Abstract: A chassis and rack system is disclosed in which a chassis separated into two separate enclosures by a central partition. Each of the enclosures is sized to receive a computer system. The partition includes a pair of vertically oriented vents, with each of the vents in fluid communication with one of the enclosures and the computer system contained therein. Heated air is removed from each computer system through the vent in the partition that is associated with the computer system. Multiple chassis may be placed one atop another in a vertical configuration in which each chassis is either directly above or directly below another chassis. In this vertical configuration, the vents form a vertically oriented common plenum that can be used to evacuate air from multiple chassis arranged in a rack.

Abstract: An information handling system includes a server rack chassis, an adaptor assembly, and second and third servers. The server rack chassis includes a bay adapted to receive a first server that has a height that is substantially equal to a height of the bay. The adaptor assembly is inserted within the bay and includes first, second, third, and fourth slots to receive servers. The adaptor assembly is substantially the same size and dimension as the first server. The second server is inserted within the first slot of the adaptor assembly, and includes a first communication fabric. The height of the second server is substantially equal to a quarter of the height of the bay. The third server is inserted within the second slot of the adaptor assembly, and includes a second communication fabric. The height of the third server is substantially equal to a quarter of the height of the bay.

Abstract: Systems and methods for indicating the unsafe service handling temperature of an information handling system component are disclosed. A method may include sensing a surface temperature of the component and comparing the surface temperature to a first and second threshold temperatures. The method may further include displaying various temperature warning by multiple temperature indicators if the surface temperature is above or below the threshold temperatures.

Abstract: A synthetic air jet cooling system includes a first component. A fan is in fluid communication with the first component. A synthetic air jet is located adjacent the first component. A thermal management engine is coupled to the first component, the fan, and the synthetic air jet. The thermal management engine is operable to receive a first component operating condition, compare the first component operating condition to a target operating condition, and increase a fan fluid flow rate from the fan and a synthetic air jet fluid flow rate from the synthetic air jet in order to reduce the difference between the first component operating condition the target operating condition. The thermal management engine increases the synthetic air jet fluid flow rate from the synthetic air jet to a predetermined synthetic air jet fluid flow rate prior to increasing the fan fluid flow rate from the fan in order to provide improvements in power consumption, airflow, and acoustics.

Abstract: In one embodiment a method includes operating a component coupled to the system at a first steady state average power consumption, measuring the temperature of the component to produce a first temperature measurement, operating the component at a second, higher power consumption for a first time period, and measuring the temperature of the component at the end of the first time period to produce a second temperature measurement. A transient thermal metric is calculated based at least in part on the first and second temperature measurements, and the transient thermal metric is used to infer the thermal coupling status of a heat dissipation appliance that is nominally thermally coupled to the component.

Abstract: Systems and methods for indicating the unsafe service handling temperature of an information handling system component are disclosed. A method may include sensing a surface temperature of the component and comparing the surface temperature to a first and second threshold temperatures. The method may further include displaying various temperature warning by multiple temperature indicators if the surface temperature is above or below the threshold temperatures.

Abstract: A cooling system for an information handling system is provided in which a cold plate is coupled to the motherboard of the computer system. The cold plate includes a number of cold pads that are located on the pan to correspond to the location of heat-emitting components on the motherboard. Chilled water is circulated through the cold pads to remove heat from the vicinity of the heat-emitting components. A heat exchanger may be coupled to the cold plate.

Abstract: A synthetic air jet cooling system includes a first component. A fan is in fluid communication with the first component. A synthetic air jet is located adjacent the first component. A thermal management engine is coupled to the first component, the fan, and the synthetic air jet. The thermal management engine is operable to receive a first component operating condition, compare the first component operating condition to a target operating condition, and increase a fan fluid flow rate from the fan and a synthetic air jet fluid flow rate from the synthetic air jet in order to reduce the difference between the first component operating condition the target operating condition. The thermal management engine increases the synthetic air jet fluid flow rate from the synthetic air jet to a predetermined synthetic air jet fluid flow rate prior to increasing the fan fluid flow rate from the fan in order to provide improvements in power consumption, airflow, and acoustics.

Abstract: A memory heat sink system includes a base comprising a first side and a second side, wherein the first side is oriented substantially perpendicularly to the second side. A plurality of convective heat transfer members extend from the first side. At least one conductive liquid cooling coupling surface located on the second side.

Abstract: A chassis having a bypass channel for air flow is disclosed. The chassis include a bypass channel that is proximate one side of the chassis. The bypass channel may be formed by the side of the chassis and a module of the computing system, such as the processor module of the computing system. A second module exists in the rear of the chassis. A physical barrier may be used to direct air from the bypass channel to the second module, which may be an I/O module. A plenum is placed on the opposite side of I/O module from the air flow. The presence of the plenum creates a negative pressure on the opposite side of the second module, causing air to cross the second module into the plenum. A fan in the rear of the chassis causes air to leave the plenum and exit the chassis.

Abstract: AA cooling system for an information handling system is provided in which a cold plate is coupled to the motherboard of the computer system. The cold plate includes a number of cold pads that are located on the pan to correspond to the location of heat-emitting components on the motherboard. Chilled water is circulated through the cold pads to remove heat from the vicinity of the heat-emitting components. A heat exchanger may be coupled to the cold plate.

