Patents by Inventor Shayan Malek
Shayan Malek has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11006524Abstract: An interposer for mechanically and electrically connecting two circuit boards is described. The interposer can be bent to enclose an area of a circuit board. The interposer can include a first layer external to the enclosed area. The first layer can be conductive and can serve as an EMI shield. The interposer can also include a second layer internal to the enclosed area. The second layer can be non-conductive but can carry multiple discrete pins that can electrically couple the first and second circuit boards and provide signal transmission pathways between the circuit boards. The interposer can be formed by folding a sheet of conductive material having different cutout regions that forms a comb pattern into multiple stacked layers. Then, the bent regions that connect the stacked layers can be removed so that the conductive bars in the comb patterns can be separated and isolated to form discrete pins.Type: GrantFiled: January 19, 2018Date of Patent: May 11, 2021Assignee: Apple Inc.Inventors: Scott A. Myers, James B. Smith, Dale T. Morgan, Shayan Malek
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Patent number: 10904370Abstract: A mobile phone may include a housing defining at least a portion of a back exterior surface of the mobile phone, a display stack at least partially within the housing, the display stack defining an active region configured to produce a graphical output, and a transparent cover positioned over the display stack. The transparent cover may define a first portion covering the active region of the display stack, a second portion adjacent the first portion, and a hole in the second portion and extending through the transparent cover. The mobile phone may also include a button element positioned in the hole of the transparent cover, a force-sensing system configured to detect an input applied to the button element, a circuit board coupled to the force-sensing system, and a shim positioned below the first portion of the transparent cover and having same thickness that as the circuit board.Type: GrantFiled: March 23, 2020Date of Patent: January 26, 2021Assignee: APPLE INC.Inventors: Douglas G. Fournier, Kurtis Mundell, Shayan Malek
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Patent number: 10881015Abstract: This application relates to securing and positioning internal components within a housing of a portable computing device. In one embodiment, a number of insert molded retaining members are utilized to inhibit outward deformation of a sidewall of the housing during a drop event. In another embodiment, a cowling is utilized to retain a number of board-to-board connectors within communication slots on a printed circuit board (PCB). In another embodiment, a C-shaped washer having diametrically opposed protrusions is utilized to adjust an alignment of an internal component.Type: GrantFiled: September 22, 2016Date of Patent: December 29, 2020Assignee: Apple Inc.Inventors: Daniel W. Jarvis, Benjamin J. Pope, Jason Sloey, Jonathan C. Denby, Ian A. Spraggs, Shayan Malek
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Publication number: 20190082535Abstract: An interposer for mechanically and electrically connecting two circuit boards is described. The interposer can be bent to enclose an area of a circuit board. The interposer can include a first layer external to the enclosed area. The first layer can be conductive and can serve as an EMI shield. The interposer can also include a second layer internal to the enclosed area. The second layer can be non-conductive but can carry multiple discrete pins that can electrically couple the first and second circuit boards and provide signal transmission pathways between the circuit boards. The interposer can be formed by folding a sheet of conductive material having different cutout regions that forms a comb pattern into multiple stacked layers. Then, the bent regions that connect the stacked layers can be removed so that the conductive bars in the comb patterns can be separated and isolated to form discrete pins.Type: ApplicationFiled: January 19, 2018Publication date: March 14, 2019Inventors: Scott A. MYERS, James B. SMITH, Dale T. MORGAN, Shayan MALEK
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Patent number: 10225964Abstract: Electrical components may be shielded using a shielding can or other shielding structure that covers the electrical components. The electrical components and the shielding structure may be mounted on a substrate such as a printed circuit board using solder or other conductive material. The shielding structure may have one or more shielding layers. The shielding layers may include high conductivity material for providing shielding for radio-frequency electromagnetic interference and magnetic material for blocking magnetic flux. Shielding structures may be formed from materials such as ferritic stainless steel, coatings that enhance solderability, corrosion resistance, and conductivity, magnetic materials printed or otherwise formed on metal layers, and other shielding structures.Type: GrantFiled: August 29, 2016Date of Patent: March 5, 2019Assignee: Apple Inc.Inventors: James B. Smith, Daniel W. Jarvis, David A. Pakula, Gregory N. Stephens, Nicholas G. L. Merz, Shayan Malek, Sina Bigdeli
