Patents by Inventor Shaue-An Yang

Shaue-An Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of bonding by anodic bonding for field emission display
    Patent number: 6863585
    Abstract: A method of bonding spacers to an anode plate of a field emission display. An anode plate having separate phosphor regions is provided, wherein a black matrix material is provided to separate the phosphor regions from one another. A magnetic layer is formed on the black matrix material. A thin metal film is formed on the anode plate and the magnetic layer. Spacers are disposed on the metal film above the black matrix material. An electromagnetic induction procedure is performed to heat the magnetic layer and thus serves as a heating source to produce heat, wherein the heat goes through the metal film to heat the spacers. A direct current (D.C.) electric field procedure is performed to bond the spacers to the metal film above the black matrix material.
    Type: Grant
    Filed: May 22, 2003
    Date of Patent: March 8, 2005
    Assignee: Industrial Technology Research Institute
    Inventors: Shaue-An Yang, Cheng-Chung Lee, Ming-Chun Hsiao, Jung-Tang Huang
  • Method of bonding by anodic bonding for field emission display
    Publication number: 20040029482
    Abstract: A method of bonding spacers to an anode plate of a field emission display. An anode plate having separate phosphor regions is provided, wherein a black matrix material is provided to separate the phosphor regions from one another. A magnetic layer is formed on the black matrix material. A thin metal film is formed on the anode plate and the magnetic layer. Spacers are disposed on the metal film above the black matrix material. An electromagnetic induction procedure is performed to heat the magnetic layer and thus serves as a heating source to produce heat, wherein the heat goes through the metal film to heat the spacers. A direct current (D.C.) electric field procedure is performed to bond the spacers to the metal film above the black matrix material.
    Type: Application
    Filed: May 22, 2003
    Publication date: February 12, 2004
    Applicant: Industrial Technology Research Institute
    Inventors: Shaue-An Yang, Cheng-Chung Lee, Ming-Chun Hsiao, Jung-Tang Huang