Patents by Inventor Shafarin Shafie

Shafarin Shafie has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solder ball attachment system
    Patent number: 6905059
    Abstract: A solder ball attachment system for manufacturing an integrated circuit or the like is disclosed. The solder ball attachment system includes a flux station to apply flux onto a substrate and a solder ball placement station to place solder balls onto the flux on the substrate. The solder ball attachment system further includes a conveyor assembly to move the substrate between the flux station and the solder ball placement station.
    Type: Grant
    Filed: January 30, 2004
    Date of Patent: June 14, 2005
    Assignee: Intel Corporation
    Inventor: Shafarin Shafie
  • Solder ball attachment system
    Publication number: 20040182910
    Abstract: A solder ball attachment system for manufacturing an integrated circuit or the like is disclosed. The solder ball attachment system includes a flux station to apply flux onto a substrate and a solder ball placement station to place solder balls onto the flux on the substrate. The solder ball attachment system further includes a conveyor assembly to move the substrate between the flux station and the solder ball placement station.
    Type: Application
    Filed: January 30, 2004
    Publication date: September 23, 2004
    Applicant: Intel Corporation
    Inventor: Shafarin Shafie
  • Solder ball attachment system
    Patent number: 6739498
    Abstract: A solder ball attachment system for manufacturing an integrated circuit or the like is disclosed. The solder ball attachment system includes a flux station adapted to apply flux onto a substrate and a solder ball placement station adapted to place solder balls onto the flux. A conveyor assembly is included to move the substrate between the flux station and the solder ball placement station.
    Type: Grant
    Filed: May 17, 2001
    Date of Patent: May 25, 2004
    Assignee: Intel Corporation
    Inventor: Shafarin Shafie
  • Solder ball attachment system
    Publication number: 20020170945
    Abstract: A solder ball attachment system for manufacturing an integrated circuit or the like is disclosed. The solder ball attachment system includes a flux station adapted to apply flux onto a substrate and a solder ball placement station adapted to place solder balls onto the flux. A conveyor assembly is included to move the substrate between the flux station and the solder ball placement station.
    Type: Application
    Filed: May 17, 2001
    Publication date: November 21, 2002
    Applicant: Intel Corporation
    Inventor: Shafarin Shafie