Abstract: Provided are a nickel-based superalloy and a manufacturing method therefor, and a component and an application. The nickel-based superalloy is prepared from the following raw materials by means of 3D printing. The raw materials include (mass percent): less than or equal to 0.3% of C, less than 5% of Co, 13-15% of W, 20-24% of Cr, 1-3% of Mo, 0.2-0.5% of Al, less than 0.1% of Ti, less than 3% of Fe, less than 0.015% of B, 0.001-0.004% of La, 0.01-0.2% of Mn, and 0.02-0.2% of Si, with the balance being Ni. Average carbide size in a tissue is 150-200 nm, and carbide size distribution is 50 nm to 4 ?m.

Abstract: A SnBiSb series low-temperature lead-free solder and a preparation method thereof, which belongs to the technical field of low-temperature soldering. The lead-free solder includes by weight the following composition: 32.8-56.5% of Bi, 0.7-2.2% of Sb, with the remainder being Sn, wherein the weight percentages of Bi and Sb satisfy a relationship of b=0.006a2?0.672a+19.61+c, wherein the symbol a represents the weight percentage of Bi, the symbol b represents the weight percentage of Sb, and the range of c is ?1.85?c?1.85. The solder alloy has a peritectic or near peritectic structure with a low melting point, and has an excellent mechanical performance and reliability, and applicable to the field of low-temperature soldering.

Abstract: A SnBiSb series low-temperature lead-free solder and a preparation method thereof, which belongs to the technical field of low-temperature soldering. The lead-free solder includes by weight the following composition: 32.8-56.5% of Bi, 0.7-2.2% of Sb, with the remainder being Sn, wherein the weight percentages of Bi and Sb satisfy a relationship of b=0.006a2?0.672a+19.61=c, wherein the symbol a represents the weight percentage of Bi, the symbol b represents the weight percentage of Sb, and the range of c is ?1.85?c?1.85. The solder alloy has a peritectic or near peritectic structure with a low melting point, and has an excellent mechanical performance and reliability, and applicable to the field of low-temperature soldering.

Abstract: Provided is a device for preparing a large-sized high-quality aluminium alloy ingot, which is mainly composed of a uniform cooler, a hot top, an oil-gas lubrication mold, an induction coil and a dummy ingot, wherein the hot top is arranged above the oil-gas lubrication mold, the induction coil is arranged outside the oil-gas lubrication mold, the uniform cooler is arranged inside the oil-gas lubrication mold, and the dummy ingot is arranged below the oil-gas lubrication mold. Further provided is a method for preparing a large-sized high-quality aluminium alloy ingot. The device combines a partitioned gas supply mold with the uniform cooler and an electromagnetic stirrer, and the effective coupling of the three achieves forced and uniform solidification forming of a melt under gas pressure contact conditions, such that a stable and continuous gas film is formed between the melt and the mold. The ingot has a smooth surface, and a fine and uniform internal structure.