Patents by Inventor Shankar Ganapathysubranian

Shankar Ganapathysubranian has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100078806
    Abstract: A microelectronic package is provided. The microelectronic package includes a semiconductor substrate and a die having a top surface and a bottom surface, wherein the bottom surface of the die is coupled to the semiconductor substrate. The microelectronic package also includes a nanomaterial layer disposed on the top surface of the die.
    Type: Application
    Filed: September 30, 2008
    Publication date: April 1, 2010
    Inventors: Nirupama Chakrapani, Vijay S. Wakharkar, Janet Feng, Nisha Ananthakrishnan, Shankar Ganapathysubranian, Gregory S. Constable