Patents by Inventor Shamala A. Chikamenahalli

Shamala A. Chikamenahalli has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrating passive components on spacer in stacked dies
    Patent number: 6943294
    Abstract: An embodiment of the present invention is a technique to integrate passive components in a die assembly. A capacitor, inductor, or resistor is integrated on a spacer between upper and lower dies in stacked dies. Conductors are attached to the capacitor, inductor or resistor to connect the capacitor, inductor, or resistor to at least one of the upper and lower dies.
    Type: Grant
    Filed: December 22, 2003
    Date of Patent: September 13, 2005
    Assignee: Intel Corporation
    Inventors: Jung Kang, Kaladhar Radhakrishnan, Shamala A. Chikamenahalli
  • INTEGRATING PASSIVE COMPONENTS ON SPACER IN STACKED DIES
    Publication number: 20050135041
    Abstract: An embodiment of the present invention is a technique to integrate passive components in a die assembly. A capacitor, inductor, or resistor is integrated on a spacer between upper and lower dies in stacked dies. Conductors are attached to the capacitor, inductor or resistor to connect the capacitor, inductor, or resistor to at least one of the upper and lower dies.
    Type: Application
    Filed: December 22, 2003
    Publication date: June 23, 2005
    Inventors: Jung Kang, Kaladhar Radhakrishnan, Shamala Chikamenahalli