Patents by Inventor Shawn S. McEuen

Shawn S. McEuen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210026416
    Abstract: Computing devices and peripherals having a dynamic curvature are disclosed. The base of a laptop can curve as the laptop lid is opened due to left and right base portions being pulled inward to a bisector of the base. Base portions can be pulled inwards by a bending strap pushed upwards by a lifter spring, by base hinges that rotate inwards, or a shape memory allow wire laced around pulleys that contract when heated. A display device with dynamic curvature can curve due to a rack and pinion linear actuator that extends or shortens adjustable rods housed in the display support. A base or display can be curved based on the context of the computer device or in response to certain events. The curvature of a base or display can be tunable by a user. Curved bases and displays can reduce wrist and eye strain.
    Type: Application
    Filed: September 26, 2020
    Publication date: January 28, 2021
    Inventors: Aleksander Magi, Evan P. Kuklinski, Shawn S. McEuen, David W. Browning, Juha Tapani Paavola
  • Patent number: 10552550
    Abstract: Technologies for physical programming include a model compute system to determine one or more physical blocks assembled in a constructed model. The model compute system determines rules associated with the one or more physical blocks in which at least one rule defines a behavior of the constructed model and determines a program stack for execution by the model compute system based on the rules associated with the one or more physical blocks.
    Type: Grant
    Filed: September 26, 2015
    Date of Patent: February 4, 2020
    Assignee: Intel Corporation
    Inventors: Glen J. Anderson, Kevin W. Bross, Shawn S. Mceuen, Mark R. Francis, Yevgeniy Y. Yarmosh, Blanka Vlasak, Gregory A. Peek, Therese E. Dugan, Cory A. Harris, Ravishankar Iyer, Omesh Tickoo, David I. Poisner
  • Patent number: 10423199
    Abstract: In one example a electronic device comprises a housing, at least one heat generating component disposed within the housing, at least one internal heat dissipation device positioned proximate the at least one heat generating component, and a thermal interface defined in at least a portion of the housing to allow direct thermal contact between the heat dissipation device and an external heat dissipation device. Other examples may be described.
    Type: Grant
    Filed: August 1, 2017
    Date of Patent: September 24, 2019
    Assignee: INTEL CORPORATION
    Inventors: Jeremy Burr, David W. Browning, Shawn S. McEuen, Mark MacDonald, Matthew D. Coakley
  • Publication number: 20180173283
    Abstract: In one example a electronic device comprises a housing, at least one heat generating component disposed within the housing, at least one internal heat dissipation device positioned proximate the at least one heat generating component, and a thermal interface defined in at least a portion of the housing to allow direct thermal contact between the heat dissipation device and an external heat dissipation device. Other examples may be described.
    Type: Application
    Filed: August 1, 2017
    Publication date: June 21, 2018
    Applicant: Intel Corporation
    Inventors: JEREMY BURR, DAVID W. BROWNING, SHAWN S. MCEUEN, MARK MACDONALD, MATTHEW D. COAKLEY
  • Patent number: 9720464
    Abstract: In one example a electronic device comprises a housing, at least one heat generating component disposed within the housing, at least one internal heat dissipation device positioned proximate the at least one heat generating component, and a thermal interface defined in at least a portion of the housing to allow direct thermal contact between the heat dissipation device and an external heat dissipation device. Other examples may be described.
    Type: Grant
    Filed: December 22, 2014
    Date of Patent: August 1, 2017
    Assignee: Intel Corporation
    Inventors: Jeremy Burr, David W. Browning, Shawn S. McEuen, Mark MacDonald, Matthew D. Coakley
  • Patent number: 9612634
    Abstract: Some embodiments of an apparatus, system and method are described for a concealed venting thermal solution. An apparatus may comprise an enclosure arranged around one or more heat generating components, a duct arranged around an internal perimeter of the enclosure and a seam inlet arranged around an external perimeter of the enclosure to allow an airflow to enter the duct. Other embodiments are described.
