Abstract: An ROF communication remote machine and an ROF system are disclosed. The machine comprises a first packaging module and a second packaging module. The first packaging module comprises a first branch and a second branch. The first branch is used for converting a downlink optical signal, and sending the downlink electrical signal to the second packaging module. The second branch receives the downlink electrical signal, converts the downlink electrical signal into a downlink optical signal, sends the downlink optical signal to the local machine, receives an uplink electrical signal, and sends the uplink electrical signal to the local machine. The second packaging module is used for amplifying the power of the downlink electrical signal, filtering the downlink electrical signal, then feeding back the downlink electrical signal to another component, receiving the uplink electrical signal, and sending the uplink electrical signal to the second port.

Abstract: A millimeter-wave active antenna unit and an interconnection structure between PCBs is provided. The interconnection structure between PCBs comprises a mainboard and an AIP antenna module. The mainboard is a first multilayer PCB on which a signal transmission line and a first pad electrically connected to the signal transmission line are provided. The AIP antenna module is a second multilayer PCB on which a second pad, an impedance matching transformation branch, an impedance line and a signal processing circuit are provided. The mainboard and the AIP antenna module are interconnected by directly welding multiple PCBs.

Abstract: An ROF communication remote machine and an ROF system are disclosed. The machine comprises a first packaging module and a second packaging module. The first packaging module comprises a first branch and a second branch The first branch is used for converting a downlink optical signal, and sending the downlink electrical signal to the second packaging module. The second branch receives the downlink electrical signal, converts the downlink electrical signal into a downlink optical signal, sends the downlink optical signal to the local machine, receives an uplink electrical signal, and sends the uplink electrical signal to the local machine. The second packaging module is used for amplifying the power of the downlink electrical signal, filtering the downlink electrical signal, then feeding back the downlink electrical signal to another component, receiving the uplink electrical signal, and sending the uplink electrical signal to the second port.

Abstract: A millimeter-wave active antenna unit and an interconnection structure between PCBs is provided. The interconnection structure between PCBs comprises a mainboard and an AIP antenna module. The mainboard is a first multilayer PCB on which a signal transmission line and a first pad electrically connected to the signal transmission line are provided. The AIP antenna module is a second multilayer PCB on which a second pad, an impedance matching transformation branch, an impedance line and a signal processing circuit are provided. The mainboard and the AIP antenna module are interconnected by directly welding multiple PCBs.