Patents by Inventor Shang-Wei Yeh

Shang-Wei Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240126327
    Abstract: The present disclosure provides an electronic wearable device. The electronic wearable device includes a first module having a first contact and a second module having a second contact. The first contact is configured to keep electrical connection with the second contact in moving with respect to each other during a wearing period.
    Type: Application
    Filed: October 14, 2022
    Publication date: April 18, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chao Wei LIU, Wei-Hao CHANG, Yung-I YEH, Jen-Chieh KAO, Tun-Ching PI, Ming-Hung CHEN, Hui-Ping JIAN, Shang-Lin WU
  • Publication number: 20220399301
    Abstract: A semiconductor package structure includes a conductive structure, at least one semiconductor element, an encapsulant, a redistribution structure and a plurality of bonding wires. The semiconductor element is disposed on and electrically connected to the conductive structure. The encapsulant is disposed on the conductive structure to cover the semiconductor element. The redistribution structure is disposed on the encapsulant, and includes a redistribution layer. The bonding wires electrically connect the redistribution structure and the conductive structure.
    Type: Application
    Filed: August 22, 2022
    Publication date: December 15, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chien-Wei CHANG, Shang-Wei YEH, Chung-Hsi WU, Min Lung HUANG
  • Patent number: 11424212
    Abstract: A semiconductor package structure includes a conductive structure, at least one semiconductor element, an encapsulant, a redistribution structure and a plurality of bonding wires. The semiconductor element is disposed on and electrically connected to the conductive structure. The encapsulant is disposed on the conductive structure to cover the semiconductor element. The redistribution structure is disposed on the encapsulant, and includes a redistribution layer. The bonding wires electrically connect the redistribution structure and the conductive structure.
    Type: Grant
    Filed: July 17, 2019
    Date of Patent: August 23, 2022
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chien-Wei Chang, Shang-Wei Yeh, Chung-Hsi Wu, Min Lung Huang
  • Publication number: 20210020597
    Abstract: A semiconductor package structure includes a conductive structure, at least one semiconductor element, an encapsulant, a redistribution structure and a plurality of bonding wires. The semiconductor element is disposed on and electrically connected to the conductive structure. The encapsulant is disposed on the conductive structure to cover the semiconductor element. The redistribution structure is disposed on the encapsulant, and includes a redistribution layer. The bonding wires electrically connect the redistribution structure and the conductive structure.
    Type: Application
    Filed: July 17, 2019
    Publication date: January 21, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chien-Wei CHANG, Shang-Wei YEH, Chung-Hsi WU, Min Lung HUANG
  • Patent number: 9452315
    Abstract: A treadmill comprises a base, a first frame, a second frame, and a driving assembly. The base allows a user to walk or run in place. The first frame and the second frame pivotally couple with a front portion and a rear portion of the base, respectively. The driving assembly moveably couples with the first frame and the second frame. The moving of the driving assembly between the first frame and the second frame will result in an elevation of the front portion or the rear portion.
    Type: Grant
    Filed: March 31, 2015
    Date of Patent: September 27, 2016
    Assignee: Dyaco International, Inc.
    Inventors: Brian Murray, Sheng-Chih Hsieh, Shang-Wei Yeh
  • Publication number: 20160256734
    Abstract: A treadmill comprises a base, a first frame, a second frame, and a driving assembly. The base allows a user to walk or run in place. The first frame and the second frame pivotally couple with a front portion and a rear portion of the base, respectively. The driving assembly moveably couples with the first frame and the second frame. The moving of the driving assembly between the first frame and the second frame will result in an elevation of the front portion or the rear portion.
    Type: Application
    Filed: March 31, 2015
    Publication date: September 8, 2016
    Inventors: Brian Murray, SHENG-CHIH HSIEH, SHANG-WEI YEH
  • Patent number: 8025455
    Abstract: A fixing device for an extension tube of an exercise includes an outer tube and an inner tube received in the outer tube, wherein the extension tube extends through the inner tube. A quick release device laterally mounted to an outer periphery of the outer tube. The quick release device extends through the outer tube and the inner tube to quickly fixing/releasing the extension tube when adjusting the stretching distance of the extension tube.
    Type: Grant
    Filed: September 24, 2009
    Date of Patent: September 27, 2011
    Inventors: Hsuan Fu Huang, Tsung Chi Chang, Shang-Wei Yeh
  • Publication number: 20110070021
    Abstract: A fixing device for an extension tube of an exercise includes an outer tube and an inner tube received in the outer tube, wherein the extension tube extends through the inner tube. A quick release device laterally mounted to an outer periphery of the outer tube. The quick release device extends through the outer tube and the inner tube to quickly fixing/releasing the extension tube when adjusting the stretching distance of the extension tube.
    Type: Application
    Filed: September 24, 2009
    Publication date: March 24, 2011
    Inventors: Hsuan Fu Huang, Tsung Chi Chang, Shang-Wei Yeh