Abstract: A wafer processing system and a rework method thereof are provided. An image capture device captures an image of a wafer to generate a captured image. A control device detects a defect pattern in the captured image, calculates a target removal thickness according to distribution of contrast values of the defect pattern, and controls a processing device to perform processing on the wafer according to the target removal thickness.

Abstract: An environmental protection water-proof safety honeycomb stacking cardboard is proposed. The honeycomb stacking cardboard is formed by a flat plate and a plurality of legs below the flat plate. The flat plate, upper leg and lower leg are made by a plurality of honeycomb plates. Top plates processed by water-proof procedure and gluing procedure are adhered on upper sides of the flat plate and lower legs; and bottom plates processed by water-proof procedure and gluing procedure and being adhered on lower sides of the flat plate and legs. Each leg is a long post and includes an upper leg and a lower leg. A periphery of the flat plate are covered by a water-proof kraft paper edge protecting cover with each side having an L shape. The exposed outside of each leg is enclosed by a water-proof kraft paper protecting envelope.

Abstract: A cardboard manufacturing process comprises the steps of forming a waterproof honeycomb structural member, forming a first member by adhering a top and a bottom layers of waterproof kraft paper on the honeycomb structural member, laminating a plurality of first members to form a second member, cutting and punching the second member to form a third member consisting of a top layer and a plurality of rib members extended downward from the top layer, adhering a waterproof frame member formed of kraft paper around either half periphery of the top layer, and adhering a plurality of waterproof groove members formed of kraft paper to the rib members. This cardboard has an enhanced structural strength.