Patents by Inventor Shen Su
Shen Su has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240179523Abstract: A configuration method includes: the terminal device generating a second key on the basis of a first key, and performing encryption and/or integrity protection on a certificate request message on the basis of the second key; and sending a first request message, the first request message comprising the certificate request message encrypted and/or integrity-protected via the second key.Type: ApplicationFiled: March 22, 2022Publication date: May 30, 2024Applicants: CHINA MOBILE COMMUNICATION CO., LTD RESEARCH INSTITUTE, CHINA MOBILE COMMUNICATIONS GROUP CO., LTD.Inventors: Ye TIAN, Li SU, Shen HE, Haitao DU, Jie MA, Wenshu JIANG
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Patent number: 11960869Abstract: An Android penetration method and device for implementing silent installation based on accessibility services. The method includes: acquiring a second target application by adding a load program to a first target application and adding penetration permissions using an Android decompilation technology; and implementing silent installation of the second target application using an accessibility service technology.Type: GrantFiled: January 5, 2022Date of Patent: April 16, 2024Assignee: Guangzhou UniversityInventors: Hui Lu, Zhihong Tian, Chengjie Jin, Luxiaohan He, Man Zhang, Jiageng Yang, Xinguo Zhang, Dongqiu Huang, Qi Sun, Yanbin Sun, Shen Su
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Patent number: 11919962Abstract: Provided herein are antibodies that bind to the alpha subunit of an IL-7 receptor (IL-7R?). Also provided are uses of these antibodies in therapeutic applications, such as treatment of inflammatory diseases. Further provided are cells that produce the antibodies, polynucleotides encoding the heavy and/or light chain regions of the antibodies, and vectors comprising the polynucleotides.Type: GrantFiled: April 16, 2021Date of Patent: March 5, 2024Assignee: Bristol Myers-Squibb CompanyInventors: Aaron Paul Yamniuk, Scott Ronald Brodeur, Ekaterina Deyanova, Richard Yu-Cheng Huang, Yun Wang, Alfred Robert Langish, Guodong Chen, Stephen Michael Carl, Hong Shen, Achal Mukundrao Pashine, Lin Hui Su
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Publication number: 20240064107Abstract: Disclosed is a system for classifying encrypted traffic based on a data packet. The system includes a traffic capture module, a traffic analysis module, and a traffic classification module. The system collects data packets from a network flow to construct a machine learning model, so as to classify encrypted traffic and identify normal traffic and malicious traffic. In a process of constructing a feature matrix, basic spatial-temporal features, header features, load features, and statistical features are obtained. In addition, behavioral features of the data packets are obtained and used to demonstrate differences between the normal traffic and the malicious traffic. Moreover, the present disclosure focuses on a difference between different versions of an encryption protocol, especially a transport layer security (TLS) protocol, and introduces the difference into a model for analysis, so that the system classifies encrypted traffic in a more efficient manner.Type: ApplicationFiled: November 1, 2023Publication date: February 22, 2024Applicant: Guangzhou UniversityInventors: Jing Qiu, Jie Ding, Rongrong Chen, Chengliang Gao, Zhihong Tian, Lihua Yin, Guangxia Xu, Shen Su, Xiaoya Ni, Fei Tang, Minghao Hu, Jiaxu Xing, Qianlong Xiao
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Publication number: 20230296461Abstract: A pressure sensor includes a first electrode, a plurality of cavities, and a second electrode. The second electrode is disposed opposite the first electrode through the plurality of cavities. The second electrode includes a flat structure spanning two adjacent cavities of the plurality of cavities.Type: ApplicationFiled: February 23, 2023Publication date: September 21, 2023Inventors: Yoshitaka Sasaki, Jotaro Akiyama, Sal Akram, Yaoching Wang, Weng Shen Su, Tsung Lin Tang, Ting-Yuan Liu, Yuki Shibano, Chung-Hsien Lin