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Patent number: 9974180Abstract: An electronic device may have a printed circuit to which electrical components are mounted. The electrical components may include a thermal sensor and a pressure sensor. A through hole in the printed circuit may receive the shaft of a standoff. The standoff may be soldered to plated metal on the sides of the through hole. A screw or other fastener may secure the printed circuit to a housing for the electronic device. A ring-shaped metal member may be soldered to the printed circuit. The ring-shaped metal member may form a bumper that surrounds the screw or other fastener and the thermal sensor. The pressure sensor may have a port through which ambient pressure measurements are made. A dust protection cover such as a fabric or other porous layer may cover the port.Type: GrantFiled: July 16, 2015Date of Patent: May 15, 2018Assignee: Apple Inc.Inventors: Shayan Malek, David A. Pakula, Gregory N. Stephens, Sawyer I. Cohen, Scott A. Myers, Tyler B. Cater, Eric W. Bates
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Patent number: 9888562Abstract: Electrical components in an electronic device are mounted on substrates such as printed circuits. Printed circuits contain signal paths formed from metal traces. The signal lines in the signal paths of the printed circuits are coupled together using electrical connection structures such as printed circuit board-to-board connectors, contacts joined by anisotropic conductive film, or contacts joined using solder. Electrical connection structures may be surrounded by conductive resilient ring-shaped structures such as conductive foam structures or spring structures. The conductive foam structures may be provided with a metal layer with which the conductive foam structures are soldered to a ring of metal on a printed circuit. Strain relief structures may be formed from an elastomeric ring that surrounds the electrical connection structures or an overmolded plastic structure.Type: GrantFiled: December 24, 2012Date of Patent: February 6, 2018Assignee: Apple Inc.Inventors: Shayan Malek, Michael B. Wittenberg, Sawyer I. Cohen, Ashutosh Y. Shukla
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Patent number: 9787342Abstract: Several embodiments for ejecting a SIM tray from an electronic device are disclosed. In some embodiments, a lever positioned behind the tray can be actuated to eject the tray. In some embodiments, a pivot mechanism can be actuated to eject the tray. In other embodiments, a gear mechanism can be actuated to eject the tray. In other embodiments, a spring element can be actuated to eject the tray. In some embodiments, the electronic device may include a key feature that allows the tray to eject only when a tool is used having a mating key feature with the key feature of the electronic device.Type: GrantFiled: November 24, 2014Date of Patent: October 10, 2017Assignee: Apple Inc.Inventors: Jared M. Kole, Shayan Malek, Matthew D. Hill, Michael Benjamin Wittenberg, Gregory N. Stephens
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Publication number: 20170290207Abstract: Electrical components may be shielded using a shielding can or other shielding structure that covers the electrical components. The electrical components and the shielding structure may be mounted on a substrate such as a printed circuit board using solder or other conductive material. The shielding structure may have one or more shielding layers. The shielding layers may include high conductivity material for providing shielding for radio-frequency electromagnetic interference and magnetic material for blocking magnetic flux. Shielding structures may be formed from materials such as ferritic stainless steel, coatings that enhance solderability, corrosion resistance, and conductivity, magnetic materials printed or otherwise formed on metal layers, and other shielding structures.Type: ApplicationFiled: August 29, 2016Publication date: October 5, 2017Inventors: James B. Smith, Daniel W. Jarvis, David A. Pakula, Gregory N. Stephens, Nicholas G. L. Merz, Shayan Malek, Sina Bigdeli
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Patent number: 9750152Abstract: This application relates to securing and positioning internal components within a housing of a portable computing device. In one embodiment a cowling is utilized to retain a number of board-to-board connectors within communication slots on a printed circuit board (PCB). In another embodiment a number of insert molded retaining members are utilized to prevent outward deformation of sidewalls of the portable computing device during a drop event. In another embodiment, a C-shaped washer having diametrically opposed protrusions is utilized to adjust an alignment of an internal component.Type: GrantFiled: August 11, 2014Date of Patent: August 29, 2017Assignee: Apple Inc.Inventors: Daniel W. Jarvis, Benjamin J. Pope, Jason S. Sloey, Jonathan C. Denby, Ian A. Spraggs, Shayan Malek
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Patent number: 9743564Abstract: An electronic device may have a printed circuit to which electrical components are mounted. Electromagnetic shields may be mounted to the printed circuit over the components to suppress interference. A shield may have a metal frame covered with a conductive fabric. The conductive fabric may cover an opening in the top of the frame. An insulating layer may be formed on the lower surface of the conductive fabric to prevent shorts between components on the printed circuit and the conductive fabric. An insulating cap such as an elastomeric polymer cap may also be formed over each component to provide electrical isolation between the components and the conductive fabric. Shields may be formed by coupling shield cans to subscriber identity module shields or other metal structures in a device. Intervening wall structures may be removed to help provide additional shielding volume.Type: GrantFiled: August 19, 2015Date of Patent: August 22, 2017Assignee: Apple Inc.Inventors: Shayan Malek, David A. Pakula, Gregory N. Stephens, Jason Sloey