    Type: Grant
    Filed: June 5, 2015
    Date of Patent: April 4, 2017
    Assignee: INTEL CORPORATION
    Inventors: Mark MacDonald, Shawn S. McEuen
  • Publication number: 20170091346
    Abstract: Technologies for physical programming include a model compute system to determine one or more physical blocks assembled in a constructed model. The model compute system determines rules associated with the one or more physical blocks in which at least one rule defines a behavior of the constructed model and determines a program stack for execution by the model compute system based on the rules associated with the one or more physical blocks.
    Type: Application
    Filed: September 26, 2015
    Publication date: March 30, 2017
    Inventors: Glen J. Anderson, Kevin W. Bross, Shawn S. Mceuen, Mark R. Francis, Yevgeniy Y. Yarmosh, Blanka Vlasak, Gregory A. Peek, Therese E. Dugan, Cory A. Harris, Ravishankar Iyer, Omesh Tickoo, David I. Poisner
  • Patent number: 9568956
    Abstract: Some embodiments of an apparatus, system and method are described for a collapsible keyboard apparatus and computing system. A collapsible keyboard apparatus may comprise a plurality of keys supported by a first support structure and a set of keys supported by a second support structure pivotally coupled to the first support structure. The second support structure may be arranged to rotate around the pivotal coupling from a first position substantially coplanar with the first support structure to a second non-coplanar position in response to a force applied to the second support structure. Other embodiments are described.
    Type: Grant
    Filed: September 29, 2011
    Date of Patent: February 14, 2017
    Assignee: INTEL CORPORATION
    Inventors: Shawn S. Mceuen, James M. Okuley
  • Publication number: 20160179147
    Abstract: In one example a electronic device comprises a housing, at least one heat generating component disposed within the housing, at least one internal heat dissipation device positioned proximate the at least one heat generating component, and a thermal interface defined in at least a portion of the housing to allow direct thermal contact between the heat dissipation device and an external heat dissipation device. Other examples may be described.
    Type: Application
    Filed: December 22, 2014
    Publication date: June 23, 2016
    Applicant: Intel Corporation
    Inventors: JEREMY BURR, DAVID W. BROWNING, SHAWN S. MCEUEN, MARK MACDONALD, MATTHEW D. COAKLEY
  • Patent number: 9313875
    Abstract: Examples are disclosed for a conformal coating molded around power source circuitry, electrical components or at least portions of a display for a computing device. The conformal coating to include embedded microencapsulated thermal energy storage material to absorb heat generated by the electrical components.
    Type: Grant
    Filed: December 11, 2012
    Date of Patent: April 12, 2016
    Assignee: INTEL CORPORATION
    Inventors: Jered H. Wikander, Mark MacDonald, Shawn S. McEuen, Harish Jagadish, David Pidwerbecki
  • Patent number: 9309707
    Abstract: In one embodiment a hinge assembly comprises a first hinge pin rotatable about a first axis, a first gear coupled to the first hinge pin and rotatable about the first axis, a second hinge pin rotatable about a second axis substantially parallel to the first axis, a second gear coupled to the second hinge pin and rotatable about the second axis, at least one connecting member to be coupled to the first hinge pin and the second hinge pin to hold the first hinge pin at a fixed distance from the second hinge pin such that the first gear is engaged with the second gear. At least one of the first gear or the second gear comprises a variable radius. Other embodiments may be described.
    Type: Grant
    Filed: December 28, 2013
    Date of Patent: April 12, 2016
    Assignee: Intel Corporation
    Inventors: Jered H. Wikander, Nathaniel B. Osterberg, Douglas Heymann, Shawn S. Mceuen
  • Publication number: 20150316967
    Abstract: Some embodiments of an apparatus, system and method are described for a concealed venting thermal solution. An apparatus may comprise an enclosure arranged around one or more heat generating components, a duct arranged around an internal perimeter of the enclosure and a seam inlet arranged around an external perimeter of the enclosure to allow an airflow to enter the duct. Other embodiments are described.
