Abstract: A vibrotactile device and method including an audio signal input unit, manual parameter input unit, microcontroller, vibration motor controller, and at least one vibration motor are provided. The microcontroller is coupled to the audio signal input unit and manual parameter input unit. The vibration motor controller is coupled to the microcontroller and the at least one vibration motor. At least one signal is generated by at least the audio signal input unit or the manual parameter input unit. A modulated signal is generated based, in part, on a filtered signal from the audio signal input unit and a vibration duty cycle is generated, based on a tempo value and a note value of the manual parameter input unit, to generate at least one driving parameter, respectively. The vibration motor controller drives the at least one vibration motor based on the at least one driving parameter.

Abstract: A portable electronic device includes a first body, a second body, a pivot assembly, and a protective assembly. The pivot assembly is pivoted to the first body and the second body and includes a shaft. The first body pivots relative to the second body via the shaft. The protective assembly is slidably disposed at periphery of the first body and the second body and includes at least one guide structure and at least one sliding structure. When the first body moves relative to the second body from a lock position to an open position, the protective assembly drives the guide structure and the sliding structure to slide along the periphery of the first body and the second body and drive the guide structure to be coaxially arranged with the shaft to allow the protective assembly to rotate with the first body relative to the second body.

Abstract: A laptop computer including a main body, a fan disposed in a receiving space of the main body, a keyboard assembly movably disposed on the main body, and a heat dissipation assembly movably disposed in the main body and linked with the keyboard assembly is provided. The main body has an air outlet and at least one first air inlet. In a process of the keyboard assembly gradually moving out of the main body, the keyboard assembly drives the heat dissipation assembly to move in the main body and form a second air inlet in the main body to communicate with the receiving space.

Abstract: A laptop computer including a main body, a fan disposed in a receiving space of the main body, a keyboard assembly movably disposed on the main body, and a heat dissipation assembly movably disposed in the main body and linked with the keyboard assembly is provided. The main body has an air outlet and at least one first air inlet. In a process of the keyboard assembly gradually moving out of the main body, the keyboard assembly drives the heat dissipation assembly to move in the main body and form a second air inlet in the main body to communicate with the receiving space.

Abstract: A portable electronic device includes a first body, a second body, a pivot assembly, and a protective assembly. The pivot assembly is pivoted to the first body and the second body and includes a shaft. The first body pivots relative to the second body via the shaft. The protective assembly is slidably disposed at periphery of the first body and the second body and includes at least one guide structure and at least one sliding structure. When the first body moves relative to the second body from a lock position to an open position, the protective assembly drives the guide structure and the sliding structure to slide along the periphery of the first body and the second body and drive the guide structure to be coaxially arranged with the shaft to allow the protective assembly to rotate with the first body relative to the second body.

Abstract: An ultrasonic wire bonding wedge with multiple bonding wire slots is provided. The wire bonding wedge includes a pillar fixing part for providing fixed connection to the bonding device. One end of the fixing part includes a wire bonding wedge nozzle, with feature that the tip of the nozzle including at least two bonding wire slots. The tip of nozzle of the wire bonding wedge includes at least two bonding wire slots, and is able to realize bonding operations between two or more bonding wires and the chips to improve bonding operation efficiency. When bonding operation is performed on a smaller bonding area, or two or more parallel bonding wires, the wire bonding wedge is able to perform a single bonding operation in a smaller bonding operation so as to reduce defective rate of the chips and ensure sufficient bonding strength of the bonding operation.