Abstract: A Planar Memory Module (PAMM) device comprising a generally planar card comprising a first side and a second side, the first side having a plurality of couplings and the second side having a plurality of connectors, a plurality of memory devices coupled to the card via a first portion of the plurality of couplings, and at least one hub chip coupled to the card via a second portion of the plurality of couplings. Each of the plurality of couplings is connected to an associated one of the plurality of connectors.

Abstract: A Planar Memory Module (PAMM) device comprising a generally planar card comprising a first side and a second side, the first side having a plurality of couplings and the second side having a plurality of connectors, a plurality of memory devices coupled to the card via a first portion of the plurality of couplings, and at least one hub chip coupled to the card via a second portion of the plurality of couplings. Each of the plurality of couplings is connected to an associated one of the plurality of connectors.

Abstract: A cooling apparatus, system and like method for an electronic device includes a plurality of heat producing electronic devices affixed to a wiring substrate. A plurality of heat transfer assemblies each include heat spreaders and thermally communicate with the heat producing electronic devices for transferring heat from the heat producing electronic devices to the heat transfer assemblies The plurality of heat producing electronic devices and respective heat transfer assemblies are positioned on the wiring substrate having the regions overlapping. A heat conduit thermally communicates with the heat transfer assemblies. The heat conduit circulates thermally conductive fluid therethrough in a closed loop for transferring heat to the fluid from the heat transfer assemblies via the heat spreader.

Abstract: A cooling or heat transfer apparatus and method is disclosed for cooling an electronic device. The apparatus includes a heat producing electronic device which may include an electronic circuit card with many heat sources. A heat transfer device is connected to the heat producing electronic device which is thermally communicating with the heat producing device for transferring heat from the heat producing device to the heat transfer device. A heat conduit is connected to the heat transfer device and thermally communicating with the heat transfer device for transferring heat to the heat conduit from the heat transfer device. A cooling housing is connected to the heat conduit and the cooling housing thermally communicating with the heat conduit for transferring heat to the cooling housing from the heat conduit. The apparatus enables the replacement of circuit cards in the field because it eliminates the need to apply thermal-interface materials.

Abstract: A Planar Memory Module (PAMM) device comprising a generally planar card comprising a first side and a second side, the first side having a plurality of couplings and the second side having a plurality of connectors, a plurality of memory devices coupled to the card via a first portion of the plurality of couplings, and at least one hub chip coupled to the card via a second portion of the plurality of couplings. Each of the plurality of couplings is connected to an associated one of the plurality of connectors.

Abstract: A Planar Memory Module (PAMM) device comprising a generally planar card comprising a first side and a second side, the first side having a plurality of couplings and the second side having a plurality of connectors, a plurality of memory devices coupled to the card via a first portion of the plurality of couplings, and at least one hub chip coupled to the card via a second portion of the plurality of couplings. Each of the plurality of couplings is connected to an associated one of the plurality of connectors.

Abstract: A Planar Memory Module (PAMM) device comprising a generally planar card comprising a first side and a second side, the first side having a plurality of couplings and the second side having a plurality of connectors, a plurality of memory devices coupled to the card via a first portion of the plurality of couplings, and at least one hub chip coupled to the card via a second portion of the plurality of couplings. Each of the plurality of couplings is connected to an associated one of the plurality of connectors.

Abstract: A Planar Memory Module (PAMM) device comprising a generally planar card comprising a first side and a second side, the first side having a plurality of couplings and the second side having a plurality of connectors, a plurality of memory devices coupled to the card via a first portion of the plurality of couplings, and at least one hub chip coupled to the card via a second portion of the plurality of couplings. Each of the plurality of couplings is connected to an associated one of the plurality of connectors.

Abstract: Where a fluid cooling medium cools a plurality of heat-producing devices arranged in a row along a generalized coordinate direction, with a space between each adjacent pair of devices, each space may have a partition that defines a boundary between a first plenum and a second plenum. The first plenum carries cooling medium across an entrance and thence into a first heat-producing device located on a first side of the partition facing the first plenum. The second plenum carries cooling medium away from a second heat-producing device located on a second side of the partition facing the second plenum and thence across an exit. The partition is disposed so that the first plenum becomes smaller in cross-sectional area as distance increases from the entrance, and the second plenum becomes larger in cross sectional area as distance decreases toward the exit.

Abstract: Disclosed is a printing apparatus, having a print surface lying in a print plane defined by an imaginary x-axis and y-axis, the print surface having an outward normal pointing in the positive direction along an imaginary z-axis, such that the x-axis, y-axis, and z-axis are substantially orthogonal to one another, a lower stamp clamp disposed adjacent to the negative-x edge of the print surface, an upper stamp clamp, moveable in two dimensions in a trajectory plane defined by the x-axis and z-axis, a stamp comprising a flexible material, the stamp having a first end attached to the lower stamp clamp and a second end attached to the upper stamp clamp, such that a cross section of the stamp parallel to the trajectory plane forms an arc extending from an origin point Q on the lower stamp clamp having (x,z) coordinates (0,0) to point E on the upper stamp clamp, this arc being described by the mathematical function &thgr;(s), where s is the curvilinear distance along the arc measured from point Q, and &thgr; is the

Abstract: The invention comprises a transducer, computer hardware, and software. The computer hardware contains a waveform-input device. The transducer (such as a microphone) converts a signal (such as sound waves) into a time-varying voltage. The waveform-input device periodically samples this voltage and digitizes each sample, thereby producing an array of N numbers in the memory of the computer that represent a small snippet of the signal measured over a time interval &Dgr;tmeas. Snippets are typically measured one after the other at a repetition rate that is inversely related to &Dgr;tmeas. The software, also stored in the memory of the computer, and executed using its central processing unit, includes a spectral-analysis process that analyzes the frequency content of each snippet and produces an associated spectrum. The software also includes a novel note-analysis process that analyzes the spectrum and extracts from it the pitch and timbre of the principal musical note contained therein.

Abstract: Disclosed is a printing apparatus, having a print surface lying in a print plane defined by an imaginary x-axis and y-axis, the print surface having an outward normal pointing in the positive direction along an imaginary z-axis, such that the x-axis, y-axis, and z-axis are substantially orthogonal to one another, a lower stamp clamp disposed adjacent to the negative-x edge of the print surface, an upper stamp clamp, moveable in two dimensions in a trajectory plane defined by the x-axis and z-axis, a stamp comprising a flexible material, the stamp having a first end attached to the lower stamp clamp and a second end attached to the upper stamp clamp, such that a cross section of the stamp parallel to the trajectory plane forms an arc extending from an origin point Q on the lower stamp clamp having (x,z) coordinates (0,0) to point E on the upper stamp clamp, this arc being described by the mathematical function &thgr;(s), where s is the curvilinear distance along the arc measured from point Q, and &thgr; is the

Abstract: The rasterization process is separated into two modes, a test mode and a normal mode, to eliminate shading calculations associated with all-hidden triangles, thereby providing improved efficiency over prior rasterization schemes.