    Type: Application
    Filed: June 5, 2015
    Publication date: November 5, 2015
    Applicant: Intel Corporation
    Inventors: Mark MacDonald, Shawn S. McEuen
  • Patent number: 9075584
    Abstract: Some embodiments of an apparatus, system and method are described for a concealed venting thermal solution. An apparatus may comprise an enclosure arranged around one or more heat generating components, a duct arranged around an internal perimeter of the enclosure and a seam inlet arranged around an external perimeter of the enclosure to allow an airflow to enter the duct. Other embodiments are described.
    Type: Grant
    Filed: December 9, 2013
    Date of Patent: July 7, 2015
    Assignee: INTEL CORPORATION
    Inventors: Mark MacDonald, Shawn S. McEuen
  • Publication number: 20150184437
    Abstract: In one embodiment a hinge assembly comprises a first hinge pin rotatable about a first axis, a first gear coupled to the first hinge pin and rotatable about the first axis, a second hinge pin rotatable about a second axis substantially parallel to the first axis, a second gear coupled to the second hinge pin and rotatable about the second axis, at least one connecting member to be coupled to the first hinge pin and the second hinge pin to hold the first hinge pin at a fixed distance from the second hinge pin such that the first gear is engaged with the second gear. At least one of the first gear or the second gear comprises a variable radius. Other embodiments may be described.
    Type: Application
    Filed: December 28, 2013
    Publication date: July 2, 2015
    Inventors: Jered H. Wikander, Nathaniel B. Osterberg, Douglas Heymann, Shawn S. Mceuen
  • Publication number: 20140301029
    Abstract: Some embodiments of an apparatus, system and method are described for a collapsible keyboard apparatus and computing system. A collapsible keyboard apparatus may comprise a plurality of keys supported by a first support structure and a set of keys supported by a second support structure pivotally coupled to the first support structure. The second support structure may be arranged to rotate around the pivotal coupling from a first position substantially coplanar with the first support structure to a second non-coplanar position in response to a force applied to the second support structure. Other embodiments are described.
    Type: Application
    Filed: September 29, 2011
    Publication date: October 9, 2014
    Inventors: Shawn S. Mceuen, James M. Okuley
  • Publication number: 20140285967
    Abstract: Examples are disclosed for a conformal coating molded around power source circuitry, electrical components or at least portions of a display for a computing device. The conformal coating to include embedded microencapsulated thermal energy storage material to absorb heat generated by the electrical components.
    Type: Application
    Filed: December 11, 2012
    Publication date: September 25, 2014
    Inventors: Jered H. Wikander, Mark MacDonald, Shawn S. McEuen, Harish Jagadish, David Pidwerbecki
  • Publication number: 20140185233
    Abstract: In one embodiment an electronic device comprises at least one electronic component and a housing comprising a first section to be rotatable about a first hinge pin extending along a first axis extending proximate a first edge, a second section to be rotatable about a second hinge pin extending along a second axis substantially parallel to the first axis, and at least one connecting arm to be coupled to the first hinge pin and the second hinge pin. Other embodiments may be described.
    Type: Application
    Filed: December 28, 2012
    Publication date: July 3, 2014
    Inventors: MARK MACDONALD, SHAWN S. MCEUEN
  • Publication number: 20140098488
    Abstract: Some embodiments of an apparatus, system and method are described for a concealed venting thermal solution. An apparatus may comprise an enclosure arranged around one or more heat generating components, a duct arranged around an internal perimeter of the enclosure and a seam inlet arranged around an external perimeter of the enclosure to allow an airflow to enter the duct. Other embodiments are described.
    Type: Application
    Filed: December 9, 2013
    Publication date: April 10, 2014
    Inventors: Mark MacDonald, Shawn S. McEuen
  • Patent number: D878383
    Type: Grant
    Filed: May 19, 2017
    Date of Patent: March 17, 2020
    Assignee: Intel Corporation
    Inventors: Shawn S. McEuen, Aleksander Magi
  • Patent number: D974366
    Type: Grant
    Filed: March 16, 2020
    Date of Patent: January 3, 2023
    Assignee: Intel Corporation
    Inventors: Shawn S. McEuen, Aleksander Magi