Abstract: A low temperature sinterable copper nanoparticle or nanowire, comprising gold, zinc, nickel, tin, or aluminum as an alloying metal, and a capping agent. The nanoparticles or nanowires may be deposited on porous or fibrous substrates, the capping agent desorbed, and sintered at low temperature to form conductive traces or sensing elements. The nanoparticles or nanowires may be deposited by aerosol jet, inkjet or dispenser printers, for example.

Abstract: Provided are a circuit board and production method therefor, a circuit device and production method therefor, and a printing material container assembly. The circuit board is mounted on a printing material container. The circuit board includes an original circuit board and an auxiliary part. The original circuit board includes multiple terminals configured to be in contact with the printing material container or a printing device. The auxiliary part is disposed on the original circuit board and is configured to perform at least one of the following: providing a conductive path or breaking off a conductive path between the terminals.

Abstract: A thermistor sensor arrangement for measuring chipset temperature is provided. According to various aspects of the present disclosure, a sensor assembly is placed between a heat sink of a chipset and a PCB on which the chipset is mounted. The sensor assembly includes a thermistor sensor, an electrical connector, and a resilient pad. The thermistor sensor includes a first end having a sensing element and a second end having sensor contacts. The electrical connector has a first interface to receive the sensor contacts, a second interface through which the signals are outputted, and a bottom surface to mount to the PCB. The resilient pad has an upper surface to which the sensing element is attached and a lower surface to engage with the PCB such that when the resilient pad is compressed, spring force of the resilient pad facilitates temperature measurement by pressing the sensing element against the heat sink.

Abstract: The present disclosure provides a cartridge test device, a cartridge component, and a cartridge component test method. The cartridge component (10) includes a cartridge package (12) and cartridges (11) accommodated in the cartridge package (12), the cartridge package (12) is provided with openings (121) corresponding to the cartridges (11). The cartridge test device (20) includes a device main body (21), a data transmission apparatus (22) mounted on the device main body (21) and in either or both of electrical connection and signal connection with the device main body (21), and test heads (23). The test heads (23) are connected to the device main body (21) and are in either or both of electrical connection and signal connection with the data transmission apparatus (22). The openings (121) are configured to allow the test heads (23) to be in either or both of electrical connection and signal connection with corresponding cartridges (11).

Abstract: A model construction system, apparatus, and method are provided. The model construction system includes at least one first source apparatus, at least one second source apparatus, and a model construction apparatus. The model construction apparatus receives a de-identification data set from each first source apparatus, receives a parameter set of a source model from each second source apparatus, generates at least one aligned data set by aligning the de-identification data set according to a predetermined data format, trains an original model to an assisted training model with the aligned data set(s), generates at least one updated parameter set according to the parameter set(s) and an assisted training parameter set, updates the assisted training model with one of the updated parameter set(s), and transmits the updated parameter set(s) to the second source apparatus(es). Each second source apparatus updates the source model according to the corresponding updated parameter set.

Abstract: A data de-identification apparatus and method are provided. The data de-identification apparatus stores a data set of a first industry, wherein the data set is defined with a plurality of fields. The data de-identification apparatus receives a first instruction and a second instruction, wherein the first instruction corresponds to a second industry and the second instruction corresponds to a use of data. The data de-identification apparatus determines an identification category for each of the fields according to the first industry, the second industry, and the use of data. The data de-identification apparatus transforms the data set into a transformed data set according to the use of data and then transforms the transformed data set into a de-identification data set according to the identification categories.

Abstract: A thermistor sensor arrangement for measuring chipset temperature is provided. According to various aspects of the present disclosure, a sensor assembly is placed between a heat sink of a chipset and a PCB on which the chipset is mounted. The sensor assembly includes a thermistor sensor, an electrical connector, and a resilient pad. The thermistor sensor includes a first end having a sensing element and a second end having sensor contacts. The electrical connector has a first interface to receive the sensor contacts, a second interface through which the signals are outputted, and a bottom surface to mount to the PCB. The resilient pad has an upper surface to which the sensing element is attached and a lower surface to engage with the PCB such that when the resilient pad is compressed, spring force of the resilient pad facilitates temperature measurement by pressing the sensing element against the heat sink.

Abstract: A data de-identification apparatus and method are provided. The data de-identification apparatus stores a data set of a first industry, wherein the data set is defined with a plurality of fields. The data de-identification apparatus receives a first instruction and a second instruction, wherein the first instruction corresponds to a second industry and the second instruction corresponds to a use of data. The data de-identification apparatus determines an identification category for each of the fields according to the first industry, the second industry, and the use of data. The data de-identification apparatus transforms the data set into a transformed data set according to the use of data and then transforms the transformed data set into a de-identification data set according to the identification categories.

Abstract: The application provides an ink cartridge chip, an ink cartridge and an operation method for giving response to printing work, and belongs to the technical field of printing. The ink cartridge chip comprises a storage module at least provided with a first ink quantity data block and a second ink quantity data block which share data with a printer and make the printer have one printing mode, wherein the first ink quantity data block is fixed in the printing mode, and the second ink quantity data block is variable in the printing mode. The ink cartridge comprises the ink cartridge chip. The application with a printing system is easy, convenient and fast, universality is high, printing at a high ink utilization rate is achieved in one printing mode, and the problems of resource waste, consumable loss, high cost and the like are solved.

Abstract: The application provides an ink cartridge chip, an ink cartridge and an operation method for giving response to printing work, and belongs to the technical field of printing. The ink cartridge chip comprises a storage module at least provided with a first ink quantity data block and a second ink quantity data block which share data with a printer and make the printer have one printing mode, wherein the first ink quantity data block is fixed in the printing mode, and the second ink quantity data block is variable in the printing mode. The ink cartridge comprises the ink cartridge chip. The application with a printing system is easy, convenient and fast, universality is high, printing at a high ink utilization rate is achieved in one printing mode, and the problems of resource waste, consumable loss, high cost and the like are solved.

Abstract: A memory device including a metallic layer shielding electromagnetic radiation and/or dissipating heat, and a method of making the memory device, are disclosed. The metallic layer is formed on a metallic layer transfer assembly. The metallic layer transfer assembly and the unencapsulated memory device are placed in a mold and encapsulated. During the encapsulation and curing of the molding compound, the metallic layer is transferred from the shield to the encapsulated memory device.

Abstract: A memory device including a metallic layer shielding electromagnetic radiation and/or dissipating heat, and a method of making the memory device, are disclosed. The metallic layer is formed on a metallic layer transfer assembly. The metallic layer transfer assembly and the unencapsulated memory device are placed in a mold and encapsulated. During the encapsulation and curing of the molding compound, the metallic layer is transferred from the shield to the encapsulated memory device.

Abstract: The present invention discloses an intravenous cytomegalovirus human immune globulin and a manufacturing method thereof, wherein the technical problem to be solved is to improve the purity, yield, and safety of the product. The intravenous cytomegalovirus human immune globulin of the present invention has a specific activity of no less than 2.5 PEI-U/mg, an anti-CMV titer of no less than 100 PEI-U/ml, a purity of greater than 98.2%, and a protein content of 51˜55 mg/ml.

Abstract: The yield of crops (such as rice, wheat, corn, potato, soybean and other like major crops) can be increased according to a method wherein plants capable of yielding such crops are treated at a specific stage in their growing period with brassinolide, i.e. (2.alpha.,3.alpha.,22R,23R)-tetrahydroxy-24S-methyl-B-homo-7-oxa-5.alpha.