Abstract: A semiconductor package is provided, which includes a first chip disposed over a first package substrate, a molding compound surrounding the first chip, a first thermal interface material disposed over the first chip and the molding compound, a heat spreader disposed over the thermal interface material, and a second thermal interface material disposed over the heat spreader. The first thermal interface material and the second thermal interface material have an identical width.

Abstract: A method of forming an IC structure includes forming first and second power rails at a power rail level. First metal segments are formed at a first metal level above the power rail level. Each first metal segment of the plurality of first metal segments overlap one or both of the first power rail or the second power rail. First vias are formed between the power rail level and the first metal level. Second metal segments are formed at a second metal level above the first metal level. At least one second metal segment of the plurality of second metal segments overlaps the first power rail. At least one second metal segment of the plurality of second metal segments overlaps the second power rail. A plurality of second vias are formed between the first metal level and the second metal level.

Abstract: A method includes forming a first dielectric layer, forming a first redistribution line comprising a first via extending into the first dielectric layer, and a first trace over the first dielectric layer, forming a second dielectric layer covering the first redistribution line, and patterning the second dielectric layer to form a via opening. The first redistribution line is revealed through the via opening. The method further includes forming a second via in the second dielectric layer, and a conductive pad over and contacting the second via, and forming a conductive bump over the conductive pad. The conductive pad is larger than the conductive bump, with a first center of conductive pad being offsetting from a second center of the conductive bump. The second via is further offset from the second center of the conductive bump.

Abstract: An semiconductor package includes a redistribution structure, a first semiconductor device, a second semiconductor device, an underfill layer and an encapsulant. The first semiconductor device is disposed on and electrically connected with the redistribution structure, wherein the first semiconductor device has a first bottom surface, a first top surface and a first side surface connecting with the first bottom surface and the first top surface, the first side surface comprises a first sub-surface and a second sub-surface connected with each other, the first sub-surface is connected with the first bottom surface, and a first obtuse angle is between the first sub-surface and the second sub-surface.

Abstract: A method for forming a chip package structure. The method includes bonding first connectors over a front surface of a semiconductor wafer. The method also includes dicing the semiconductor wafer from a rear surface of the semiconductor wafer to form semiconductor dies and mounting first and second semiconductor dies in the semiconductor dies over a top surface of the interposer substrate. The method further forming an encapsulating layer over the top surface of the interposer substrate to cover the first semiconductor die and the second semiconductor die. A first sidewall of the first semiconductor die faces a second sidewall of the second semiconductor die, and upper portions of the first sidewall and the second sidewall have a tapered contour, to define a top die-to-die distance and a bottom die-to-die distance that is less than the top die-to-die distance.

Abstract: A semiconductor package provided herein includes a wiring substrate, a semiconductor component, conductor terminals, a bottom stiffener and a top stiffener. The wiring substrate has a first surface and a second surface opposite to the first surface. The semiconductor component is disposed on the first surface of the wiring substrate. The conductor terminals are disposed on the second surface of the wiring substrate and electrically connected to the semiconductor component through the wiring substrate. The bottom stiffener is disposed on the second surface of the wiring substrate and positioned between the conductor terminals. The top stiffener is disposed on the first surface of the wiring substrate. The top stiffener is laterally spaced further away from the semiconductor component than the bottom stiffener.

Abstract: A conductive via layer is deposited on a bottom electrode, then patterned and trimmed to form a sub 20 nm conductive via on the bottom electrode. The conductive via is encapsulated with a first dielectric layer, which is planarized to expose a top surface of the conductive via. A MTJ stack is deposited on the encapsulated conductive via wherein the MTJ stack comprises at least a pinned layer, a barrier layer, and a free layer. A top electrode layer is deposited on the MTJ stack and patterned and trimmed to form a sub 30 nm hard mask. The MTJ stack is etched using the hard mask to form an MTJ device and over etched into the encapsulation layer but not into the bottom electrode wherein metal re-deposition material is formed on sidewalls of the encapsulation layer underlying the MTJ device and not on sidewalls of a barrier layer of the MTJ device.

Abstract: An image processing method includes acquiring a set of image samples for training an attribute recognition model, wherein the set of image samples includes a first subset of image samples with category labels and a second subset of image samples without category labels; training a sample prediction model using the first subset of image samples, and predicting categories of the image samples in the second subset of image samples using the trained sample prediction model; determining a category distribution of the set of image samples based on the category labels of the first subset of image samples and the predicted categories of the second subset of image samples; and acquiring a new image sample if the determined category distribution does not conform to the expected category distribution, and adding the acquired new image sample to the set of image samples.

