Abstract: A downforce system adjusts the amount of downforce being applied to a row unit of an agricultural implement. The downforce system is controlled to increase or decrease the force on the row unit. A load is sensed at the row unit and compared to either or both of a user defined target and a lower threshold that can be based, at least in part, upon a percentage of a value. When the load is determined to be below the lower threshold, the user defined amount is increased at a rate of change until the load is above the threshold, at which point the increase is stopped, and reduced, if necessary.

Abstract: A downforce system adjusts the amount of downforce being applied to a row unit of an agricultural implement. The downforce system is controlled to increase or decrease the force on the row unit. A load is sensed at the row unit and compared to either or both of a user defined target and a lower threshold that can be based, at least in part, upon a percentage of a value. When the load is determined to be below the lower threshold, the user defined amount is increased at a rate of change until the load is above the threshold, at which point the increase is stopped, and reduced, if necessary.

Abstract: A broken-gap tunnel junction device comprising a thin quantum well (QW) layer situated at the interface between adjacent highly doped n-type and p-type semiconductor layers, wherein the QW layer has a type-III broken-gap energy band alignment with respect to one or more of the surrounding semiconductor layers such that a conduction band of the QW layer is below the valence band of one or more of the n-type and p-type bulk semiconductor layers.

Abstract: The present invention provides a high yield pathway for the fabrication, transfer and assembly of high quality printable semiconductor elements having selected physical dimensions, shapes, compositions and spatial orientations. The compositions and methods of the present invention provide high precision registered transfer and integration of arrays of microsized and/or nanosized semiconductor structures onto substrates, including large area substrates and/or flexible substrates. In addition, the present invention provides methods of making printable semiconductor elements from low cost bulk materials, such as bulk silicon wafers, and smart-materials processing strategies that enable a versatile and commercially attractive printing-based fabrication platform for making a broad range of functional semiconductor devices.

Abstract: The present invention provides a high yield pathway for the fabrication, transfer and assembly of high quality printable semiconductor elements having selected physical dimensions, shapes, compositions and spatial orientations. The compositions and methods of the present invention provide high precision registered transfer and integration of arrays of microsized and/or nanosized semiconductor structures onto substrates, including large area substrates and/or flexible substrates. In addition, the present invention provides methods of making printable semiconductor elements from low cost bulk materials, such as bulk silicon wafers, and smart-materials processing strategies that enable a versatile and commercially attractive printing-based fabrication platform for making a broad range of functional semiconductor devices.

Abstract: The present invention provides a high yield pathway for the fabrication, transfer and assembly of high quality printable semiconductor elements having selected physical dimensions, shapes, compositions and spatial orientations. The compositions and methods of the present invention provide high precision registered transfer and integration of arrays of microsized and/or nanosized semiconductor structures onto substrates, including large area substrates and/or flexible substrates. In addition, the present invention provides methods of making printable semiconductor elements from low cost bulk materials, such as bulk silicon wafers, and smart-materials processing strategies that enable a versatile and commercially attractive printing-based fabrication platform for making a broad range of functional semiconductor devices.

Abstract: The present invention provides a high yield pathway for the fabrication, transfer and assembly of high quality printable semiconductor elements having selected physical dimensions, shapes, compositions and spatial orientations. The compositions and methods of the present invention provide high precision registered transfer and integration of arrays of microsized and/or nanosized semiconductor structures onto substrates, including large area substrates and/or flexible substrates. In addition, the present invention provides methods of making printable semiconductor elements from low cost bulk materials, such as bulk silicon wafers, and smart-materials processing strategies that enable a versatile and commercially attractive printing-based fabrication platform for making a broad range of functional semiconductor devices.

Abstract: An entertainment and knowledge-based board game and method of play concerning the twelve dispensations starting with the Garden of Eden and ending with the Israelites entering into the Promise Land, designed to promote Biblical knowledge and spiritual growth in its players. The board game comprises a game board; God cards; Grace cards; breastplates of righteousness; and gems; wherein the game comprises Bible-related trivia questions; and a set of user instructions. The trivia is related to the books of Genesis through Joshua of the Old Testament.

Abstract: The present invention provides a high yield pathway for the fabrication, transfer and assembly of high quality printable semiconductor elements having selected physical dimensions, shapes, compositions and spatial orientations. The compositions and methods of the present invention provide high precision registered transfer and integration of arrays of microsized and/or nanosized semiconductor structures onto substrates, including large area substrates and/or flexible substrates. In addition, the present invention provides methods of making printable semiconductor elements from low cost bulk materials, such as bulk silicon wafers, and smart-materials processing strategies that enable a versatile and commercially attractive printing-based fabrication platform for making a broad range of functional semiconductor devices.