Abstract: A slider includes a substrate having a trailing edge, a leading edge opposite the trailing edge, and an air bearing surface connecting the trailing edge with the leading edge; a read/write transducer formed at the trailing edge; and a coat layer attached on the trailing edge and covering on the read/write transducer. The slider further includes a protection layer for shielding the read/write transducer thereby preventing the read/write transducer from damaging during a laser soldering process. The present invention can prevent the read/write transducer from damaging during the laser bonding process and, in turn improve the reading and writing performance of the slider. The invention also discloses an HGA and a disk drive unit.

Abstract: An apparatus for disconnecting solder joints between two welded surfaces includes a laser device for emitting laser beams to a solder joint, and a solder material removal device. And the solder material removal device includes a nozzle device having a first passage, a holder holding the nozzle device and having a second passage communicated with the first passage, and at least two pumping devices connected to the holder to pump the melted solder material out from the nozzle device and the holder. The laser device and the solder material removal device are separated, a glass cover with a hole formed thereon is covered on the top of the holder, and the laser device is located above the glass cover and separated from the holder. The present invention can shorten maintenance time and maintenance workload and improve work efficiency, furthermore reduce and stabilize the laser energy.

Abstract: A magnetic head includes a slider substrate having a trailing edge and multiple bonding pads arranged on the trailing edge in a row. Each of the bonding pads includes a seed layer adhered to the trailing edge and electrically connected with the slider substrate, a soldering layer formed on the seed layer and adapted for connecting with a suspension, and at least one solder nonwettable layer adhered to the trailing edge and connected with at least one side of the seed layer. The structure of the magnetic head is simple and stable, which can prevent the bonding pads bridging and shorting-circuit. An HGA and a disk drive unit with the same, a manufacturing method for the magnetic head are also disclosed.

Abstract: A magnetic head includes a slider substrate having a trailing edge and multiple bonding pads arranged on the trailing edge in a row. Each of the bonding pads includes a seed layer adhered to the trailing edge and electrically connected with the slider substrate, a soldering layer formed on the seed layer and adapted for connecting with a suspension, and at least one solder nonwettable layer adhered to the trailing edge and connected with at least one side of the seed layer. The structure of the magnetic head is simple and stable, which can prevent the bonding pads bridging and shorting-circuit. An HGA and a disk drive unit with the same, a manufacturing method for the magnetic head are also disclosed.

Abstract: An apparatus for disconnecting solder joints between two welded surfaces includes a laser device for emitting laser beams to a solder joint, and a solder material removal device. And the solder material removal device includes a nozzle device having a first passage, a holder holding the nozzle device and having a second passage communicated with the first passage, and at least two pumping devices connected to the holder to pump the melted solder material out from the nozzle device and the holder. The laser device and the solder material removal device are separated, a glass cover with a hole formed thereon is covered on the top of the holder, and the laser device is located above the glass cover and separated from the holder. The present invention can shorten maintenance time and maintenance workload and improve work efficiency, furthermore reduce and stabilize the laser energy.

Abstract: A suspension includes a flexure and a plurality of electrical traces formed on the flexure. Each electrical trace has a trace body and a bonding pad arranged for connecting with a slider, and the bonding pad is a free end before connecting with the slider and is capable of bending to the trace body flexibly, and the bonding pad includes a trace body layer and a solder layer formed on the trace body layer, thereby the bonding pads of the electrical traces connecting with the slider by reflowing the solder layer. The present invention uses no extra solder balls, so as to reduce the manufacturing cost and the corresponding apparatus cost. The invention also discloses a manufacturing method of a suspension, and a connecting method for a suspension and a slider.

Abstract: A suspension includes a flexure and a plurality of electrical traces formed on the flexure. Each electrical trace has a trace body and a bonding pad arranged for connecting with a slider, and the bonding pad is a free end before connecting with the slider and is capable of bending to the trace body flexibly, and the bonding pad includes a trace body layer and a solder layer formed on the trace body layer, thereby the bonding pads of the electrical traces connecting with the slider by reflowing the solder layer. The present invention uses no extra solder balls, so as to reduce the manufacturing cost and the corresponding apparatus cost. The invention also discloses a manufacturing method of a suspension, and a connecting method for a suspension and a slider.

Abstract: A slider includes a substrate having a trailing edge, a leading edge opposite the trailing edge, and an air bearing surface connecting the trailing edge with the leading edge; a read/write transducer formed at the trailing edge; and a coat layer attached on the trailing edge and covering on the read/write transducer. The slider further includes a protection layer for shielding the read/write transducer thereby preventing the read/write transducer from damaging during a laser soldering process. The present invention can prevent the read/write transducer from damaging during the laser bonding process and, in turn improve the reading and writing performance of the slider. The invention also discloses an HGA and a disk drive unit.