Patents by Inventor Shai Feldman
Shai Feldman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20180021565Abstract: In some embodiments, an apparatus includes a substantially rigid base and a flexible substrate. The substantially rigid base has a first protrusion and a second protrusion, and is configured to be coupled to an electronic device. The flexible substrate has a first surface and a second surface, and includes an electrical circuit configured to electronically couple the electronic device to at least one of an electrode a battery, or an antenna. The flexible substrate is coupled to the base such that a first portion of the second surface is in contact with the first protrusion. A second portion of the second surface is non-parallel to the first portion.Type: ApplicationFiled: September 11, 2017Publication date: January 25, 2018Applicant: Bioness Inc.Inventors: Amit DAR, Shai FELDMAN, Arkady GLUKHOVSKY, Shmuel SPRINGER, Einan REGEV
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Patent number: 9757554Abstract: In some embodiments, an apparatus includes a substantially rigid base and a flexible substrate. The substantially rigid base has a first protrusion and a second protrusion, and is configured to be coupled to an electronic device. The flexible substrate has a first surface and a second surface, and includes an electrical circuit configured to electronically couple the electronic device to at least one of an electrode a battery, or an antenna. The flexible substrate is coupled to the base such that a first portion of the second surface is in contact with the first protrusion. A second portion of the second surface is non-parallel to the first portion.Type: GrantFiled: February 24, 2015Date of Patent: September 12, 2017Assignee: Bioness Inc.Inventors: Amit Dar, Shai Feldman, Arkady Glukhovsky, Shmuel Springer, Einan Regev
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Patent number: 9072896Abstract: In some embodiments, an apparatus includes a substantially rigid base and a flexible substrate. The substantially rigid base has a first protrusion and a second protrusion, and is configured to be coupled to an electronic device. The flexible substrate has a first surface and a second surface, and includes an electrical circuit configured to electronically couple the electronic device to at least one of an electrode a battery, or an antenna. The flexible substrate is coupled to the base such that a first portion of the second surface is in contact with the first protrusion. A second portion of the second surface is non-parallel to the first portion.Type: GrantFiled: December 1, 2010Date of Patent: July 7, 2015Assignee: Bioness Inc.Inventors: Amit Dar, Shai Feldman, Arkady Glukhovsky, Shmuel Springer, Einan Regev
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Publication number: 20150165186Abstract: In some embodiments, an apparatus includes a substantially rigid base and a flexible substrate. The substantially rigid base has a first protrusion and a second protrusion, and is configured to be coupled to an electronic device. The flexible substrate has a first surface and a second surface, and includes an electrical circuit configured to electronically couple the electronic device to at least one of an electrode a battery, or an antenna. The flexible substrate is coupled to the base such that a first portion of the second surface is in contact with the first protrusion. A second portion of the second surface is non-parallel to the first portion.Type: ApplicationFiled: February 24, 2015Publication date: June 18, 2015Applicant: BIONESS INC.Inventors: Amit DAR, Shai FELDMAN, Arkady GLUKHOVSKY, Shmuel SPRINGER, Einan REGEV
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Publication number: 20150129399Abstract: Devices for switching or tuning of an electrical circuit comprise a liquid metal (LM) drop confined inside a sealed cavity. The cavity is formed at least partially inside a microelectronics layered structure which includes metal, dielectric and semiconductor layers. The microelectronics layered structure may be prepared using a VLSI/CMOS technology. Some of the VLSI/CMOS metal layers or metalized vias may be used for conduction lines contacted by the LM drop or as RF transmission lines opened or closed by the LM drop.Type: ApplicationFiled: July 31, 2012Publication date: May 14, 2015Inventors: Shai Feldman, Oren Aharon
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Patent number: 9012254Abstract: Methods for forming an enclosed liquid metal (LM) drop inside a sealed cavity by formation of LM components as solid LM component layers and reaction of the solid LM component layers to form the LM drop. In some embodiments, the cavity has boundaries defined by layers or features of a microelectronics (e.g. VLSI-CMOS) or MEMS technology. In such embodiments, the methods comprise implementing an initial microelectronics or MEMS process to form the layers or features and the cavity, sequential or side by side formation of solid LM component layers in the cavity, sealing of the cavity to provide a closed space and reaction of the solid LM components to form a LM alloy in the general shape of a drop. In some embodiments, nanometric reaction barriers may be inserted between the solid LM component layers to lower the LM eutectic formation temperature.Type: GrantFiled: July 31, 2012Date of Patent: April 21, 2015Assignee: Kadoor Microelectronics LtdInventors: Oren Aharon, Shai Feldman
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Patent number: 8738137Abstract: In some embodiments, an apparatus includes a substantially rigid base and a flexible substrate. The substantially rigid base has a first protrusion and a second protrusion, and is configured to be coupled to an electronic device. The flexible substrate has a first surface and a second surface, and includes an electrical circuit configured to electronically couple the electronic device to at least one of an electrode a battery, or an antenna. The flexible substrate is coupled to the base such that a first portion of the second surface is in contact with the first protrusion. A second portion of the second surface is non-parallel to the first portion.Type: GrantFiled: December 1, 2009Date of Patent: May 27, 2014Assignee: Bioness Inc.Inventors: Amit Dar, Shai Feldman, Arkady Glukhovsky, Shmuel Springer, Einan Regev
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Publication number: 20140017842Abstract: Methods for forming an enclosed liquid metal (LM) drop inside a sealed cavity by formation of LM components as solid LM component layers and reaction of the solid LM component layers to form the LM drop. In some embodiments, the cavity has boundaries defined by layers or features of a microelectronics (e.g. VLSI-CMOS) or MEMS technology. In such embodiments, the methods comprise implementing an initial microelectronics or MEMS process to form the layers or features and the cavity, sequential or side by side formation of solid LM component layers in the cavity, sealing of the cavity to provide a closed space and reaction of the solid LM components to form a LM alloy in the general shape of a drop. In some embodiments, nanometric reaction barriers may be inserted between the solid LM component layers to lower the LM eutectic formation temperature.Type: ApplicationFiled: July 31, 2012Publication date: January 16, 2014Applicant: Kadoor Microelectronics Ltd.Inventors: Oren Aharon, Shai Feldman
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Publication number: 20130138164Abstract: In some embodiments, an apparatus includes a substantially rigid base and a flexible substrate. The substantially rigid base has a first protrusion and a second protrusion, and is configured to be coupled to an electronic device. The flexible substrate has a first surface and a second surface, and includes an electrical circuit configured to electronically couple the electronic device to at least one of an electrode a battery, or an antenna. The flexible substrate is coupled to the base such that a first portion of the second surface is in contact with the first protrusion. A second portion of the second surface is non-parallel to the first portion.Type: ApplicationFiled: December 1, 2010Publication date: May 30, 2013Applicant: BIONESS, INC.Inventors: Amit Dar, Shai Feldman, Arkady Glukhovsky, Shmuel Springer, Einan Regev
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Publication number: 20100076533Abstract: In some embodiments, an apparatus includes a substantially rigid base and a flexible substrate. The substantially rigid base has a first protrusion and a second protrusion, and is configured to be coupled to an electronic device. The flexible substrate has a first surface and a second surface, and includes an electrical circuit configured to electronically couple the electronic device to at least one of an electrode a battery, or an antenna. The flexible substrate is coupled to the base such that a first portion of the second surface is in contact with the first protrusion. A second portion of the second surface is non-parallel to the first portion.Type: ApplicationFiled: December 1, 2009Publication date: March 25, 2010Inventors: Amit Dar, Shai Feldman, Arkady Glukhovsky, Shmuel Springer