Abstract: A battery may have a foil battery pack with leads that are coupled to a printed circuit board. Battery protection structures formed from an insulating material such as plastic may be used to protect the foil battery pack. The foil battery pack may have a rectangular shape with front and rear faces surrounded by a rectangular peripheral edge. The battery protection structures may have a ring shape that surrounds the peripheral edge while leaving the front and rear faces exposed to minimize the size of the battery protection structures. An elastomeric material may be used to form the battery protection structures. The elastomeric material may allow the battery protection structures to stretch when the battery pack expands during use. Two shots of plastic may be incorporated into the battery protection structures to provide both puncture resistance and the ability to stretch during use.

Abstract: A switching subassembly includes a modular molded interconnect bracket and a switching device arranged on the modular molded interconnect bracket. The modular molded interconnect includes at least one electronic circuit trace arranged thereon configured to interconnect a portion of a flexible printed circuit board and to support a portion of the flexible printed circuit board. The switching device is configured to contact portions of the at least one electronic circuit trace.

Abstract: Retention structures are provided to guide and secure a co-axial cable from an upper portion to a lower portion of a logic board having a bend region. In one embodiment, a retention structure can guide, retain, and electrically ground the co-axial cable at multiple locations. In another embodiment, a retention structure can provide route a co-axial cable around the bend region of the logic board, while providing strain relief and the ability to accommodate co-axial cables of different lengths, due to manufacturing tolerances. Multi-purpose cowling structures are also provided to minimize spacing impact within an electronic device, while maximizing functional utility. In another embodiment, a cowling can electrically connect the ground plane of a logic board to the ground plane of a housing member and provide a pre-load force to a conductor connection existing on logic board.

Abstract: Latch mechanism devices for attaching components within a device and methods of use are provided herein. In one aspect, the latch mechanism includes a pair of deflectable members between which a protruding latch member, such as a latch pin, is inserted thereby separating the deflectable members. A latch pin can have a distal insertion portion and a proximal locking portion, the locking portion having a reduced profile so as to resiliently receive the deflectable members displaced by insertion of the latch pin so as to couple the latch pin between the cords. The latch pin can have insertion faces and locking faces angled so as to control the force required to insert and retract the latch pin from the cord pair. The latch mechanism may utilize releasing mechanisms for separating or reducing tension in the deflectable members to facilitate retraction of the latch pin.

Abstract: An electronic device may be provided with shape memory structures. The shape memory structures may be used to form actuators for a camera shutter, an actuator for moving an optical filter, or other actuators in an electronic device. A camera shutter may have an opaque shutter member that is movable between a first position in which the shutter is closed and blocks light from a digital image sensor and a second position in which the shutter is open and allows light to reach the digital image sensor. The camera shutter may have an associated color filter structure. Shape memory wire may be configured to form a loop that heats upon application of a signal or may be configured to form a twisting or linear actuator. The camera shutter may be provided with a controllable aperture.

Abstract: One embodiment of a molded shield can include a cavity to conform to and receive an electrical component, a slit to conform to and receive a metal frame and a metal layer coupled to the top and lateral sides of the molded shield. In one embodiment, the molded shield can be formed from silicon and can include material to enhance electrical conductivity. The molded shield can couple to the metal frame which in turn can be coupled to ground with the resulting configuration acting to reduce electrical emissions. The molded shield can transfer heat away from the electrical component through conduction.

Abstract: Electronic devices having integrated thermal and EMI shields for providing thermal dissipation and EMI shielding of one or more circuitry components, and methods for making the same, are provided. The integrated shield combines both thermal and EMI shielding properties into a single layer material that saves space within the electronic device. The integrated shield can be constructed from a silicon material having one or more EMI shielding additives incorporated therein.

Abstract: Various systems of an electronic device and methods for manufacturing the same are provided. In some embodiments, a routing assembly is provided that may not only route a cable along a circuit board, but that may also shield an electronic component or secure an electronic component to the circuit board. In some other embodiments, there is provided a mechanism for electrically coupling two components of an electronic device that may also be visually appealing in the context of other portions of the electronic device.

Abstract: This is directed to systems and methods for shielding a circuitry region of an electronic device from interference (e.g., EMI) with a removable shield assembly.

Abstract: Threaded structures such as threaded standoff structures may be provided with features that control the flow of solder. A base structure for a standoff may be formed from a material such as metal. During attachment of the standoff to a substrate such as a printed circuit board, the base structure may be exposed to molten solder. A solderphilic coating may be provided on the outer surface of the standoff to encourage wicking of solder up and over lower portions of the standoff and beneath the standoff, thereby helping to secure the standoff to the substrate. The center of the base structure may be provided with threads to receive screws. To prevent solder from covering the threads, the surface of the threads may be provided with a solderphobic surface.

Abstract: Multi-purpose cowling structures are provided to minimize spacing impact within an electronic device, while maximizing functional utility. In one embodiment, an electromagnetic interference shield may provide one or more anchors for enabling a logic board cowling to apply sufficient downward force to one or more board connectors to prevent inadvertent disconnects. In another embodiment, a cowling can electrically connect the ground plane of a logic board to the ground plane of a housing member and provide a pre-load force to a conductor connection existing on logic board. A compass mounted on a flexible printed circuit board is also provided. Mounting the compass on a flexible printed circuit board enables the compass to be mounted remote from ferrous object that may affect the compass's performance.

Abstract: Retention structures are provided to guide and secure a co-axial cable from an upper portion to a lower portion of a logic board having a bend region. In one embodiment, a retention structure can guide, retain, and electrically ground the co-axial cable at multiple locations. In another embodiment, a retention structure can provide route a co-axial cable around the bend region of the logic board, while providing strain relief and the ability to accommodate co-axial cables of different lengths, due to manufacturing tolerances. Multi-purpose cowling structures are also provided to minimize spacing impact within an electronic device, while maximizing functional utility. In another embodiment, a cowling can electrically connect the ground plane of a logic board to the ground plane of a housing member and provide a pre-load force to a conductor connection existing on logic board.

Abstract: Electronic devices may be provided that include mechanical and electronic components. Connectors may be used to interconnect printed circuits and devices mounted to printed circuits. Printed circuits may include rigid printed circuit boards and flexible printed circuit boards. Cosmetic structures such as cowlings may be used to improve device aesthetics. Bumpers may be mounted over rough edges of printed circuit boards to protect flex circuits that are routed over the printed circuit boards. Fasteners may be soldered to solder pad structures on printed circuit boards.

Abstract: Electronic devices may be provided that include mechanical and electronic components. Connectors may be used to interconnect printed circuits and devices mounted to printed circuits. Printed circuits may include rigid printed circuit boards and flexible printed circuit boards. Heat sinks and other thermally conductive structures may be used to remove excess component heat. Structures may also be provided in an electronic device to detect moisture. Integrated circuits and other circuitry may be mounted on a printed circuit board under a radio-frequency shielding can.