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Publication number: 20230088319Abstract: A pressure sensor comprises a polysilicon sensing membrane. The pressure sensor further includes one or more polysilicon electrodes disposed over a silicon substrate. The sensor also includes one or more polysilicon routing layers that electrically connects electrodes of the one or more polysilicon electrodes to one another, wherein the polysilicon sensing membrane deforms responsive to a stimuli and changes a capacitance between the polysilicon sensing membrane and the one or more polysilicon electrodes. The sensor also includes one or more vacuum cavities positioned between the polysilicon sensing membrane and the one or more polysilicon electrodes.Type: ApplicationFiled: August 30, 2022Publication date: March 23, 2023Inventors: Tsung Lin Tang, Chung-Hsien Lin, Ting-Yuan Liu, Weng Shen Su, Yaoching Wang
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Publication number: 20230089813Abstract: A method includes depositing a passivation layer on a substrate; depositing and patterning a first polysilicon layer on the passivation layer; depositing and patterning a first oxide layer on the first polysilicon layer forming a patterned first oxide layer; depositing and patterning a second polysilicon layer on the patterned first oxide layer. A portion of the second polysilicon layer directly contacts a portion of the first polysilicon layer. A portion of the patterned second polysilicon layer corresponds to a bottom electrode. A second oxide layer is deposited on the patterned second polysilicon layer and on an exposed portion of the patterned first oxide layer. A portion of the second oxide layer corresponding to a sensing cavity is etched, exposing the bottom electrode. Another substrate is bonded to the second oxide layer enclosing the sensing cavity. A top electrode is disposed within the another substrate and positioned over the bottom electrode.Type: ApplicationFiled: September 21, 2022Publication date: March 23, 2023Inventors: Weng Shen Su, Chung-Hsien Lin, Yaoching Wang, Tsung Lin Tang, Ting-Yuan Liu, Calin Miclaus
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Publication number: 20220129256Abstract: Embodiments of the present invention provides an Android penetration method and device for implementing silent installation based on accessibility services. The method includes: acquiring a second target application by adding a load program to a first target application and adding penetration permissions using an Android decompilation technology; and implementing silent installation of the second target application using an accessibility service technology. The embodiment of the present invention enables a terminal to perform silent penetration test without root and user interaction. The embodiments of the present invention can also improve the stability of the penetration session.Type: ApplicationFiled: January 5, 2022Publication date: April 28, 2022Inventors: Hui Lu, Zhihong Tian, Chengjie Jin, Luxiaohan He, Man Zhang, Jiageng Yang, Xinguo Zhang, Dongqiu Huang, Qi Sun, Yanbin Sun, Shen Su
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Patent number: 10816422Abstract: A pressure sensor comprises a first substrate and a cap attached to the first substrate. The cap includes a processing circuit, a cavity and a deformable membrane separating the cavity and a port open to an outside of the pressure sensor. Sensing means are provided for converting a response of the deformable membrane to pressure at the port into a signal capable of being processed by the processing circuit. The cap is attached to the first substrate such that the deformable membrane faces the first substrate and such that a gap is provided between the deformable membrane and the first substrate which gap contributes to the port. The first substrate comprises a support portion the cap is attached to, a contact portion for electrically connecting the pressure sensor to an external device, and one or more suspension elements for suspending the support portion from the contact portion.Type: GrantFiled: February 24, 2017Date of Patent: October 27, 2020Assignee: InvenSense, Inc.Inventors: Chung-Hsien Lin, Rene Hummel, Ulrich Bartsch, Marion Hermersdorf, Tsung Lin Tang, Wang Shen Su, Chia Min Lin
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Patent number: 10712218Abstract: A sensor includes a deformable membrane that deflects in response to a stimuli. The sensor further includes a capacitive element coupled to the deformable membrane. The capacitive element is disposed within an enclosed cavity of the sensor. The capacitive element changes capacitance in response to the deformable membrane deflecting. The capacitive element comprises a getter material for collecting gas molecules within the enclosed cavity.Type: GrantFiled: March 29, 2019Date of Patent: July 14, 2020Assignee: InvenSense, Inc.Inventors: Johannes Schumm, Andreas Reinhard, Thomas Kraehenbuehl, Stefan Thiele, Rene Hummel, Chung-Hsien Lin, Wang Shen Su, Tsung Lin Tang, Chia Ming Lin
