Patents by Inventor Shaoxin Zhou

Shaoxin Zhou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic device
    Patent number: 11789504
    Abstract: An electronic device includes a heat emitting element disposed on a circuit board and a heat pipe group. The heat pipe group includes at least two heat pipes, and the heat pipe group is located on the heat emitting element. The heat pipes in the heat pipe group have at least one different characteristic parameter. Optimal working regions of the heat pipes in the heat pipe group are different. When the heat pipes in the heat pipe group work in the optimal working regions, thermal resistance ranges of the at least two heat pipes in the heat pipe group are 0.05-1 degrees Celsius per Watt (° C./W).
    Type: Grant
    Filed: September 14, 2021
    Date of Patent: October 17, 2023
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Linfang Jin, Xiaowei Hui, Xiangyang Yang, Shaoxin Zhou
  • Electronic Device
    Publication number: 20220004235
    Abstract: An electronic device includes a heat emitting element disposed on a circuit board and a heat pipe group. The heat pipe group includes at least two heat pipes, and the heat pipe group is located on the heat emitting element. The heat pipes in the heat pipe group have at least one different characteristic parameter. Optimal working regions of the heat pipes in the heat pipe group are different. When the heat pipes in the heat pipe group work in the optimal working regions, thermal resistance ranges of the at least two heat pipes in the heat pipe group are 0.05-1 degrees Celsius per Watt (° C./W).
    Type: Application
    Filed: September 14, 2021
    Publication date: January 6, 2022
    Inventors: Linfang Jin, Xiaowei Hui, Xiangyang Yang, Shaoxin Zhou
  • Electronic device
    Patent number: 11144101
    Abstract: An electronic device includes a heat emitting element disposed on a PCB. The electronic device further includes a heat pipe group. The heat pipe group includes at least two heat pipes, and the heat pipe group is located on the heat emitting element. The heat pipes in the heat pipe group have at least one different characteristic parameter. Optimal working regions of the heat pipes in the heat pipe group are different. When the heat pipes in the heat pipe group work in the corresponding optimal working regions, thermal resistance ranges of the at least two heat pipes in the heat pipe group are 0.05-1° C./W.
    Type: Grant
    Filed: August 1, 2019
    Date of Patent: October 12, 2021
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Linfang Jin, Xiaowei Hui, Xiangyang Yang, Shaoxin Zhou
  • Electronic Device
    Publication number: 20190354147
    Abstract: An electronic device includes a heat emitting element disposed on a PCB. The electronic device further includes a heat pipe group. The heat pipe group includes at least two heat pipes, and the heat pipe group is located on the heat emitting element. The heat pipes in the heat pipe group have at least one different characteristic parameter. Optimal working regions of the heat pipes in the heat pipe group are different. When the heat pipes in the heat pipe group work in the corresponding optimal working regions, thermal resistance ranges of the at least two heat pipes in the heat pipe group are 0.05-1° C./W.
    Type: Application
    Filed: August 1, 2019
    Publication date: November 21, 2019
    Inventors: Linfang Jin, Xiaowei Hui, Xiangyang Yang, Shaoxin Zhou
  • Electronic device
    Patent number: 10409340
    Abstract: An electronic device is provided. The electronic device includes a heat emitting element, and the heat emitting element is disposed on a circuit board PCB. The electronic device further includes a heat pipe group. The heat pipe group includes at least two heat pipes, and the heat pipe group is located on the heat emitting element. The heat pipes in the heat pipe group have at least one different characteristic parameter. Optimal working regions of the heat pipes in the heat pipe group are different. When the heat pipes in the heat pipe group work in the corresponding optimal working regions, thermal resistance ranges of the at least two heat pipes in the heat pipe group are 0.05-1° C./W.
    Type: Grant
    Filed: June 4, 2014
    Date of Patent: September 10, 2019
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Linfang Jin, Xiaowei Hui, Xiangyang Yang, Shaoxin Zhou
  • Electronic Device
    Publication number: 20170102745
    Abstract: An electronic device is provided. The electronic device includes a heat emitting element, and the heat emitting element is disposed on a circuit board PCB. The electronic device further includes a heat pipe group. The heat pipe group includes at least two heat pipes, and the heat pipe group is located on the heat emitting element. The heat pipes in the heat pipe group have at least one different characteristic parameter. Optimal working regions of the heat pipes in the heat pipe group are different. When the heat pipes in the heat pipe group work in the corresponding optimal working regions, thermal resistance ranges of the at least two heat pipes in the heat pipe group are 0.05-1° C./W.
    Type: Application
    Filed: June 4, 2014
    Publication date: April 13, 2017
    Applicant: Huawei Technologies Co., Ltd.
    Inventors: Linfang Jin, Xiaowei Hui, Xiangyang Yang, Shaoxin Zhou