Abstract: A multi-element probe array suitable for sensing or stimulating is disclosed. In one embodiment, the multi-element probe array includes a plurality of microfibers extending longitudinally and oriented substantially parallel to form a bundle. Probe elements are defined by a first subset of the microfibers displaced in a forward direction alone the longitudinal axis relative to spacer elements defined by a second subset of the microfibers. Interface elements and communication elements are disposed on the probe elements.

Abstract: Techniques for ultra-high density connection are disclosed. In one embodiment, an ultra-high density connector includes a bundle of substantially parallel elongate cylindrical elements, where each cylindrical element is substantially in contact with at least one adjacent cylindrical element. Ends of the elongate cylindrical elements are disposed differentially with respect to each other to define a three-dimensional interdigitating mating surface. At least one of the elongate cylindrical elements has an electrically conductive contact positioned to tangentially engage a corresponding electrical contact of a mating connector.

Abstract: Devices and methods for electrical interconnection for microelectronic circuits are disclosed. One method of electrical interconnection includes forming a bundle of microfilaments, wherein at least two of the microfilaments include electrically conductive portions extending along their lengths. The method can also include bonding the microfilaments to corresponding bond pads of a microelectronic circuit substrate to form electrical connections between the electrically conductive portions and the corresponding bond pads. A microelectronic circuit can include a bundle of microfilaments bonded to corresponding bond pads to make electrical connection between corresponding bonds pads and electrically-conductive portions of the microfilaments.

Abstract: A method for fabricating a multi-cell electronic circuit array and exemplary multi-cell electronic circuit arrays are disclosed. In one embodiment, a multi-cell electronic circuit array includes an elongate substrate having a linear array of first electronic cell components micro fabricated thereon. The elongate substrate is inserted into a tubular enclosure which has at least one second electronic cell component which interacts with the first electronic cell components.

Abstract: A serpentine device having a proximal end and a distal end comprising a series of discs arrayed in succession and on center along a common, neutral axis, wherein the discs comprise a first and second surface; and at least one flexible interconnect extending between and connecting each disc to any succeeding disc according to a pre-determined connection configuration, wherein the interconnects are indirectly connected to one another through the discs and configured to provide torsional and bending support to each of the discs connected thereto under an applied load, thus achieving a continuum of flexibility along an entire length of the serpentine device, as well as to facilitate the torquability of the serpentine device. The serpentine device may further comprise a bendable member and at least one transfer element configured to perform one or more transfer functions, namely the transfer of energy, work, fluid, electricity, light energy, sound energy, matter, etc.

Abstract: A miniaturized utility device having integrated optical capabilities for use on a high aspect ratio system, wherein the miniaturized utility device comprises: (a) a micro camera comprising a solid state micro imaging device including, as an integral structure, an imaging array electrically coupled to a conductive pad, wherein the solid state imaging device further includes at least one utility aperture passing therethrough, and a lens optically coupled to the imaging array; and (b) a micro utility instrument configured for coordinated operation with the imaging device at a common local site, wherein the micro utility instrument is configured to perform a designated function viewable, preferably in real-time, via a camera image generated by the micro camera.

Abstract: An electromechanical structure such as a MEMS resonator formed in the surface of a semiconductor body. A flexible beam containing a conductive plate is integrally formed in a cavity in the surface of a semiconductor body. A second conductive plate is parallel to the first along a sidewall of the cavity. A voltage applied across the first and second conductive plates forces the flexible beam to vibrate horizontally. A cap layer seals the cavity and maintains a vacuum in the cavity. The structure is smaller than the wavelength of the RF signal generated therefrom and, therefore, virtually shielded.