Abstract: In order to automatically measure a signal skew between a first test signal and a second test signal by using an oscilloscope, a method is provided by the present invention. The method includes: capturing a band center of the first test signal; capturing a first sampling point and a second sampling point of the second test signal; comparing a voltage difference between the first sampling point and the second sampling point of the second test signal with a threshold value so as to decide and capture a rising band center and a falling band center of the second test signal. By using the invented method, the signal skew between the first test signal and the second test signal can be calculated according to the band center of the first test signal, the rising band center and the falling band center of the second test signal.

Abstract: A heat dissipation device is used for dissipating heat generated from a plurality of memory modules inserted on a motherboard. The memory modules are parallel to each other. Two hooks are disposed at two ends of the slot of each memory connector, respectively, to clamp the memory module corresponding to the slot when the memory module is inserted in the slot. The heat dissipation device includes two fixing frames, a connection frame, and two fans. The two fixing frames are disposed at two opposite ends of the memory connectors and fastened with the hooks at two ends of each slot, respectively. Additionally, the connection frame is connected between the two fixing frames. The two fans are disposed on the two fixing frames, respectively. An air inlet of one of the two fans faces an air outlet of the other one.

Abstract: A heat dissipation device is used for dissipating heat generated from a plurality of memory modules inserted on a motherboard. The memory modules are parallel to each other. Two hooks are disposed at two ends of the slot of each memory connector, respectively, to clamp the memory module corresponding to the slot when the memory module is inserted in the slot. The heat dissipation device includes two fixing frames, a connection frame, and two fans. The two fixing frames are disposed at two opposite ends of the memory connectors and fastened with the hooks at two ends of each slot, respectively. Additionally, the connection frame is connected between the two fixing frames. The two fans are disposed on the two fixing frames, respectively. An air inlet of one of the two fans faces an air outlet of the other one.

Abstract: In order to automatically measure a signal skew between a first test signal and a second test signal by using an oscilloscope, a method is provided by the present invention. The method includes: capturing a band center of the first test signal; capturing a first sampling point and a second sampling point of the second test signal; comparing a voltage difference between the first sampling point and the second sampling point of the second test signal with a threshold value so as to decide and capture a rising band center and a falling band center of the second test signal. By using the invented method, the signal skew between the first test signal and the second test signal can be calculated according to the band center of the first test signal, the rising band center and the falling band center of the second test signal.

Abstract: An automatic jitter measurement method for an oscilloscope is provided. The method includes: establishing a database in a data processing unit, in which the step of establishing the database includes establishing at least a horizontal delay parameter and a horizontal scale parameter; enabling the oscilloscope for fetching a test signal, according to the horizontal delay parameter and the horizontal scale parameter; enabling a signal accumulation function of the oscilloscope for obtaining a signal accumulation maximum position value and a signal accumulation minimum position value of the test signal; and adjusting a display position of the test signal on the oscilloscope to obtain a jitter value of the test signal according to the signal accumulation maximum position value and the signal accumulation minimum position value.