Abstract: A chassis having a bypass channel for air flow is disclosed. The chassis include a bypass channel that is proximate one side of the chassis. The bypass channel may be formed by the side of the chassis and a module of the computing system, such as the processor module of the computing system. A second module exists in the rear of the chassis. A physical barrier may be used to direct air from the bypass channel to the second module, which may be an I/O module. A plenum is placed on the opposite side of I/O module from the air flow. The presence of the plenum creates a negative pressure on the opposite side of the second module, causing air to cross the second module into the plenum. A fan in the rear of the chassis causes air to leave the plenum and exit the chassis.

Abstract: A heat dissipation apparatus includes a first commponent connector defining a first component slot immediately adjacent the first component connector, wherein the first component connector is located adjacent to and spaced apart from a second component connector that defines a second component slot. A heat dissipating member is thermally coupled to a heat producing component such that the heat dissipating member is located in the second component slot that is defined by the second component connector when the heat producing component is coupled to the first component connector and located in the first component slot. The heat dissipation apparatus may be coupled to a heat producing component and used to dissipate heat from the heat producing component when there are empty component connector slots located adjacent the component connector that the heat producing component is coupled to.

Abstract: A rack system is disclosed. The racks and the computer systems included within the racks have a shallow configuration. The racks are placed next to one another in a back-to-back configuration in which the backs of each of the racks are adjacent to one another. All of the user-accessible components of the computers system face toward the front of each rack. The heated air from each of the computer systems is expelled in the space between each of the racks. The space between each of the racks is relatively narrow, as there are no user-accessible components between the racks. The racks are coupled to one another with a bar that may include at least some spring action to accommodate some movement of the racks toward or away from one another without the tipping of either rack.

Abstract: A chassis and rack system is disclosed in which a chassis separated into two separate enclosures by a central partition. Each of the enclosures is sized to receive a computer system. The partition includes a pair of vertically oriented vents, with each of the vents in fluid communication with one of the enclosures and the computer system contained therein. Heated air is removed from each computer system through the vent in the partition that is associated with the computer system. Multiple chassis may be placed one atop another in a vertical configuration in which each chassis is either directly above or directly below another chassis. In this vertical configuration, the vents form a vertically oriented common plenum that can be used to evacuate air from multiple chassis arranged in a rack.

Abstract: A memory device cooling apparatus includes a first heat sink operable to engage a first chip that is located on a memory device and that is operable to operate at a first temperature. A second heat sink is included that is separate from the first heat sink and is operable to engage a second chip that is located on a memory device and that is operable to operate at a second temperature, wherein the second temperature is different from the first temperature. A retaining feature is operable to couple the first heat sink and the second heat sink to a memory device. The memory device cooling apparatus may be coupled to a memory device having at least two different chips that operate at different temperatures to efficiently dissipate heat from the chips in order to cool the memory device.

Abstract: A heat dissipation apparatus includes a first thermal conducting member including a first thermal transfer surface. A second thermal conducting member including a second thermal transfer surface that is located adjacent the first thermal transfer surface. A thermal interface material engages the first thermal transfer surface and the second thermal transfer surface. A channel is defined adjacent the first thermal transfer surface and the second thermal transfer surface, whereby an excess of the thermal interface material is located in the channel. The first thermal conducting member may be thermally coupled to an information handling system processor and the channel may prevent the thermal interface material from engaging sensitive surfaces adjacent the processor.

Abstract: A heat dissipation apparatus includes a heat transfer base that is operable to couple to a heat producing component that is operable to couple to a first component connector and be located in a first component slot defined by the first component connector, wherein the first component connector is located adjacent to and spaced apart from a second component connector that defines a second component slot. A heat dissipating member extends from the heat transfer base such that the heat dissipating member is located in the second component slot that is defined by the second component connector when the heat producing component is coupled to the first component connector and located in the first component slot. The heat dissipation apparatus may be coupled to a heat producing component and used to dissipate heat from the heat producing component when there are empty component connector slots located adjacent the component connector that the heat producing component is coupled to.

Abstract: An information handling system and method of operating an information handling system are disclosed. In one embodiment the method comprises operating a component coupled to the system at a first steady state average power consumption, measuring the temperature of the component to produce a first temperature measurement, operating the component at a second, higher power consumption for a first time period, and measuring the temperature of the component at the end of the first time period to produce a second temperature measurement. A transient thermal metric is calculated based at least in part on the first and second temperature measurements, and the transient thermal metric is used to infer the thermal coupling status of a heat dissipation appliance that is nominally thermally coupled to the component.

Abstract: A memory device cooling apparatus includes a first heat sink operable to engage a first chip that is located on a memory device and that is operable to operate at a first temperature. A second heat sink is included that is separate from the first heat sink and is operable to engage a second chip that is located on a memory device and that is operable to operate at a second temperature, wherein the second temperature is different from the first temperature. A retaining feature is operable to couple the first heat sink and the second heat sink to a memory device. The memory device cooling apparatus may be coupled to a memory device having at least two different chips that operate at different temperatures to efficiently dissipate heat from the chips in order to cool the memory device.