Abstract: Compact rear mounted modular heat exchangers and related methods are disclosed herein. An example apparatus disclosed herein includes a heat exchanger having an air flow inlet and an air flow outlet, a holder frame to receive a component of a server chassis, and a bracket coupled to the holder frame, the bracket to retain the heat exchanger adjacent a rear of the server chassis.

Abstract: An apparatus is described that includes a flow enhancement structure to enhance a flow of immersion bath liquid specifically through space between fins of a heat sink and/or across a base of a heat sink.

Abstract: An apparatus is described. The apparatus includes a packaged semiconductor device. The packaged semiconductor device having an integrated heat spreader, wherein, a boiling enhancement structure exists on the integrated heat spreader without a block mass residing between the boiling enhancement structure and the integrated heat spreader. The boiling enhancement structure has a structured non-planar surface to promote bubble nucleation in an immersion cooling system.

Abstract: Technologies for managing hot spots in a compute device with use of a vortex tube are disclosed. Cold air from one or more vortex tubes can be routed to hot spots of one or more compute devices, providing effective spot cooling. This approach may allow for cooling of components that might otherwise be difficult to cool, such as components where would be difficult or impossible to cool with a heat sink. This approach may also be effective in cooling components that are downstream of a heat sink and would otherwise only be cooled by air that was already heated by the heat sink.

Abstract: In one example a docking mat for an electronic device comprises a first major surface on which the electronic device may be positioned, a wireless power transmitting device, and a controller comprising logic, at least partly including hardware logic, to determine a location of the electronic device on the first major surface of the docking mat, establish a communication connection with the electronic device, receive at least one charge parameter from the electronic device, and activate the wireless power transmitting device in response to a determination that the electronic device is positioned proximate the wireless power transmitting device and the at least one charge parameter indicates that the electronic device is in a condition to receive power from the wireless power transmitting device. Other examples may be described.

Abstract: A universal power adapter may be provided to provide both a wireless charging signal and a DC signal for wired charging. The universal power adapter may include an AC/DC converter device, a first power circuit, a second power circuit, and a jack to provide a wireless charging signal and a DC signal. The AC/DC converter device to provide a DC signal based on an AC signal received from an external power source. The first power circuit to receive the DC signal and to provide a wireless charging signal based on the DC signal. The second power circuit to receive the DC signal and to provide a DC signal based on the DC signal. The jack may provide both the wireless charging signal and the DC signal.

Abstract: In one example a docking mat for an electronic device comprises a first major surface on which the electronic device may be positioned, a wireless power transmitting device, and a controller comprising logic, at least partly including hardware logic, to determine a location of the electronic device on the first major surface of the docking mat, establish a communication connection with the electronic device, receive at least one charge parameter from the electronic device, and activate the wireless power transmitting device in response to a determination that the electronic device is positioned proximate the wireless power transmitting device and the at least one charge parameter indicates that the electronic device is in a condition to receive power from the wireless power transmitting device. Other examples may be described.

Abstract: A system and method for application controlled fragrance generation are disclosed. A particular embodiment includes: receiving a fragrance trigger from an application, the fragrance trigger being associated with a particular fragrance that corresponds to an event, action, image, sound, or gesture depicted in the application, determining a temperature needed to cause the particular fragrance to be emitted from a fragrance cartridge; and causing a thermal element to heat the fragrance cartridge to the determined temperature.

Abstract: Various embodiments are generally directed to an apparatus, method and other techniques to receive thermal energy from a source, convert phase change material (102) from an initial state to a secondary state in response to absorption of the thermal energy, and transfer the thermal energy from the phase change material (102) to a thermoelectric component (106). In addition, various embodiments may include collecting, conducting and converting the thermal energy into electrical energy for use in powering one or more electronic components.