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Publication number: 20190226932Abstract: A sensor includes a deformable membrane that deflects in response to a stimuli. The sensor further includes a capacitive element coupled to the deformable membrane. The capacitive element is disposed within an enclosed cavity of the sensor. The capacitive element changes capacitance in response to the deformable membrane deflecting. The capacitive element comprises a getter material for collecting gas molecules within the enclosed cavity.Type: ApplicationFiled: March 29, 2019Publication date: July 25, 2019Inventors: Johannes SCHUMM, Andreas REINHARD, Thomas KRAEHENBUEHL, Stefan THIELE, Rene HUMMEL, Chung-Hsien LIN, Wang Shen SU, Tsung Lin TANG, Chia Ming LIN
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Patent number: 10254185Abstract: A sensor includes a deformable membrane that deflects in response to a stimuli. The sensor further includes a capacitive element coupled to the deformable membrane. The capacitive element is disposed within an enclosed cavity of the sensor. The capacitive element changes capacitance in response to the deformable membrane deflecting. The capacitive element comprises a getter material for collecting gas molecules within the enclosed cavity.Type: GrantFiled: March 14, 2018Date of Patent: April 9, 2019Assignee: InvenSense, Inc.Inventors: Johannes Schumm, Andreas Reinhard, Thomas Kraehenbuehl, Stefan Thiele, Rene Hummel, Chung-Hsien Lin, Wang Shen Su, Tsung Lin Tang, Chia Min Lin
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Patent number: 10173297Abstract: A chemical mechanical polishing (abbreviated as CMP) conditioner comprises a bottom substrate, an intermediate substrate and a diamond film The intermediate substrate is provided on the bottom substrate. The intermediate substrate comprises a hollow portion, an annular portion surrounding the hollow portion, and at least one projecting ring projecting out of the annular portion away from the bottom substrate. The projecting ring comprises a plurality of bumps arranged to be spaced apart from each other along an annulus region. The bumps are extended in a radial direction of the intermediate substrate. The diamond film is provided on the intermediate substrate. The diamond film is allowed for conforming to the bumps, so as to form a plurality of the abrasive projections.Type: GrantFiled: May 2, 2017Date of Patent: January 8, 2019Assignee: KINIK COMPANY LTD.Inventors: Jui-Lin Chou, Ting-Sheng Huang, Hsin-Chun Wang, Xue-Shen Su
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Publication number: 20180202882Abstract: A sensor includes a deformable membrane that deflects in response to a stimuli. The sensor further includes a capacitive element coupled to the deformable membrane. The capacitive element is disposed within an enclosed cavity of the sensor. The capacitive element changes capacitance in response to the deformable membrane deflecting. The capacitive element comprises a getter material for collecting gas molecules within the enclosed cavity.Type: ApplicationFiled: March 14, 2018Publication date: July 19, 2018Inventors: Johannes Schumm, Andreas Reinhard, Thomas Kraehenbuehl, Stefan Thiele, Rene Hummel, Chung-Hsien Lin, Wang Shen Su, Tsung Lin Tang, Chia Min Lin
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Patent number: 9969054Abstract: A grinding tool includes a substrate having a working surface, and a plurality of abrasive particles distributed over the working surface and protruding outward from the working surface, wherein at least some of the abrasive particles are machined to form abrasive particles respectively having an obliquely truncated pyramid shape. Some embodiments described herein also include a method of manufacturing the grinding tool.Type: GrantFiled: April 20, 2016Date of Patent: May 15, 2018Assignee: Kinik CompanyInventors: Jui-Lin Chou, Chia-Feng Chiu, Wen-Jen Liao, Xue-Shen Su
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Patent number: 9958349Abstract: A pressure sensor comprises a deformable membrane deflecting in response to pressure applied, a first stationary electrode, and a second electrode coupled to the deformable membrane, for determining a change in a capacitance between the first and the second electrode in response to the pressure applied. At least one of the first and the second electrode comprises a getter material for collecting gas molecules.Type: GrantFiled: March 30, 2016Date of Patent: May 1, 2018Assignee: INVENSENSE, INC.Inventors: Johannes Schumm, Andreas Reinhard, Thomas Kraehenbuehl, Stefan Thiele, Rene Hummel, Chung-Hsien Lin, Wang Shen Su, Tsung Lin Tang, Chia Min Lin