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Publication number: 20170222329Abstract: A multiple antenna feed assembly including an antenna feed support having a body made of an electrically insulating material and a method of forming the antenna feed assembly, are provided. The antenna feed support may have a slot adapted to receive a connector; and a gap formed in the body having a thickness to fit a printed circuit board (PCB). The multiple antenna feed assembly may include a first connector adapted to fit in the slot of the antenna feed support; and a second connector electrically isolated from the first connector. Also provided is an antenna feed support to provide structural support and electrical isolation for the components of a multiple antenna feed assembly as above.Type: ApplicationFiled: April 11, 2017Publication date: August 3, 2017Inventor: Shayan Malek
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Patent number: 9713851Abstract: A method and system for securing a flexible circuit to a mounting structure is disclosed. The system can include a surface-mount device, flexible circuit, stiffener, and bracket. The stiffener is used as an intermediate coupling device between the flexible circuit and bracket. The flexible circuit is coupled to the stiffener with a heat-activated adhesive. Next, the surface-mount device is mounted to the flexible circuit with surface-mounting techniques. A peripheral area of the stiffener is then welded to the bracket. The bracket in turn can be fastened to the enclosure of an electronic device.Type: GrantFiled: November 12, 2013Date of Patent: July 25, 2017Assignee: Apple Inc.Inventors: Nicholas G. Merz, Shayan Malek, Sawyer I. Cohen, Timothy Lui
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Patent number: 9658648Abstract: An electronic device may have a signal cable formed from a flexible printed circuit. A service loop may be formed in the signal cable. The bend may be formed in a desired location on the flexible printed circuit by contraction of an elastic member having ends attached to the flexible printed circuit. The elastic member may be conductive to carry signals and provide shielding. Structures may be attached to the flexible printed circuit to promote bending in a desired location and direction. A crease or other bending promotion feature may be applied to the flexible printed circuit at a desired bend location. Overbending prevention structures such as overmolded elastomeric structures may be applied to the flexible printed circuit at the bend. Integral strain relief features may prevent overbending of the flexible printed circuit upon exiting the elastomeric structures. Overmolded structures may serve as protective bumpers.Type: GrantFiled: March 25, 2014Date of Patent: May 23, 2017Assignee: Apple Inc.Inventors: Benjamin M. Rappoport, Justin R. Wodrich, Santhana Balaji, Shayan Malek
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Patent number: 9648744Abstract: Electronic devices are provided with ejectable component assemblies. Each ejectable component assembly may include a tray that can be loaded with one or more types of removable module, such as a mini-SIM card and a micro-SIM card, and inserted into the device. Each assembly may also include a cover coupled to a circuit board. The tray may be inserted through an opening in the electronic device and into a space between the cover and the circuit board. A portion of the space is contained within the pocket. A portion of the tray may be contained within the pocket when the tray is inserted into the device for holding the module at a functional insertion position within the device.Type: GrantFiled: September 11, 2012Date of Patent: May 9, 2017Assignee: APPLE INC.Inventors: Michael B. Wittenberg, Miguel C. Christophy, Shayan Malek
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Patent number: D795823Type: GrantFiled: October 14, 2016Date of Patent: August 29, 2017Assignee: Apple Inc.Inventors: Shota Aoyagi, Richard P. Howarth, Shayan Malek, Scott A. Myers, David A. Pakula, Gregory Nicolaus Stephens
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Patent number: D906234Type: GrantFiled: August 23, 2018Date of Patent: December 29, 2020Assignee: Apple Inc.Inventors: Sina Bigdeli, Lucy E. Browning, Richard Hung Minh Dinh, Shayan Malek, Aaron H. Squier
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Patent number: D906306Type: GrantFiled: September 9, 2013Date of Patent: December 29, 2020Assignee: Apple Inc.Inventors: Jody Akana, Bartley K. Andre, Shota Aoyagi, Jeremy Bataillou, Miguel Christophy, Daniel J. Coster, Daniele De Iuliis, Richard Hung Minh Dinh, M. Evans Hankey, Julian Hoenig, Richard P. Howarth, Jonathan P. Ive, Daniel W. Jarvis, Duncan Robert Kerr, Jared Kole, Kelvin Kwong, Shayan Malek, Benjamin J. Pope, Matthew Dean Rohrbach, Peter Russell-Clarke, Mikael Silvanto, Christopher J. Stringer, Tang Yew Tan, Eugene Antony Whang, Rico Zörkendörfer
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Patent number: D910545Type: GrantFiled: August 23, 2018Date of Patent: February 16, 2021Assignee: Apple Inc.Inventors: Richard Hung Minh Dinh, Sherry Lee, Shayan Malek, Kurtis James Mundell, Benjamin J. Pope
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Patent number: D956685Type: GrantFiled: December 28, 2020Date of Patent: July 5, 2022Assignee: Apple Inc.Inventors: Sawyer Isaac Cohen, Richard Hung Minh Dinh, Bryan D. Keen, Shayan Malek, Devon A. Monaco