Abstract: The present disclosure provides a cooling system, including an air-cooling device and a water-cooling device. The air-cooling device includes a first fan, an evaporator, a first condenser, and a second fan. The first fan is arranged in a first cooling room and configured to blow a hot air inside a rack into a first cooling room. The evaporator is arranged in the first cooling room. The first condenser is arranged in a second cooling room. The second fan is arranged in the second cooling room and configured to blow an outside air into the second cooling room. The water-cooling device includes a radiator. The radiator is arranged in the second cooling room and configured to receive a hot liquid from an electronic device in the rack through a third pipeline and transmit a cold liquid to the electronic device through a fourth pipeline.

Abstract: Methods of cutting gate structures and fins, and structures formed thereby, are described. In an embodiment, a substrate includes first and second fins and an isolation region. The first and second fins extend longitudinally parallel, with the isolation region disposed therebetween. A gate structure includes a conformal gate dielectric over the first fin and a gate electrode over the conformal gate dielectric. A first insulating fill structure abuts the gate structure and extends vertically from a level of an upper surface of the gate structure to at least a surface of the isolation region. No portion of the conformal gate dielectric extends vertically between the first insulating fill structure and the gate electrode. A second insulating fill structure abuts the first insulating fill structure and an end sidewall of the second fin. The first insulating fill structure is disposed laterally between the gate structure and the second insulating fill structure.

Abstract: A computer system (such as a controller) that selects channels and/or channel widths for use during communication in a shared band of frequencies is described. During operation, the computer system may receive, associated with access points in a region (such as a zone), information specifying unavailable channels associated with the shared band of frequencies, where the unavailable channels are currently used by the access points. For example, the information may be included in access-point status reports from the access points. Then, based at least in part on the unavailable channels, the computer system may determine the channels and/or the channel widths for use by the access points during communication in the shared band of frequencies in the region. Next, the computer system may provide, addressed to the access points, second information specifying the determined channels and/or the channel width.

Abstract: The disclosure relates to methods, compositions, and combinations for the treatment of cancer. Specifically, the disclosure relates to methods comprising administering to a subject in need thereof at least one of an anti-CTLA-4 antibody or an antigen-binding fragment and an anti-PD-L1 antibody or an antigen-binding fragment thereof. The disclosure also relates to combinations comprising at least one of an anti-CTLA-4 antibody or an antigen-binding fragment and an anti-PD-L1 antibody or an antigen-binding fragment thereof.

Abstract: The disclosure relates to methods and compositions for the treatment of cancer. Specifically, the disclosure relates to methods comprising administering to a subject in need thereof for the treatment of cancer a NKG2A neutralizing agent, a PD-1 neutralizing agent, a chemotherapy agent, and a VEGF neutralizing agent or an EGFR neutralizing agent.

Abstract: The disclosure relates to methods, compositions, and combinations for the treatment of cancer. Specifically, the disclosure relates to methods comprising administering to a subject in need thereof at least one of an anti-CTLA-4 antibody or an antigen-binding fragment and an anti-PD-L1 antibody or an antigen-binding fragment thereof. The disclosure also relates to combinations comprising at least one of an anti-CTLA-4 antibody or an antigen-binding fragment and an anti-PD-L1 antibody or an antigen-binding fragment thereof.

Abstract: The invention provides for a human antibody that binds to human vascular endothelial growth factor receptor 2, preferably ramucirumab, for the treatment of hepatocellular carcinoma (HCC) in patients having levels of alpha-fetoprotein (AFP) of 1.5×ULN (Upper Limit of Normal) or greater, and as a predictive method for the treatment of HCC in patients having AFP levels of 1.5×ULN or greater.

Abstract: The invention provides for a human antibody that binds to human vascular endothelial growth factor receptor 2, preferably ramucirumab, for the treatment of hepatocellular carcinoma in patients having levels of alpha-fetoprotein (AFP) of 1.5 ULN or greater, and as a predictive method for the treatment of HCC in patients having AFP levels of 1.5×ULN or greater.

Abstract: A method for electrostatic prevention in an electrostatic discharge protection area applicable to an electrostatic conducting device including a main body, an alert unit, a sensing unit and a grounding unit is disclosed. The electrostatic conducting device is used for sensing an external signal and externally coupling to a ground line, and the main body is used for being worn by a user. The sensing unit is coupled to the alert unit for sensing the external signal so as to enable the alert unit. The grounding unit and the alert unit form a loop when being in contact with the skin of the user and coupled to the ground line. The loop is opened when the ground line is coupled to the grounding unit, and the alert unit is thus disabled. Effective ESD protection is achieved.

Abstract: A stencil for printing solder paste on a printed circuit board improves an assembly process, cuts production costs, and saves storage space. The stencil is coupled to a fixing frame having a plurality of fixing portions and a motor unit. The motor unit generates a plurality of pulling forces. The stencil includes a solder paste printing region and a plurality of fixing regions. Vias are disposed in the solder paste printing region. The directions of the pulling forces are coplanar with the solder paste printing region. The edge of the solder paste printing region extends outward to define the fixing regions. The fixing regions are movably fixed to the fixing portions and bear the pulling forces to flatten the solder paste printing region of the stencil.

Abstract: A device for managing solder paste includes a storage room, a warm up room, a preparing room and a central control device, wherein the storage room, the warm up room and the preparing room respectively have a transportation unit for delivering a solder paste can. There are reading devices disposed respectively at an inlet/outlet of the above rooms for reading information of the solder paste can when the solder paste can passes thereby, and the central control device updates storage information for the solder paste cans. The central control device may access production information of a production line from a production managing system, and thus analyze the mold number and amount of solder paste cans, receive the solder paste cans based on a first-in, first-out manner, and deliver the solder paste cans to the warm up room for the warm up treatment.

Abstract: A system and a method for managing solder paste are disclosed. The storage information of solder paste cans stored in a storage room is established, production information is accessed from a production managing system for analyzing an amount of solder paste cans in need, the solder paste cans to be used are inquired and obtained from the storage room, and the solder paste cans are delivered to the warm up room for warm up treatment. The solder paste is thus systematically managed, such that the efficacy of management is improved and labor cost is reduced.

Abstract: A connector for connecting to a printed circuit board, including a connector body and a plurality of lead pins extending from the connector body and soldered onto the printed circuit board. The lead pins extend from a region including a bottom surface of the connector body and a side surface adjacent to the bottom surface, thereby overcoming the drawbacks as encountered in prior techniques including missing and poor soldering during SMT soldering process or the connector falling off from the soldering point in use.

Abstract: A fixing frame and an assembled fixing device printing solder paste on a printed circuit board improve an assembly process, cut production costs, and save storage space. The fixing frame has a plurality of fixing portions and a motor unit. The fixing portions are connected to each other to define a hollowed-out planar region. The motor unit generates a plurality of pulling forces by means of mechanical transmission. The assembled fixing device includes a fixing frame and a stencil. The stencil has a solder paste printing region and a plurality of fixing regions. The edge of the solder paste printing region extends outward to define the fixing regions. The fixing regions are movably fixed to the fixing portions and bear the pulling forces. The solder paste printing region lies within the hollowed-out planar region. The directions of the pulling forces are coplanar with the solder paste printing region.