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Publication number: 20180029192Abstract: A chemical mechanical polishing (abbreviated as CMP) conditioner comprises a bottom substrate, an intermediate substrate and a diamond film The intermediate substrate is provided on the bottom substrate. The intermediate substrate comprises a hollow portion, an annular portion surrounding the hollow portion, and at least one projecting ring projecting out of the annular portion away from the bottom substrate. The projecting ring comprises a plurality of bumps arranged to be spaced apart from each other along an annulus region. The bumps are extended in a radial direction of the intermediate substrate. The diamond film is provided on the intermediate substrate. The diamond film is allowed for conforming to the bumps, so as to form a plurality of the abrasive projections.Type: ApplicationFiled: May 2, 2017Publication date: February 1, 2018Inventors: Jui-Lin Chou, Ting-Sheng Huang, Hsin-Chun Wang, Xue-Shen Su
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Patent number: 9821431Abstract: Provided is a CMP conditioner comprising: a substrate, multiple abrasive bars, and multiple slide blocks. The substrate is divided into a central surface and an outer surface. The central surface is a recessed part. The outer surface encompasses the central surface. Multiple mounting holes are recessed from the outer surface. The abrasive bars are each respectively mounted in the mounting holes. Each of the multiple abrasive bars comprises a bar body and an abrasive particle. The abrasive particle is mounted on a top surface of the abrasive bar. The multiple slide blocks are distributed among the mounting holes of the outer surface. Each of the multiple slide blocks comprises a slide dressing surface. The present invention utilizes the slide blocks to reduce the contact between the substrate and a polishing mat efficiently. The slide blocks may decrease dissolving out of metal components within the substrate and the pollution induced.Type: GrantFiled: February 4, 2016Date of Patent: November 21, 2017Assignee: KINIK COMPANYInventors: Jui-Lin Chou, Chia-Feng Chiu, Wen-Jen Liao, Xue-Shen Su
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Publication number: 20170216994Abstract: A chemical mechanical polishing conditioner comprises a substrate and at least one abrasive unit. The abrasive unit is provided on the substrate, and the abrasive unit comprises a supporting layer, an abrasive layer and a stress-relief layer. The supporting layer is provided with a working face far away from the substrate and a non-working face opposite to the working face. The abrasive layer is provided on the working face of the supporting layer, and the abrasive layer is a first diamond-plated film formed by chemical vapor deposition method. The first diamond-plated film is provided with a plurality of abrasive tips. The stress-relief layer is provided on the non-working face of the supporting layer, and the stress-relief layer is a second diamond-plated film formed by chemical vapor deposition method. A thermal stress-relieving effect may be exerted by the stress-relief layer, so as to reduce warpage or deformation of the supporting layer.Type: ApplicationFiled: October 14, 2016Publication date: August 3, 2017Inventors: Jui-Lin CHOU, Chia-Feng CHIU, Yu-Tai CHEN, Wen-Jen LIAO, Xue-Shen SU
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Publication number: 20170167933Abstract: A pressure sensor comprises a first substrate and a cap attached to the first substrate. The cap includes a processing circuit, a cavity and a deformable membrane separating the cavity and a port open to an outside of the pressure sensor. Sensing means are provided for converting a response of the deformable membrane to pressure at the port into a signal capable of being processed by the processing circuit. The cap is attached to the first substrate such that the deformable membrane faces the first substrate and such that a gap is provided between the deformable membrane and the first substrate which gap contributes to the port. The first substrate comprises a support portion the cap is attached to, a contact portion for electrically connecting the pressure sensor to an external device, and one or more suspension elements for suspending the support portion from the contact portion.Type: ApplicationFiled: February 24, 2017Publication date: June 15, 2017Inventors: Chung-Hsien LIN, Rene HUMMEL, Ulrich BARTSCH, Marion HERMERSDORF, Tsung Lin TANG, Wang Shen SU, Chia Min LIN