Abstract: A method of fabricating an integrated circuit includes placing a first set of conductive feature patterns on a first level, placing a second set of conductive feature patterns on a second level, placing a first set of via patterns between the second set of conductive feature patterns and the first set of conductive feature patterns, placing a third set of conductive feature patterns on a third level different from the first level and the second level, placing a second set of via patterns between the third set of conductive feature patterns and the second set of conductive feature patterns, and manufacturing the integrated circuit based on at least one of the above patterns of the integrated circuit.

Abstract: A fan assembly including a fan frame and an impeller. The fan frame includes a frame body and a first peripheral protruding plate and has an air inlet and an air outlet. The first peripheral protruding plate protrudes from a side of the frame body and forms an air channel together with the frame body. The first peripheral protruding plate is configured to reduce a noise made by the fan assembly. The air inlet is in fluid communication with the air outlet via the air channel. The impeller is rotatably disposed on the frame body and located in the air channel. The protruding height of the first peripheral protruding plate relative to the frame body ranges from 50 to 100 percent of an overall axial thickness of the impeller.

Abstract: A fan assembly including a fan frame and an impeller. The fan frame includes a frame body and a first peripheral protruding plate and has an air inlet and an air outlet. The first peripheral protruding plate protrudes from a side of the frame body and forms an air channel together with the frame body. The first peripheral protruding plate is configured to reduce a noise made by the fan assembly. The air inlet is in fluid communication with the air outlet via the air channel. The impeller is rotatably disposed on the frame body and located in the air channel. The protruding height of the first peripheral protruding plate relative to the frame body ranges from 50 to 100 percent of an overall axial thickness of the impeller.

Abstract: A heat dissipation device is provided, including a main body, a plurality of fins, a plurality of flat tubes, a pump head, and a fan. The pump head and the fan are disposed on opposite sides of the main body. The main body has three tanks arranged along the long axis of the main body. The flat tubes communicate with the tanks. The fins are disposed on the flat tubes.

Abstract: An electronic device including a chassis, a motherboard, an expansion card and a support. The motherboard is disposed in the chassis. The expansion card includes a circuit board assembly and a fixing plate. The circuit board assembly is fixed to a side of the fixing plate. The circuit board assembly is electrically connected to the motherboard and is fixed to the chassis via the fixing plate. A side of the support supports a side of the circuit board assembly that is located farthest from the fixing plate. A side of the support that is located farthest from the circuit board assembly is fixed to the motherboard and the chassis.

Abstract: An electronic device including a chassis, a motherboard, an expansion card and a support. The motherboard is disposed in the chassis. The expansion card includes a circuit board assembly and a fixing plate. The circuit board assembly is fixed to a side of the fixing plate. The circuit board assembly is electrically connected to the motherboard and is fixed to the chassis via the fixing plate. A side of the support supports a side of the circuit board assembly that is located farthest from the fixing plate. A side of the support that is located farthest from the circuit board assembly is fixed to the motherboard and the chassis.

Abstract: A fan device includes a frame including an axle base and a vane including a hub disposed on the axle base pivotally and blade assemblies disposed circumferentially on the sidewall surface. The hub includes a windward side and a sidewall surface. Each blade assemblies includes a first blade and a second blade protruded from the sidewall surface radially. The second blade is farther away than the first blade from the windward side. The angle of between an extending surface of a second side edge of the second blade extending and the windward side is greater than another angle of between an extending surface of a first side edge of the first blade extending and the windward side. The gap between the partial second side edge and the windward side is less than another gap between the first side edge and the windward side.

Abstract: A heat dissipation device for being in thermal contact with a heat source includes multiple heat dissipation fins, a heat pipe and a fan. Each of the heat dissipation fins includes a plate and an air guiding body. The plate has a thermal contact side used for being in thermal contact with the heat source. An acute angle is formed between an extension side of the air guiding body and the thermal contact side. The heat pipe penetrates through the plates. The fan used for forming an air current is installed at a side of the heat dissipation fin opposite to the thermal contact side. The air guiding body and the heat pipe are disposed in a flowing path of the air current. Thereby, the air current is guided toward the heat pipe and the amount of air flowing through the heat pipe is increased.

Abstract: A fan device includes a frame including an axle base and a vane including a hub disposed on the axle base pivotally and blade assemblies disposed circumferentially on the sidewall surface. The hub includes a windward side and a sidewall surface. Each blade assemblies includes a first blade and a second blade protruded from the sidewall surface radially. The second blade is farther away than the first blade from the windward side. The angle of between an extending surface of a second side edge of the second blade extending and the windward side is greater than another angle of between an extending surface of a first side edge of the first blade extending and the windward side. The gap between the partial second side edge and the windward side is less than another gap between the first side edge and the windward side.

Abstract: A fixing mechanism for fixing a thermal module on a base includes a U-shaped buckling component disposed on a side of the base for buckling a thermal fin and a heat conducting block of the thermal module, and a fixing component disposed on the other side of the base and connected to the U-shaped buckling component for clipping the base with the U-shaped buckling component.

Abstract: A fixing mechanism for fixing a thermal module on a base includes a U-shaped buckling component disposed on a side of the base for buckling a thermal fin and a heat conducting block of the thermal module, and a fixing component disposed on the other side of the base and connected to the U-shaped buckling component for clipping the base with the U-shaped buckling component.

Abstract: A circuit board includes a substrate forming an opening, a first thermal module disposed on a first side of the substrate, a second thermal module disposed on a second side opposite to the first side of the substrate m, and a heat pipe installed on the substrate and passing through the opening. A first end of the heat pipe is connected to the first thermal module, and a second end of the heat pipe is connected to the second thermal module.

Abstract: A circuit board includes a substrate forming an opening, a first thermal module disposed on a first side of the substrate, a second thermal module disposed on a second side opposite to the first side of the substrate m, and a heat pipe installed on the substrate and passing through the opening. A first end of the heat pipe is connected to the first thermal module, and a second end of the heat pipe is connected to the second thermal module.

Abstract: The present invention provides a device and a method for monitoring a component arranged inside a computer. The monitoring device includes: a detection unit, an I2C bus, a display panel, a processor, and a regulation unit. The detection unit is used for detecting and acquiring the information of operation statuses of components inside the computer. The I2C bus coupled to the detection unit is used for transmitting the forgoing detected information. The display panel arrange at a shell of the computer is used for displaying the foregoing information. The processor will receive the information from the I2C bus and thereby display the received information on the display panel.

Abstract: A heat dissipation method for microprocessors to dissipate heat for a microprocessor of low power consumption includes a fan directly mounting on the microprocessor. The fan directs external cold air to the microprocessor to perform heat exchange and to achieve heat dissipation object.

Abstract: The present invention provides a device and a method for monitoring a component arranged inside a computer. The monitoring device comprises: a detection unit, an I2C bus, a display panel, a processor, and a regulation unit. The detection unit is used for detecting and acquiring the information of operation statuses of components inside the computer. The I2C bus coupled to the detection unit is used for transmitting the forgoing detected information. The display panel arrange at a shell of the computer is used for displaying the foregoing information. The processor will receive the information from the I2C bus and thereby display the received information on the display panel.