Patents by Inventor Shen-Hong Kao

Shen-Hong Kao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for contacting flexible printed circuit with another flexible circuitry component and related circuitry assembly
    Patent number: 7445496
    Abstract: A method for connecting a flexible printed circuit (FPC) with a flexible circuitry component containing conducting wires is disclosed. The flexible circuitry component has an uncovered conducting portion. The proposed method includes providing a tenon and a holder with a groove corresponding to the tenon; and utilizing the tenon to wedge the uncovered conducting portion of the flexible circuitry component and a connecting region of the FPC in the groove of the holder to cause that the uncovered conducting portion contacts the connecting region.
    Type: Grant
    Filed: July 17, 2006
    Date of Patent: November 4, 2008
    Assignee: Lite-On Technology Corp.
    Inventor: Shen-Hong Kao
  • METHOD FOR CONTACTING FLEXIBLE PRINTED CIRCUIT WITH ANOTHER FLEXIBLE CIRCUITRY COMPONENT AND RELATED CIRCUITRY ASSEMBLY
    Publication number: 20070224878
    Abstract: A method for connecting a flexible printed circuit (FPC) with a flexible circuitry component containing conducting wires is disclosed. The flexible circuitry component has an uncovered conducting portion. The proposed method includes providing a tenon and a holder with a groove corresponding to the tenon; and utilizing the tenon to wedge the uncovered conducting portion of the flexible circuitry component and a connecting region of the FPC in the groove of the holder to cause that the uncovered conducting portion contacts the connecting region.
    Type: Application
    Filed: July 17, 2006
    Publication date: September 27, 2007
    Inventor: Shen-Hong Kao