Abstract: A deformable label processor and related methods are described. The processor is heated and urged against a label, such as a heat transfer label, to apply one or more designs from the label and/or the label itself onto a container or other surface. The processor and methods are well suited for application of labels onto compound curved surfaces. The label processors include particular exhaust assemblies and air diffuser assemblies.

Abstract: A deformable label processor and related methods are described. The processor is heated and urged against a label, such as a heat transfer label, to apply one or more designs from the label and/or the label itself onto a container or other surface. The processor and methods are well suited for application of labels onto compound curved surfaces. The label processors include particular exhaust assemblies and air diffuser assemblies.

Abstract: A deformable label processor and related methods are described. The processor is heated and urged against a label, such as a pressure sensitive heat shrink label, to apply the label onto a container or other surface. The processor and methods are well suited for application of labels onto compound curved surfaces. Also described are high volume label application processes using assemblies of multiple label processors. Additional assemblies and methods are described for selectively contacting and adhering regions of a label onto a moving container during labeling operations. Select regions of a label can be wiped to modify or alter label portions that are in contact and not in contact with the container. A label treatment process performed after label application is also disclosed. The treatment process reduces the occurrence of label defects and improves label retention, adherence and aesthetics. The treatment process includes heating an applied label and adhesive to a particular temperature.

Abstract: A deformable label processor and related methods are described. The processor is heated and urged against a label, such as a heat transfer label, to apply one or more designs from the label onto a container or other surface. The processor and methods are well suited for application of labels onto compound curved surfaces. Also described are high volume label application processes using assemblies of multiple label processors. Additional assemblies and methods are described for selectively contacting and adhering regions of a label onto a moving container during labeling operations.

Abstract: A system for conditioning the leads of a semiconductor device. The system includes a base having anvil surfaces configured to form the leads to a predetermined shape, and forming arms mounted to the base. An actuator is movable relative to the base to move the forming arms from a first position, with the forming arm spaced from the leads, to a second position, with the forming arm urging the leads against the anvil surface to form the leads to a predetermined configuration. Adjustment means adjust the position of said anvil and arms. A video scanner scans sample semiconductor devices and generates lead dimension and configuration signals. A processor processes said signals and applies the processed signals to the adjustment means to form leads of a semiconductor device to predetermined dimensions and configuration.

Abstract: A system for conditioning the leads of a semiconductor device. The system includes a base having at least one anvil surface configured to form the leads to a predetermined shape, and at least one forming arm mounted to the base. An actuator is movable relative to the base to move the forming arm from a first position, with the forming arm spaced from the leads, to a second position, with the forming arm urging the leads against the anvil surface to form the leads to a predetermined configuration.