Abstract: A computing system (100) with external wireless charging coil (150,550,650,750,850), includes a computing apparatus which includes a battery (120,210,320); and the external charging coil (150,550,650,750,850) to be coupled with the computing apparatus, including a self-coiling cable to transition to an uncoiled state when weighted and to transition to a coiled state when unweighted; wherein the battery (120,210,320) is chargeable by inductive charging utilizing the external charging coil (150,550,650,750,850) as an inductive receiving coil.

Abstract: Technologies for managing hot spots in a compute device with use of a vortex tube are disclosed. Cold air from one or more vortex tubes can be routed to hot spots of one or more compute devices, providing effective spot cooling. This approach may allow for cooling of components that might otherwise be difficult to cool, such as components where would be difficult or impossible to cool with a heat sink. This approach may also be effective in cooling components that are downstream of a heat sink and would otherwise only be cooled by air that was already heated by the heat sink.

Abstract: In one example an electronic device comprises at least heat generating component, a heat spreader positioned proximate the at least one heat generating component and a passive radiator cooling device, comprising an enclosure, an active speaker positioned at least partially within the enclosure, and a passive audio radiator positioned at least partially within the enclosure. Other examples may be described.

Abstract: A universal power adapter may be provided to provide both a wireless charging signal and a DC signal for wired charging. The universal power adapter may include an AC/DC converter device, a first power circuit, a second power circuit, and a jack to provide a wireless charging signal and a DC signal. The AC/DC converter device to provide a DC signal based on an AC signal received from an external power source. The first power circuit to receive the DC signal and to provide a wireless charging signal based on the DC signal. The second power circuit to receive the DC signal and to provide a DC signal based on the DC signal. The jack may provide both the wireless charging signal and the DC signal.

Abstract: Various embodiments are generally directed to an apparatus, method and other techniques to receive thermal energy from a source, convert phase change material (102) from an initial state to a secondary state in response to absorption of the thermal energy, and transfer the thermal energy from the phase change material (102) to a thermoelectric component (106). In addition, various embodiments may include collecting, conducting and converting the thermal energy into electrical energy for use in powering one or more electronic components.

Abstract: In an example, a computing device is disclosed in which processing elements and other active devices may generate thermal irregularities such as hot spots on the casing of a computing device. In some cases, these hot spots may be undesirable from a comfort and usability standpoint or because they may result in thermal damage to system components. To remediate thermal irregularities, including hot spots, a localized depression may be provided in a casing or chassis to enlarge the air gap between the heat source and the bottom casing around the hot spot, so that the bottom casing skin temperature at the hot spot can be lowered with the increased air gap. A heat spreader may also be disposed above the localized depression to better distribute heat over a surface area. In some cases, ribbing may be provided to provide structural support to a heat spreader disposed over a localized depression.

Abstract: A system and method for application controlled fragrance generation are disclosed. A particular embodiment includes: receiving a fragrance trigger from an application, the fragrance trigger being associated with a particular fragrance that corresponds to an event, action, image, sound, or gesture depicted in the application, determining a temperature needed to cause the particular fragrance to be emitted from a fragrance cartridge; and causing a thermal element to heat the fragrance cartridge to the determined temperature.

Abstract: In one example an electronic device comprises at least heat generating component, a heat spreader positioned proximate the at least one heat generating component and a passive radiator cooling device, comprising an enclosure, an active speaker positioned at least partially within the enclosure, and a passive audio radiator positioned at least partially within the enclosure. Other examples may be described.

Abstract: In an example, a computing device is disclosed in which processing elements and other active devices may generate thermal irregularities such as hot spots on the casing of a computing device. In some cases, these hot spots may be undesirable from a comfort and usability standpoint or because they may result in thermal damage to system components. To remediate thermal irregularities, including hot spots, a localized depression may be provided in a casing or chassis to enlarge the air gap between the heat source and the bottom casing around the hot spot, so that the bottom casing skin temperature at the hot spot can be lowered with the increased air gap. A heat spreader may also be disposed above the localized depression to better distribute heat over a surface area. In some cases, ribbing may be provided to provide structural support to a heat spreader disposed over a localized depression.