Abstract: A substrate for an LED assembly can have a plurality of cups formed therein. At least one cup can be formed within another cup. The cups can be co-axial with respect to one another, for example. A machined surface of the substrate can enhance reflectivity of the LED assembly. A transparent and/or non-global solder mask can enhance reflectivity of the LED assembly. A transparent ring can enhance reflectivity of the LED assembly. By enhancing reflectivity of the LED assembly, the brightness of the LED assembly can be increased. Brighter LED assemblies can be used in applications such as flashlights, displays, and general illumination.

Abstract: A substrate for an LED assembly can have a plurality of cups formed therein. At least one cup can be formed within another cup. The cups can be co-axial with respect to one another, for example. A machined surface of the substrate can enhance reflectivity of the LED assembly. A transparent and/or non-global solder mask can enhance reflectivity of the LED assembly. A transparent ring can enhance reflectivity of the LED assembly. By enhancing reflectivity of the LED assembly, the brightness of the LED assembly can be increased. Brighter LED assemblies can be used in applications such as flashlights, displays, and general illumination.

Abstract: A substrate for an LED assembly can have a plurality of cups formed therein. At least one cup can be formed within another cup. The cups can be co-axial with respect to one another, for example. A machined surface of the substrate can enhance reflectivity of the LED assembly. A transparent and/or non-global solder mask can enhance reflectivity of the LED assembly. A transparent ring can enhance reflectivity of the LED assembly. By enhancing reflectivity of the LED assembly, the brightness of the LED assembly can be increased. Brighter LED assemblies can be used in applications such as flashlights, displays, and general illumination.

Abstract: A substrate for an LED assembly can have a plurality of cups formed therein. At least one cup can be formed within another cup. The cups can be co-axial with respect to one another, for example. A machined surface of the substrate can enhance reflectivity of the LED assembly. A transparent and/or non-global solder mask can enhance reflectivity of the LED assembly. A transparent ring can enhance reflectivity of the LED assembly. By enhancing reflectivity of the LED assembly, the brightness of the LED assembly can be increased. Brighter LED assemblies can be used in applications such as flashlights, displays, and general illumination.

Abstract: A connector system employs a first connector moiety on an insertable miniaturized form factor card. A mobile information device (MID) has a printed circuit board having a second connector moiety and a frame mounted on the MID PCB for receiving the card. A slot is present in the frame for engagement of an elastomeric connector element in alignment with the second connector moiety. The card is positioned by the frame for alignment of the first connector moiety with the elastomeric connector element. The contact surface of the first connector moiety, as an example, multiple contact pads on the card, is extended, accomplished in the example by a matching plurality of individual metallic conductor extensions affixed to the plurality of contact pads using surface mount technology, and a cover attached to the frame is provided for urging the card into the frame and urging the extended contact surface to compress the elastomeric connector for positive contact.

Abstract: A connector system for a miniaturized form factor card allows a communications system for mobile information devices having an applications processor and user interface components. A receiving frame is provided in the mobile information device for an insertable miniaturized form factor card incorporating means for RF transmission and reception and a wireless modem. A connector moiety on the card is received in a mating moiety in the receiving frame. The applications processor and the user interface components in the mobile information device are interconnected to digital functions of the wireless modem and means for RF transmission and reception through the connector.

Abstract: A connector system for a miniaturized form factor card allows a communications system for mobile information devices having an applications processor and user interface components. A receiving frame is provided in the mobile information device for an insertable miniaturized form factor card incorporating means for RF transmission and reception and a wireless modem. A connector moiety on the card is received in a mating moiety in the receiving frame. The applications processor and the user interface components in the mobile information device are interconnected to digital functions of the wireless modem and means for RF transmission and reception through the connector.

Abstract: A dual memory architecture for software partition on mobile terminals incorporates a mobile information device (MID) handset having a first memory; a plurality of host peripherals; and a card interface. A miniaturized form factor card (mobile card) incorporating wireless communications components is received in the card interface and includes a second memory including default host peripheral drivers. The interface provides operable connection from the MID memory to the mobile card. In certain embodiments, the first memory includes device specific host peripheral drivers, which are uploaded to the mobile card second memory upon insertion of the mobile card in the card interface.

Abstract: A reduced pin count connection system for an insertable operational systems card having a plurality of input and output signals to a host device having operational circuits responsive to the input and output signals of the card includes a master serial data link in the card for communicating at least a portion of the plurality of input and output signals of the card. A slave serial data link is operably interconnected to the master serial data link through a connector having a second plurality contacts less than the plurality of input and output signals and communicates the input and output signals to the operational circuits in the host device.

Abstract: A mobile information device (MID) incorporates a handset having a primary applications processor, a primary display, a primary input keyboard, a second input keypad, a second display having reduced functionality from the primary display and a card interface. A miniaturized form factor card is received in the card interface which includes a second processor and wireless communications components. The interface provides operable connection from the second processor to the second input keypad and second display. During operations of simple voice call or comparable functions, the primary applications processor, primary display and primary keyboard remain in sleep mode to reduce power consumption for the MID with the call functionality provided by the second processor, second keyboard and second display. During operations requiring higher level functionality, the primary applications processor, primary display and primary keyboard are awakened to provide the necessary capability.