Abstract: The present disclosure provides a routing structure. The routing structure includes a substrate having a boundary and a first conductive trace configured to be coupled to a first conductive pad disposed within the boundary of the substrate. The first conductive trace is inclined with respect to the boundary of the substrate.

Abstract: An electrode material for an energy storage device including a covalent organic framework includes a plurality of aromatic moieties each linked by at least one thioether linkage. An anode including said electrode material, and an energy storage device having said anode.

Abstract: A live broadcasting recording equipment, a live broadcasting recording system and a live broadcasting recording method are provided. The live broadcasting recording equipment includes a camera, a processing device, and a terminal device. The camera captures images to provide photographic data. The processing device executes background removal processing on the photographic data to generate a person image. The terminal device communicates with the processing device and has a display. The processing device executes multi-layer processing to fuse the person image, a three-dimensional virtual reality background image, an augmented reality object image, and a presentation image, and generate a composite image. After an application gateway of the processing device recognizes a login operation of the terminal device, the processing device outputs the composite image to the terminal device, so that the display of the terminal device displays the composite image.

Abstract: Methods, systems, and computer programs are presented for creating notifications for resources shared or posted by connections of a member. One method includes an operation for accessing databases to collect member information that includes first-degree connections and information about each first-degree connection. Further, a list of first-degree connections is stored in a data store with information about each first-degree connection. The method further includes operations for detecting a resource associated with a first member, and for accessing the data store to obtain network connections (first- and second-degree connections) of the first member. For each network connection of the first member, the method determines if the resource is relevant for the network connection based on the retrieved member information. Further, the method includes generating a notification about the resource for one or more of the network connections based on a relevance of the resource to the network connection.

Abstract: To realize polarization MIMO in a more suitable form in a mobile communication apparatus. A communication apparatus includes a plurality of antenna parts configured to receive or transmit a wireless signal, a communication control part configured to control transmitting or receiving the wireless signal via at least any of the plurality of antenna parts, and a casing housing the communication control part, in which each of the plurality of antenna parts is held near each of a plurality of partial regions normal directions of which cross each other or the normal directions of which are mutually twisted in outer faces of the casing, and transmit or receive a first wireless signal and a second wireless signal propagating in directions substantially orthogonal to the partial regions and having mutually different polarization directions.

Abstract: According to one embodiment, a motor driving device includes an output part that supplies an exciting current to an exciting coil, a position detection part that detects a rotational position of a rotor, and a driving control part that produces a driving signal that is based on a detection signal from the position detection part and supplies it to the output part. The position detection part has first, second, and third detection elements that are integrally integrated together with the driving control part and detect rotational positions of the rotor.

Abstract: Example camera and hub arrangements are presented herein. An example device includes an Ethernet connector configured to provide power and data, a camera port configured to provide power and data to a camera module, and an audio port configured to provide power and data to at least one audio input/output module. The device also includes a processor configured to determine one or more camera parameters for the camera module attached to the camera port, such as a type of a camera module attached to the camera port. The device can change operation mode based on camera parameters and audio parameters associated with connected camera modules and audio modules. Different modules can be connected to the device and located remotely from the device.

Abstract: Methods, systems, and apparatus, including computer programs encoded on computer storage media, for generating a computer chip placement. One of the methods includes obtaining netlist data for a computer chip; and generating a computer chip placement, comprising placing a respective macro node at each time step in a sequence comprising a plurality of time steps, the placing comprising, for each time step: generating an input representation for the time step; processing the input representation using a node placement neural network having a plurality of network parameters, wherein the node placement neural network is configured to process the input representation in accordance with current values of the network parameters to generate a score distribution over a plurality of positions on the surface of the computer chip; and assigning the macro node to be placed at the time step to a position from the plurality of positions using the score distribution.

Abstract: A file generation method includes obtaining first information based on a resource index file, where the resource index file comprises indexes, file names, and first path information of a plurality of resource files, where the resource files include a first resource file and a second resource file, where the first information includes second path information and a file name of a first file; loading the first file based on the first information; obtaining the first resource file and the second resource file from the first file based on second information; and displaying the first page based on the first resource file and the second resource file.

Abstract: According to one embodiment, a motor driving device includes an output part that supplies an exciting current to an exciting coil, a position detection part that detects a rotational position of a rotor, and a driving control part that produces a driving signal that is based on a detection signal from the position detection part and supplies it to the output part. The position detection part has first, second, and third detection elements that are integrally integrated together with the driving control part and detect rotational positions of the rotor.