant: Apple Inc.
    Inventors: William P. Cornelius, Seungyong Baek
  • Publication number: 20220286334
    Abstract: Circuits, methods, and apparatus that provide improved data recovery for data transmitted through a channel of limited bandwidth. An example can provide circuits, methods, and apparatus that can equalize losses in a physical channel. This equalization can provide an overall channel response that is more consistent and uniform.
    Type: Application
    Filed: March 3, 2021
    Publication date: September 8, 2022
    Applicant: Apple Inc.
    Inventors: William P. Cornelius, Seungyong Baek
  • Patent number: 11411579
    Abstract: Circuits, methods, and apparatus for efficiently implementing encoding and decoding between binary and multilevel data.
    Type: Grant
    Filed: October 19, 2020
    Date of Patent: August 9, 2022
    Assignee: Apple Inc.
    Inventors: William P. Cornelius, Seungyong Baek
  • Publication number: 20210249806
    Abstract: Connectors that support high-speed data transfers and have a high signal quality, good reliability, and are readily manufactured. One example can provide a connector receptacle that supports high-speed data transfers and has a high signal quality by employing connector contacts that include multiple structures.
    Type: Application
    Filed: February 21, 2021
    Publication date: August 12, 2021
    Applicant: Apple Inc.
    Inventors: Mahmoud R. Amini, Nikhil S. Pansare, William P. Cornelius, Seungyong Baek
  • Publication number: 20210105023
    Abstract: Circuits, methods, and apparatus for efficiently implementing encoding and decoding between binary and multilevel data.
    Type: Application
    Filed: October 19, 2020
    Publication date: April 8, 2021
    Applicant: Apple Inc.
    Inventors: William P. Cornelius, Seungyong Baek
  • Patent number: 10931048
    Abstract: Connectors that support high-speed data transfers and have a high signal quality, good reliability, and are readily manufactured. One example can provide a connector receptacle that supports high-speed data transfers and has a high signal quality by employing connector contacts that include multiple structures.
    Type: Grant
    Filed: September 24, 2019
    Date of Patent: February 23, 2021
    Assignee: Apple Inc.
    Inventors: Mahmoud R. Amini, Nikhil S. Pansare, William P. Cornelius, Seungyong Baek
  • Patent number: 10812102
    Abstract: Circuits, methods, and apparatus for efficiently implementing encoding and decoding between binary and multilevel data.
    Type: Grant
    Filed: July 1, 2019
    Date of Patent: October 20, 2020
    Assignee: Apple Inc.
    Inventors: William P. Cornelius, Seungyong Baek
  • Publication number: 20200099156
    Abstract: Connectors that support high-speed data transfers and have a high signal quality, good reliability, and are readily manufactured. One example can provide a connector receptacle that supports high-speed data transfers and has a high signal quality by employing connector contacts that include multiple structures.
    Type: Application
    Filed: September 24, 2019
    Publication date: March 26, 2020
    Applicant: Apple Inc.
    Inventors: Mahmoud R. Amini, Nikhil S. Pansare, William P. Cornelius, Seungyong Baek
  • Publication number: 20200007155
    Abstract: Circuits, methods, and apparatus for efficiently implementing encoding and decoding between binary and multilevel data.
    Type: Application
    Filed: July 1, 2019
    Publication date: January 2, 2020
    Applicant: Apple Inc.
    Inventors: William P. Cornelius, Seungyong Baek