Abstract: A medical device includes a mechanical structure and a force sensor unit. The force sensor unit comprises a mounting bracket, a first rod, a second rod, a first magnet, a second magnet, a first coil coupled to the mounting bracket, and a second coil coupled to the mounting bracket. The first rod and the second rod each have a center axis defined between a proximal and distal portion of the respective first and second rods. The center axis of the second rod is noncoaxial with the center axis of the first rod. The first magnet is coupled to the first rod and translates within the first coil along the center axis of the first rod. Similarly, the second magnet is coupled to the second rod and translates within the second coil along the center axis of the second rod.

Abstract: A medical device comprises an end effector, a mechanical structure, a connector, and a force sensor unit. The connector extends from a drive component of the mechanical structure to the end effector. Motion of the drive component produces a tension force within the connector, which is associated with an end effector torque or force exerted by the end effector. The force sensor unit comprises a body, and the body is coupled in-line with the connector so that strain in the connector is imparted to the body. A strain sensor measures the strain on the body as an indication of strain in the connector, which is an indication of torque or force at the end effector. The connector may be continuous, and coupled to the body with a slack relief portion of the connector within the body. Alternatively, the connector may be discontinuous and coupled to opposite ends of the body.

Abstract: A monitor device includes a substrate and a plurality of temperature sensors disposed in the substrate. The monitor device also includes a processor coupled to the substrate and adapted to receive one or more signals from the plurality of temperature sensors. The processor is further adapted to convert the one or more received signals into one or more converted signals. The monitor device further includes a transceiver coupled to the substrate and adapted to receive the one or more converted signals. The transceiver is further adapted to transmit one or more output signals to an external receiver.

Abstract: A monitor device includes a substrate and a plurality of temperature sensors disposed in the substrate. The monitor device also includes a processor coupled to the substrate and adapted to receive one or more signals from the plurality of temperature sensors. The processor is further adapted to convert the one or more received signals into one or more converted signals. The monitor device further includes a transceiver coupled to the substrate and adapted to receive the one or more converted signals. The transceiver is further adapted to transmit one or more output signals to an external receiver.

Abstract: An integrated system for baking and chilling wafers includes a heater for heating a wafer to an elevated temperature, a chiller for cooling the wafer, and a shuttle operatively connected to the heater and the chiller for transferring the wafer between the heater and the chiller. The chiller further includes a low thermal mass wafer support for providing support to a bottom surface of a wafer and a chill plate coupled to the low thermal mass wafer support for cooling the wafer. The low thermal mass wafer support has a higher thermal conductivity in the plane parallel to the bottom surface of the wafer than in the direction perpendicular to the bottom surface of the wafer. The low thermal mass wafer support can further include a plurality of proximity pins for supporting the wafer.

Abstract: A method and apparatus related to a substrate support structure are provided. In accordance with one embodiment of the present invention, a method for manufacturing a substrate support structure including proximity pins and apparatus for supporting a substrate inside a semiconductor processing equipment are provided. The method includes providing a plate assembly comprising a plate and a plate surface and forming a plurality of recessed regions in the plate surface. Additionally, the method includes filling the recessed regions with a bonding material including epoxy material and placing a plurality of support members into the epoxy-coated recessed regions. The method further includes pushing the support members with a flat plate held up from the surface by shims to provide a uniform local height of the support members, followed by a curing step to fix the supporting members to the recessed regions.