Patents by Inventor ShangShi Wu

ShangShi Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7513042
    Abstract: A fluid injector and method of manufacturing the same. The fluid injector comprises a base, a first through hole, a bubble generator, a passivation layer, and a metal layer. The base includes a chamber and a surface. The first through hole communicates with the chamber, and is disposed in the base. The bubble generator is disposed on the surface near the first through hole, and is located outside the chamber. The passivation layer is disposed on the surface. The metal layer defines a second through hole, and is disposed on the passivation layer outside the chamber. The second through hole communicates with the first through hole.
    Type: Grant
    Filed: March 9, 2006
    Date of Patent: April 7, 2009
    Assignee: BenQ Corporation
    Inventors: Hung-Sheng Hu, Wei-Lin Chen, In-Yao Lee, Tsung-Ping Hsu, Chung-Cheng Chou, ShangShi Wu
  • Publication number: 20060284932
    Abstract: A fluid injector and method of manufacturing the same. The fluid injector comprises a base, a first through hole, a bubble generator, a passivation layer, and a metal layer. The base includes a chamber and a surface. The first through hole communicates with the chamber, and is disposed in the base. The bubble generator is disposed on the surface near the first through hole, and is located outside the chamber. The passivation layer is disposed on the surface. The metal layer defines a second through hole, and is disposed on the passivation layer outside the chamber. The second through hole communicates with the first through hole.
    Type: Application
    Filed: March 9, 2006
    Publication date: December 21, 2006
    Inventors: Hung-Sheng Hu, Wei-Lin Chen, In-Yao Lee, Tsung-Ping Hsu, Chung-Cheng Chou, ShangShi Wu
  • Patent number: 7040740
    Abstract: A fluid injector and method of manufacturing the same. The fluid injector includes a base, a first through hole, a bubble generator, a passivation layer, and a metal layer. The base includes a chamber and a surface. The first through hole communicates with the chamber, and is disposed in the base. The bubble generator is disposed on the surface near the first through hole, and is located outside the chamber. The passivation layer is disposed on the surface. The metal layer defines a second through hole, and is disposed on the passivation layer outside the chamber. The second through hole communicates with the first through hole.
    Type: Grant
    Filed: July 11, 2003
    Date of Patent: May 9, 2006
    Assignee: Benq Corporation
    Inventors: Hung-Sheng Hu, Wei-Lin Chen, In-Yao Lee, Tsung-Ping Hsu, Chung-Cheng Chou, ShangShi Wu
  • Publication number: 20040183865
    Abstract: A fluid injector and method of manufacturing the same. The fluid injector comprises a base, a first through hole, a bubble generator, a passivation layer, and a metal layer. The base includes a chamber and a surface. The first through hole communicates with the chamber, and is disposed in the base. The bubble generator is disposed on the surface near the first through hole, and is located outside the chamber. The passivation layer is disposed on the surface. The metal layer defines a second through hole, and is disposed on the passivation layer outside the chamber. The second through hole communicates with the first through hole.
    Type: Application
    Filed: July 11, 2003
    Publication date: September 23, 2004
    Applicant: BENO CORPORATION
    Inventors: Hung-Sheng Hu, Wei-Lin Chen, In-Yao Lee, Tsung-Ping Hsu, Chung-Cheng Chou, ShangShi Wu