Abstract: A reduced pin count connection system for an insertable operational systems card having a plurality of input and output signals to a host device having operational circuits responsive to the input and output signals of the card includes a master serial data link in the card for communicating at least a portion of the plurality of input and output signals of the card. A slave serial data link is operably interconnected to the master serial data link through a connector having a second plurality contacts less than the plurality of input and output signals and communicates the input and output signals to the operational circuits in the host device.

Abstract: A connector system for a miniaturized form factor card allows a communications system for mobile information devices having an applications processor and user interface components. A receiving frame is provided in the mobile information device for an insertable miniaturized form factor card incorporating means for RF transmission and reception and a wireless modem. A connector moiety on the card is received in a mating moiety in the receiving frame. The miniaturized form factor card also incorporates an array of solder pads for alternative permanent engagement of a mating array of solder pads on a printed circuit board in an alternative mobile information device. The applications processor and the user interface components in the mobile information device are interconnected to digital functions of the wireless modem and means for RF transmission and reception through the connector or, alternatively, the solder pad array.

Abstract: A heat dissipation system for a miniaturized form factor card allows a communications system for mobile information devices contained in the card to operate with high heat loads by employing a high conductivity pad on the printed circuit board of the mobile information device which contacts the case of the miniaturized form factor card. Additionally, heat dissipation plugs are integrated into the edge of the PCB with emitting surfaces adjacent radiation holes in the case of the mobile information device adjacent the PCB. Heat convection channels through layers of the PCB allow transfer of heat from the pad to other conductive layers in the PCB. High thermal conductivity packing in the miniaturized form factor card conducts heat from the internal components to the case of the card in contact with the high conductivity. Placement of high heat generation components within the card case adjacent the contact interface with the high conductivity pad is also employed for maximum heat dissipation.

Abstract: A device for network routing control of voice/data traffic for a mobile phone having a primary communication network incorporates a short range radio interface communicating with a compatible radio interface in the mobile phone and a wireless communications interface communicating voice/data traffic received through the short range radio interface to an alternative wireless network and traffic received from the alternative wireless network to the short range radio interface. The device is packaged with a media player receiving content over the alternative wireless network and storage for the media content and mobile phone data.

Abstract: A connector system employs a first connector moiety on an insertable miniaturized form factor card. A mobile information device (MID) has a printed circuit board having a second connector moiety with a frame mounted on the MID PCB for receiving the card and having a slot for engagement of an elastomeric connector element in alignment with the second connector moiety. The card is positioned by the frame for alignment of the first connector moiety with the elastomeric connector element. The elastomeric connector element is a single integrated element. The first connector moiety incorporates a plurality of contact pads on the card and the second connector moiety incorporates a like plurality of contact pads on the MID PCB. The contact pads include at least a first set of RF pads and the signals on the first and second connector moieties are arranged for cross talk shielding in the elastomeric connector.

Abstract: A heat dissipation system for a miniaturized form factor card allows a communications system for mobile information devices contained in the card to operate with high heat loads by employing a high conductivity pad on the printed circuit board of the mobile information device which contacts the case of the miniaturized form factor card. Additionally, heat dissipation plugs are integrated into the edge of the PCB with emitting surfaces adjacent radiation holes in the case of the mobile information device adjacent the PCB. Heat convection channels through layers of the PCB allow transfer of heat from the pad to other conductive layers in the PCB. High thermal conductivity packing in the miniaturized form factor card conducts heat from the internal components to the case of the card in contact with the high conductivity. Placement of high heat generation components within the card case adjacent the contact interface with the high conductivity pad is also employed for maximum heat dissipation.

Abstract: A connector system for a miniaturized form factor card allows a communications system for mobile information devices having an applications processor and user interface components. A receiving frame is provided in the mobile information device for an insertable miniaturized form factor card incorporating means for RF transmission and reception and a wireless modem. A connector moiety on the card is received in a mating moiety in the receiving frame. The applications processor and the user interface components in the mobile information device are interconnected to digital functions of the wireless modem and means for RF transmission and reception through the connector.

Abstract: A connector system for a miniaturized form factor card allows a communications system for mobile information devices having an applications processor and user interface components. A receiving frame is provided in the mobile information device for an insertable miniaturized form factor card incorporating means for RF transmission and reception and a wireless modem. A connector moiety on the card is received in a mating moiety in the receiving frame. The applications processor and the user interface components in the mobile information device are interconnected to digital functions of the wireless modem and means for RF transmission and reception through the connector.

Abstract: A miniaturized form factor card provides a communications system for mobile information devices having an applications processor and user interface components. A receiving frame is provided in the mobile information device and an insertable miniaturized form factor card incorporating means for RF transmission and reception and a wireless modem and having an indexing connector which is received in a mating moiety in the receiving frame. The applications processor and the user interface components in the mobile information device are interconnected to digital functions of the wireless modem and means for RF transmission and reception through the connector. Additionally, the miniaturized form factor card further includes a power management function interfacing with the applications processor and user interface components through the connector.

Abstract: A WiFi voice communication system incorporates a plurality of access points (AP) interconnected to a WiFi network. A handset for voice communication through the AP is provided with two sets of medium access control (MAC) components, each of said MAC having the capability to set up a voice or data call with an AP individually and simultaneously, and means for transferring a voice call from one AP to another by transferring from one MAC to another.