Patents by Inventor Shashikanth BOBBA

Shashikanth BOBBA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-level integrated circuit, device and method for modeling multi-level integrated circuits
    Patent number: 8710671
    Abstract: A multi-level integrated circuit, having a superposition of a first stack and a second stack of layers, and including a first row of electronic devices produced in the first stack, extending parallel to a first direction and fitting into a first volume with a substantially parallelepiped rectangle shape and having edges perpendicular to the first direction and with dimension H1; a second row of electronic devices produced in the second stack, extending parallel to the first direction and fitting into a second volume with a substantially parallelepiped rectangle shape and having edges perpendicular to the first direction and with dimension H2<H1; and a plurality of electrical connection elements passing through the second stack of layers, each connection element fitting into a third volume arranged on the first volume and next to the second volume.
    Type: Grant
    Filed: December 22, 2011
    Date of Patent: April 29, 2014
    Assignee: Commissariat à l'énergie atomique et aux énergies alternatives
    Inventors: Shashikanth Bobba, Olivier Thomas
  • MULTI-LEVEL INTEGRATED CIRCUIT, DEVICE AND METHOD FOR MODELING MULTI-LEVEL INTEGRATED CIRCUITS
    Publication number: 20120161329
    Abstract: A multi-level integrated circuit comprising a superposition of a first stack and a second stack of layers, and including: a first row of electronic devices produced in the first stack, extending parallel to a first direction and fitting into a first volume with a substantially parallelepiped rectangle shape and having edges perpendicular to the first direction and with dimension H1; a second row of electronic devices produced in the second stack, extending parallel to the first direction and fitting into a second volume with a substantially parallelepiped rectangle shape and having edges perpendicular to the first direction and with dimension H2<H1; a plurality of electrical connection elements passing through the second stack of layers, each connection element fitting into a third volume arranged on the first volume and next to the second volume.
    Type: Application
    Filed: December 22, 2011
    Publication date: June 28, 2012
    Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE ALT
    Inventors: Shashikanth BOBBA, Olivier THOMAS