Patents by Inventor Shenavia S. Howell

Shenavia S. Howell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated heat spreader (IHS) with heating element
    Patent number: 11798861
    Abstract: Embodiments may relate to a microelectronic package that includes a lid coupled with a package substrate such that a die is positioned between the lid and the package substrate. The lid may include a heating element that is to heat an area between the lid and the die. Other embodiments may be described or claimed.
    Type: Grant
    Filed: July 8, 2019
    Date of Patent: October 24, 2023
    Assignee: Intel Corporation
    Inventors: Peng Li, Kelly P. Lofgreen, Manish Dubey, Bamidele Daniel Falola, Ken Hackenberg, Shenavia S. Howell, Sergio Antonio Chan Arguedas, Yongmei Liu, Deepak Goyal
  • Integrated circuit packages with asymmetric adhesion material regions
    Patent number: 11682605
    Abstract: Disclosed herein are integrated circuit (IC) packages with asymmetric adhesion material regions, as well as related methods and devices. For example, in some embodiments, an IC package may include a solder thermal interface material (STIM) between a die of the IC package and a lid of the IC package. The lid of the IC package may include an adhesion material region, in contact with the STIM, that is asymmetric with respect to the die.
    Type: Grant
    Filed: May 28, 2019
    Date of Patent: June 20, 2023
    Assignee: Intel Corporation
    Inventors: Karthik Visvanathan, Shenavia S. Howell, Sergio Antonio Chan Arguedas, Peng Li
  • Package-level backside metallization (BSM)
    Patent number: 11652061
    Abstract: Embodiments may relate to a microelectronic package that includes a die and a backside metallization (BSM) layer positioned on the face of the die. The BSM layer may include a feature that indicates that the BSM layer was formed on the face of the die by a masked deposition technique. Other embodiments may be described or claimed.
    Type: Grant
    Filed: June 17, 2019
    Date of Patent: May 16, 2023
    Assignee: Intel Corporation
    Inventors: Shenavia S. Howell, John J. Beatty, Raymond A. Krick, Suzana Prstic
  • INTEGRATED HEAT SPREADER (IHS) WITH HEATING ELEMENT
    Publication number: 20210013117
    Abstract: Embodiments may relate to a microelectronic package that includes a lid coupled with a package substrate such that a die is positioned between the lid and the package substrate. The lid may include a heating element that is to heat an area between the lid and the die. Other embodiments may be described or claimed.
    Type: Application
    Filed: July 8, 2019
    Publication date: January 14, 2021
    Applicant: Intel Corporation
    Inventors: Peng Li, Kelly P. Lofgreen, Manish Dubey, Bamidele Daniel Falola, Ken Hackenberg, Shenavia S. Howell, Sergio Antonio Chan Arguedas, Yongmei Liu, Deepak Goyal
  • PACKAGE-LEVEL BACKSIDE METALLIZATION (BSM)
    Publication number: 20200395307
    Abstract: Embodiments may relate to a microelectronic package that includes a die and a backside metallization (BSM) layer positioned on the face of the die. The BSM layer may include a feature that indicates that the BSM layer was formed on the face of the die by a masked deposition technique. Other embodiments may be described or claimed.
    Type: Application
    Filed: June 17, 2019
    Publication date: December 17, 2020
    Applicant: Intel Corporation
    Inventors: Shenavia S. Howell, John J. Beatty, Raymond A. Krick, Suzana Prstic
  • INTEGRATED CIRCUIT PACKAGES WITH ASYMMETRIC ADHESION MATERIAL REGIONS
    Publication number: 20200381334
    Abstract: Disclosed herein are integrated circuit (IC) packages with asymmetric adhesion material regions, as well as related methods and devices. For example, in some embodiments, an IC package may include a solder thermal interface material (STIM) between a die of the IC package and a lid of the IC package. The lid of the IC package may include an adhesion material region, in contact with the STIM, that is asymmetric with respect to the die.
    Type: Application
    Filed: May 28, 2019
    Publication date: December 3, 2020
    Applicant: Intel Corporation
    Inventors: Karthik Visvanathan, Shenavia S. Howell, Sergio Antonio Chan Arguedas, Peng Li